摘要
将石墨烯邦定至粉末底粉的表面,在固化过程中,石墨烯可迁移至涂层表层,成膜后制备导电型石墨烯粉末涂料(邦定法)。作为对比,将石墨烯通过挤出机混炼后,完全分散在涂层中,制备导电型石墨烯粉末涂料(内挤法)。结果发现:石墨烯用量同样为0. 3%时,内挤法涂层表面电阻为10~(12)Ω,而邦定法可降低至10~6Ω。邦定技术可大大降低石墨烯的用量,降低成本。采用红外光谱对粉末涂料的化学结构进行表征,通过差示扫描量热仪(DSC)测定其固化过程,并探讨了石墨烯的添加量对涂层表面电阻的影响。
Conductive powder coating could be prepared by bonding base powder with graphene which migrates to top layer of coating surface during curing process. By comparison,graphene is also co-extruded with the coating composition. The results indicate that the same content of graphene 0. 3% can enable the surface resistance of the coating via extruding process to be 10~(12)Ω while the surface resistance of the coating via bonding process is 10~6Ω,indicating that the bonding process can significantly reduce the amount of graphene used in the formulation,which significantly results in cost reduction. Chemical structure is studied by FTIR and the curing process is monitored by DSC. In addition,the influence of graphene content on electrical resistance of the film is also studied.
引文
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