金属泡沫复合微肋微通道热沉的流动传热特性分析
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摘要
构建了一种金属泡沫和固体微肋相结合的复合微肋微通道热沉(combined fin heat sink, CFHS),采用扩展型达西模型和局部非热平衡传热模型数值研究了复合微肋微通道热沉的流动与传热特性,结合热阻网络分析了复合微肋结构的传热规律,并对复合微肋热沉的综合换热能效进行了评价.结果表明,与传统固体微肋结构相比,复合微肋结构可显著提升微通道热沉的换热性能;金属泡沫厚度和孔隙率是影响换热性能的主要因素,存在最佳金属泡沫临界填充厚度以及最佳孔隙率参数设置.相对于传统固体微肋热沉,本文研究的复合微肋热沉热阻降低了约56%,综合换热能效提升了约1.32倍,金属泡沫最佳孔隙率及临界无量纲厚度分别为0.9和0.3.本文相关研究成果可为开发高效的电子设备冷却装置提供理论指导.
Three-dimensional(3D) interconnect technology promises significant performance advantages for the next generation of high speed and multi-functional electronic devices, however, the large-scale integration of electronic circuit and vertical stacking of multi-functional dice have been demonstrated to result in substantially increased waste-heat generation rates and localized hotspots. Efficient thermal management solutions are imperative to ensure the operating temperature of components below a reasonable level. Among various cooling techniques, metal foam heat sink has been identified as a promising alternative for electronic cooling, because of the large specific surface area, high effective thermal conductivity and intensive fluid mixing capability that foam material provided. In this study, a novel micro-channel heat sink with combined metal foam-solid fin, namely combined fin heat sink(CFHS), was established for electronics cooling. Numerical simulations based on Brinkman-Darcy extended momentum equation and local thermal non-equilibrium energy equations were carried out to investigate the fluid flow and heat transfer characteristics. To simplify the computations, a single channel was used as the computational domain with a dimension of 20 mm×2.4 mm× 6 mm. The constant heat flux of 100 W/cm2 was supplied at the bottom wall to simulate the high-powered electronic device. Metal foam and fin were made of high thermal conductivity copper, and pure water was used as the working coolant. It was assumed that the metal foam was fully saturated with fluid in laminar flow state and the thermal resistance between the metal foam and fin was neglected. Effects of combined fin configuration on the flow and heat transfer performances were studied to determine the optimal porosity and dimensionless metal foam layer thickness for designing the CFHS. The thermal performance of the novel heat sink was compared to that of the conventional heat sink, and the total thermal resistance was analyzed based on the simplified thermal resistance network. The results indicate that the CFHS is more favorable in promoting thermal performance that the average Nusselt number of CFHS is 2.53 times higher than that of the conventional heat sink, while accompanied by the high pressure drop as a penalty. The flow resistance and specific area are two conflicting parameters that affect the thermal and hydraulic performances of the CFHS, our results show that there exists a critical dimensionless metal foam thickness and optimal porosity, which are 0.9 and 0.3, respectively. Compared with the conventional heat sink, the total thermal resistance of CFHS is significantly reduced by 56%, and the thermal performance factor of CFHS performs 1.32 times higher. The presented CFHS thus provides a feasible solution for thermal management of electronic devices with high-powered density.
Three-dimensional(3D) interconnect technology promises significant performance advantages for the next generation of high speed and multi-functional electronic devices, however, the large-scale integration of electronic circuit and vertical stacking of multi-functional dice have been demonstrated to result in substantially increased waste-heat generation rates and localized hotspots. Efficient thermal management solutions are imperative to ensure the operating temperature of components below a reasonable level. Among various cooling techniques, metal foam heat sink has been identified as a promising alternative for electronic cooling, because of the large specific surface area, high effective thermal conductivity and intensive fluid mixing capability that foam material provided. In this study, a novel micro-channel heat sink with combined metal foam-solid fin, namely combined fin heat sink(CFHS), was established for electronics cooling. Numerical simulations based on Brinkman-Darcy extended momentum equation and local thermal non-equilibrium energy equations were carried out to investigate the fluid flow and heat transfer characteristics. To simplify the computations, a single channel was used as the computational domain with a dimension of 20 mm×2.4 mm× 6 mm. The constant heat flux of 100 W/cm2 was supplied at the bottom wall to simulate the high-powered electronic device. Metal foam and fin were made of high thermal conductivity copper, and pure water was used as the working coolant. It was assumed that the metal foam was fully saturated with fluid in laminar flow state and the thermal resistance between the metal foam and fin was neglected. Effects of combined fin configuration on the flow and heat transfer performances were studied to determine the optimal porosity and dimensionless metal foam layer thickness for designing the CFHS. The thermal performance of the novel heat sink was compared to that of the conventional heat sink, and the total thermal resistance was analyzed based on the simplified thermal resistance network. The results indicate that the CFHS is more favorable in promoting thermal performance that the average Nusselt number of CFHS is 2.53 times higher than that of the conventional heat sink, while accompanied by the high pressure drop as a penalty. The flow resistance and specific area are two conflicting parameters that affect the thermal and hydraulic performances of the CFHS, our results show that there exists a critical dimensionless metal foam thickness and optimal porosity, which are 0.9 and 0.3, respectively. Compared with the conventional heat sink, the total thermal resistance of CFHS is significantly reduced by 56%, and the thermal performance factor of CFHS performs 1.32 times higher. The presented CFHS thus provides a feasible solution for thermal management of electronic devices with high-powered density.
