LTCC钎焊封装工艺设计
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摘要
探索了一种LTCC钎焊封装工艺设计,采用有限元软件ANSYS建立了相应的封装模型。在主要考虑热传导和空气自然对流情况下,对封装模型进行了稳态温度仿真分析,定量分析了原有及改进工艺设计对表面锡铅焊料温度的影响。研究结果表明:LTCC钎焊封装工艺设计具有转化为工程化应用的可行性。
The process design for LTCC packaging with soldering was discussed by ANSYS software. The steady temperature simulation analysis for packaging model was carried out under the case of heat conduction and natural convection of air. The influence of the original and improved process design on tinlead solder surface temperature were quantitatively analyzed. The results showed that the process design has the possibility to be transformed into engineering application.
The process design for LTCC packaging with soldering was discussed by ANSYS software. The steady temperature simulation analysis for packaging model was carried out under the case of heat conduction and natural convection of air. The influence of the original and improved process design on tinlead solder surface temperature were quantitatively analyzed. The results showed that the process design has the possibility to be transformed into engineering application.
引文
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[5]陈品,吴兆华,黄红艳,等.LTCC中内埋大功率芯片散热的三维有限元分析[J].电子与封装,2011,11(3):5-9.
[2]解启林,朱启政,林伟成,等.LTCC电路基板大面积接地钎焊工艺设计[J].应用基础与工程科学学报,2007,15(3):358-362.
[3]程迎军,罗乐,蒋玉齐,等.多芯片组件散热的三维有限元分析[J].电子元件与材料,2004,23(5):43-45.
[4]伍艺龙,李悦,李慧.高功率多芯片组件的散热分析[J].电子工艺技术,2017,38(2):77-79.
[5]陈品,吴兆华,黄红艳,等.LTCC中内埋大功率芯片散热的三维有限元分析[J].电子与封装,2011,11(3):5-9.