电磁脉冲环境下HVDC换流阀晶闸管的失效机理及寿命模型分析
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摘要
换流阀的可靠性评估在高压直流输电系统中是至关重要的,尤其是在电磁脉冲特殊环境下的晶闸管换流阀可靠性的评估,但是现有的可靠性评估方法并不适用于电磁脉冲等特殊环境及复杂运行工况下可靠性的评估与计算,因此,特殊环境下晶闸管的寿命评估值得深入研究。本文详细地分析了电磁脉冲环境下高压直流输电系统中换流阀所采用的压接型晶闸管的主要失效演化机理,进而提出了一种考虑换流阀冷却系统的热阻抗模型与晶闸管失效机理相结合的寿命预测方法,基于该方法建立了晶闸管在电磁脉冲下的热应力计算模型,进而获得了晶闸管的寿命模型。最后,本文给出了量化的分析过程和结果,说明了一种特殊的电磁脉冲环境—电磁脉冲对换流阀的主要破坏作用。
Reliability evaluation of the converter valve is very important in HVDC transmission system,especially the reliability evaluation of the thyristor valve in the special environment of EMP(electromagnetic pulse). However,the existing reliability evaluation method is not applicable to the evaluation and calculation of the reliability at special environment and the complex operating conditions of the electromagnetic pulse.Therefore, the life evaluation of thyristor valve under special environment is worth studying deeply. In this paper, the main failure evolution mechanism of the press-pack thyristor used in the HVDC transmission system under the electromagnetic pulse environment is analyzed in detail,and then a life prediction method considering the thermal impedance model of the converter valve cooling system and the thyristor failure mechanism is proposed The thermal stress calculation model of thyristor under electromagnetic pulse is established, and the life model of thyristor is obtained. Finally, the quantitative analysis process and results are presented and the main destructive effect of a special electromagnetic pulse environment on the converter valve is explained.
Reliability evaluation of the converter valve is very important in HVDC transmission system,especially the reliability evaluation of the thyristor valve in the special environment of EMP(electromagnetic pulse). However,the existing reliability evaluation method is not applicable to the evaluation and calculation of the reliability at special environment and the complex operating conditions of the electromagnetic pulse.Therefore, the life evaluation of thyristor valve under special environment is worth studying deeply. In this paper, the main failure evolution mechanism of the press-pack thyristor used in the HVDC transmission system under the electromagnetic pulse environment is analyzed in detail,and then a life prediction method considering the thermal impedance model of the converter valve cooling system and the thyristor failure mechanism is proposed The thermal stress calculation model of thyristor under electromagnetic pulse is established, and the life model of thyristor is obtained. Finally, the quantitative analysis process and results are presented and the main destructive effect of a special electromagnetic pulse environment on the converter valve is explained.
引文
[1] Advanced solutions in power systems:HVDC, FACTS, and artificial intelligence[M]. John Wiley&Sons,2016.
[2]国家电网公司直流换流站2003-2014年运行情况分析[R].
[3] SKVARENINA T L. The Power Electronics Handbook[M].The power electronics handbook/CRC Press,2002.
[4]谢彦召,王赞基,王群书,等.高空核爆电磁脉冲波形标准及特征分析[J].强激光与粒子束,2003,15(8):781-787.XIE Yanzhao, WANG Zanji, WANG Qunshu, et al. High altitude nuclear electromagnetic pulse waveform standards:a review[J]. High Power Laser and Particle Beams,2003,15(8):781-787.
[5]MA K. Electro-thermal model of power semiconductors dedicated for both case and junction temperature estimation[C]//Power Electronics for the Next Generation Wind Turbine System. Springer International Publishing, 2015:139-143.
[6] CHUNG H S,WANG H,BLAABJERG F,et al. Reliability of power electronic converter systems[M]. The Institution of Engineering and Technology,2016.
[7] MA K,HE N,LISERRE M,et al. Frequency-domain thermal modeling and characterization of power semiconductor devices[J]. IEEE Transactions on Power Electronics, 2016, 31(10):7183-7193.
[8] Ma K. Electro-thermal model of power semiconductors dedicated for both case and junction temperature estimation[M]. Power Electronics for the Next Generation W ind Turbine System. Springer International Publishing, 2015:139-143.
[9] BUSCA C, TEODORESCU R, BLAABJERG F, et al. An overview of the reliability prediction related aspects of high power IGBTs in wind power applications[J]., Microelectronics Reliability, 2011,51(9/11):1903-1907.
[10]CIAPPA M. Selected failure mechanisms of modern power modules[J]. Microelectronics Reliability, 2002, 42(4/5):653-667.
[11] SHARIFABADI K, HARNEFORS L, NEE H P, et al. Design, control, and application of modular multilevel converters for HVDC transmission systems[M]. John Wiley&Sons,2016.
[12] CHEN Y X. Study on reliability of switched reluctance motor system[D]. China University of Mining and Technology,2014.
[13]DURAND C,KLINGLER M,COUTELLIER D,et al. Power cycling reliability of power module:a survey[J]. IEEE Transactions on Device and Materials Reliability, 2016,16(1):80-97.
[2]国家电网公司直流换流站2003-2014年运行情况分析[R].
[3] SKVARENINA T L. The Power Electronics Handbook[M].The power electronics handbook/CRC Press,2002.
[4]谢彦召,王赞基,王群书,等.高空核爆电磁脉冲波形标准及特征分析[J].强激光与粒子束,2003,15(8):781-787.XIE Yanzhao, WANG Zanji, WANG Qunshu, et al. High altitude nuclear electromagnetic pulse waveform standards:a review[J]. High Power Laser and Particle Beams,2003,15(8):781-787.
[5]MA K. Electro-thermal model of power semiconductors dedicated for both case and junction temperature estimation[C]//Power Electronics for the Next Generation Wind Turbine System. Springer International Publishing, 2015:139-143.
[6] CHUNG H S,WANG H,BLAABJERG F,et al. Reliability of power electronic converter systems[M]. The Institution of Engineering and Technology,2016.
[7] MA K,HE N,LISERRE M,et al. Frequency-domain thermal modeling and characterization of power semiconductor devices[J]. IEEE Transactions on Power Electronics, 2016, 31(10):7183-7193.
[8] Ma K. Electro-thermal model of power semiconductors dedicated for both case and junction temperature estimation[M]. Power Electronics for the Next Generation W ind Turbine System. Springer International Publishing, 2015:139-143.
[9] BUSCA C, TEODORESCU R, BLAABJERG F, et al. An overview of the reliability prediction related aspects of high power IGBTs in wind power applications[J]., Microelectronics Reliability, 2011,51(9/11):1903-1907.
[10]CIAPPA M. Selected failure mechanisms of modern power modules[J]. Microelectronics Reliability, 2002, 42(4/5):653-667.
[11] SHARIFABADI K, HARNEFORS L, NEE H P, et al. Design, control, and application of modular multilevel converters for HVDC transmission systems[M]. John Wiley&Sons,2016.
[12] CHEN Y X. Study on reliability of switched reluctance motor system[D]. China University of Mining and Technology,2014.
[13]DURAND C,KLINGLER M,COUTELLIER D,et al. Power cycling reliability of power module:a survey[J]. IEEE Transactions on Device and Materials Reliability, 2016,16(1):80-97.