引文
1 Cheng T,Luo X B,Huang S Y.Thermal analysis and optimization of multiple LED packaging based on a general analytical solution.Inter J Thermal Sci,2010,49:196-201
2 Gong L,Kota K,Tao W Q,et al.Parametric numerical study of flow and heat transfer in microchannels with wavy walls.J Heat Transfer,2011,133:051702
3 Lee J H.Convection performance of nanofluids for electronics cooling.Doctor Dissertation.Palo Alto:Stanford University,2009
4 Zhao C Y.Review on thermal transport in high porosity cellular metal foams with open cells.Inter J Heat Mass Transfer,2012,55:3618-3632
5 Hsieh W H,Wu J Y,Shih W H,et al.Experimental investigation of heat-transfer characteristics of aluminum-foam heat sinks.Inter JHeat Mass Transfer,2004,47:5149-5157
6 Bhattacharya A,Mahajan R L.Metal foam and finned metal foam heat sinks for electronics cooling in buoyancy-induced convection.JElectron Packaging,2006,128:259-266
7 Zhang D H,Wu M F,Zhang F M,et al.Convection heat transfer simulation for metal foam heat sink based on the field synergy(in Chinese).J Jiangsu Univer Sci Technol(Nat Sci Ed),2016,30:45-50[张东辉,吴明发,张凤梅,等.基于场协同原理的泡沫金属热沉流动换热特性模拟.江苏科技大学学报(自然科学版),2016,30:45-50]
8 Mahalle A M,Jajoo B N.An approach for modeling and simulation of sintered Bronze foam sink for high heat dissipation.Appl Therm Eng,2013,51:899-907
9 Hetsroni G,Gurevich M,Rozenblit R.Sintered porous medium heat sink for cooling of high-power mini-devices.Inter J Heat Fluid Flow,2006,27:259-266
10 Singh R,Akbarzadeh A,Mochizuki M.Sintered porous heat sink for cooling of high-powered microprocessors for server applications.Inter J Heat Mass Transfer,2009,52:2289-2299
11 Bayomy A M,Saghir M Z,Yousefi T.Electronic cooling using water flow in aluminum metal foam heat sink:Experimental and numerical approach.Inter J Therm Sci,2016,109:182-200
12 Ji X B,Xu J L.Fluid flow and heat transfer characteristics in ultra-light porous metal foam(in Chinese).J Chem Ind Eng Soc China,2009,60:21-27[纪献兵,徐进良.流体在超轻多孔金属泡沫中的流动和换热特性.化工学报,2009,60:21-27]
13 Wan Z M,Liu J,Chen M,et al.Experimental investigation of flow and heat transfer in a porous micro heat sink for dissipating high heat flux(in Chinese).Proc CSEE,2011,31:74-78[万忠民,刘靖,陈敏,等.高热流密度散热的多孔微热沉流动与传热实验研究.中国电机工程学报,2011,31:74-78]
14 Jeng T M,Tzeng S C,Xu R.Experimental study of heat transfer characteristics in a 180-deg round turned channel with discrete aluminum-foam blocks.Inter J Heat Mass Transfer,2014,71:133-141
15 Chen K C,Wang C C.Performance improvement of high power liquid-cooled heat sink via non-uniform metal foam arrangement.Appl Therm Eng,2015,87:41-46
16 Bhattacharya A,Mahajan R L.Finned metal foam heat sinks for electronics cooling in forced convection.J Electron Packaging,2002,124:155-163
17 DeGroot C T,Straatman A G,Betchen L J.Modeling forced convection in finned metal foam heat sinks.J Electron Packaging,2009,131:021001
18 Feng S S,Kuang J J,Wen T,et al.An experimental and numerical study of finned metal foam heat sinks under impinging air jet cooling.Inter J Heat Mass Transfer,2014,77:1063-1074
19 Hung T C,Huang Y X,Yan W M.Thermal performance analysis of porous-microchannel heat sinks with different configuration designs.Inter J Heat Mass Transfer,2013,66:235-243
20 Li Y T,Gong L,Zhang K F,et al.Numerical study on thermal characteristics of heat sinks with different porous metallic foam configuration designs(in Chinese).J Eng Thermophys,2015,36:2422-2426[李勇铜,巩亮,张克舫,等.多孔金属布置对热沉传热特性影响的数值研究.工程热物理学报,2015,36:2422-2426]
21 Li Y T,Gong L,Xu M H,et al.Thermal performance analysis of biporous metal foam heat sink.J Heat Transfer,2017,139:052005
