共享手臂型涂胶显影机特殊T形缺陷成因及解决办法研究
详细信息    查看全文 | 推荐本文 |
  • 英文篇名:The T map defect mechanism of share-arm type coating/developing machine and solution
  • 作者:秦利鹏
  • 英文作者:QIN Li-peng;Shanghai Huali Microelectronics Corporation;
  • 关键词:光刻 ; 缺陷 ; T ; map ; 回吸
  • 英文关键词:Photolithography;;defect;;T map;;suck back
  • 中文刊名:JCDI
  • 英文刊名:China Integrated Circuit
  • 机构:上海华力微电子有限公司;
  • 出版日期:2019-04-05
  • 出版单位:中国集成电路
  • 年:2019
  • 期:v.28;No.239
  • 语种:中文;
  • 页:JCDI201904015
  • 页数:4
  • CN:04
  • ISSN:11-5209/TN
  • 分类号:71-74
摘要
随着光刻图形尺寸越来越小,缺陷(任何对目标图形的偏离)对产品良率影响越来越大。在各种各样的缺陷产生原因中,显影缺陷是影响产品良率的一种主要的缺陷来源。本文通过对T map缺陷所经过涂胶与显影单元次数分析,在仔细研究显影单元构造,推论出显影nozzle回到起始位置过程中,显影液偷滴到所经过显影单元内正在旋干的spin wafer上造成了T map缺陷,并通过实验验证了推论结论。在明确成因的基础上,进一步给出了显影nozzle回吸调整方法,避免了T map再次发生造成的产品报废,给行业内解决同类缺陷提供了参考。
        along with the smaller critical dimension(CD), defect(any deviation with target pattern) is a key impact to product yield. Among the different reason of causing defect, the defect related with developing is a main type.Through analysis T map wafer passed the coating/developing unit counts, and the developing spin unit configuration,we infer that developing water dripping to spin wafer when developing nozzle go back to home position cause T map defect, experiments also support the conclusion. Based on the genetic mechanism, we give the optimized method of tuning suck back and avoid the T map defect. It also provides a reference for the industry to solve similar defects.
引文
[1]Borodovsky Y.Marching to the beat of Moore’law[A].Proc of SPIE.2006.6153-615301.
    [2]Xiao H.Introduction to Semiconductor Manufacturing Technology Roadmap for Semiconductors,Second Edition[M],Bellingham:SPIE Press.2012.
    [3]Lin B.Optical Lithography:here is why[M].Bellingham:SPIE Press.2010.

© 2004-2018 中国地质图书馆版权所有 京ICP备05064691号 京公网安备11010802017129号

地址:北京市海淀区学院路29号 邮编:100083

电话:办公室:(+86 10)66554848;文献借阅、咨询服务、科技查新:66554700