22 Xu H J,Qu Z G,Tao W Q.Thermal transport analysis in parallel-plate channel filled with open-celled metallic foams.Inter J Heat Mass Transfer,2011,38:868-873
2 Gong L,Kota K,Tao W Q,et al.Parametric numerical study of flow and heat transfer in microchannels with wavy walls.J Heat Transfer,2011,133:051702
3 Lee J H.Convection performance of nanofluids for electronics cooling.Doctor Dissertation.Palo Alto:Stanford University,2009
4 Zhao C Y.Review on thermal transport in high porosity cellular metal foams with open cells.Inter J Heat Mass Transfer,2012,55:3618-3632
5 Hsieh W H,Wu J Y,Shih W H,et al.Experimental investigation of heat-transfer characteristics of aluminum-foam heat sinks.Inter JHeat Mass Transfer,2004,47:5149-5157
6 Bhattacharya A,Mahajan R L.Metal foam and finned metal foam heat sinks for electronics cooling in buoyancy-induced convection.JElectron Packaging,2006,128:259-266
7 Zhang D H,Wu M F,Zhang F M,et al.Convection heat transfer simulation for metal foam heat sink based on the field synergy(in Chinese).J Jiangsu Univer Sci Technol(Nat Sci Ed),2016,30:45-50[张东辉,吴明发,张凤梅,等.基于场协同原理的泡沫金属热沉流动换热特性模拟.江苏科技大学学报(自然科学版),2016,30:45-50]
8 Mahalle A M,Jajoo B N.An approach for modeling and simulation of sintered Bronze foam sink for high heat dissipation.Appl Therm Eng,2013,51:899-907
9 Hetsroni G,Gurevich M,Rozenblit R.Sintered porous medium heat sink for cooling of high-power mini-devices.Inter J Heat Fluid Flow,2006,27:259-266
10 Singh R,Akbarzadeh A,Mochizuki M.Sintered porous heat sink for cooling of high-powered microprocessors for server applications.Inter J Heat Mass Transfer,2009,52:2289-2299
11 Bayomy A M,Saghir M Z,Yousefi T.Electronic cooling using water flow in aluminum metal foam heat sink:Experimental and numerical approach.Inter J Therm Sci,2016,109:182-200
12 Ji X B,Xu J L.Fluid flow and heat transfer characteristics in ultra-light porous metal foam(in Chinese).J Chem Ind Eng Soc China,2009,60:21-27[纪献兵,徐进良.流体在超轻多孔金属泡沫中的流动和换热特性.化工学报,2009,60:21-27]
13 Wan Z M,Liu J,Chen M,et al.Experimental investigation of flow and heat transfer in a porous micro heat sink for dissipating high heat flux(in Chinese).Proc CSEE,2011,31:74-78[万忠民,刘靖,陈敏,等.高热流密度散热的多孔微热沉流动与传热实验研究.中国电机工程学报,2011,31:74-78]
14 Jeng T M,Tzeng S C,Xu R.Experimental study of heat transfer characteristics in a 180-deg round turned channel with discrete aluminum-foam blocks.Inter J Heat Mass Transfer,2014,71:133-141
15 Chen K C,Wang C C.Performance improvement of high power liquid-cooled heat sink via non-uniform metal foam arrangement.Appl Therm Eng,2015,87:41-46
16 Bhattacharya A,Mahajan R L.Finned metal foam heat sinks for electronics cooling in forced convection.J Electron Packaging,2002,124:155-163
17 DeGroot C T,Straatman A G,Betchen L J.Modeling forced convection in finned metal foam heat sinks.J Electron Packaging,2009,131:021001
18 Feng S S,Kuang J J,Wen T,et al.An experimental and numerical study of finned metal foam heat sinks under impinging air jet cooling.Inter J Heat Mass Transfer,2014,77:1063-1074
19 Hung T C,Huang Y X,Yan W M.Thermal performance analysis of porous-microchannel heat sinks with different configuration designs.Inter J Heat Mass Transfer,2013,66:235-243
20 Li Y T,Gong L,Zhang K F,et al.Numerical study on thermal characteristics of heat sinks with different porous metallic foam configuration designs(in Chinese).J Eng Thermophys,2015,36:2422-2426[李勇铜,巩亮,张克舫,等.多孔金属布置对热沉传热特性影响的数值研究.工程热物理学报,2015,36:2422-2426]
21 Li Y T,Gong L,Xu M H,et al.Thermal performance analysis of biporous metal foam heat sink.J Heat Transfer,2017,139:052005
22 Xu H J,Qu Z G,Tao W Q.Thermal transport analysis in parallel-plate channel filled with open-celled metallic foams.Inter J Heat Mass Transfer,2011,38:868-873