摘要
为了解决小尺寸高容量MLCC的切割侧裂问题,深入分析了侧裂原因,优化了瓷浆配方、内电极印刷厚度以及层压、切割工艺。结果发现:瓷浆中合适的黏合剂和增塑剂添加量可以提高介质膜片的黏接性,适当减小内电极印刷厚度可以减小电容坯块的厚度差,优化层压工艺可以有效提高电容坯块的致密性,优化切割工艺可以减小芯片所受的应力。通过上述措施解决了切割侧裂问题。
In order to solve the problem of cutting side crack of small size and high capacity MLCC, the causes of side crack were analyzed in depth, and the formulation of ceramic slurry, the printing thickness of inner electrode, lamination process and cutting process was performed. The results show that proper amount of binders and plasticizers in ceramic slurry can enhance adhesion of dielectric film. Properly reducing printing thickness of inner electrodes can reduce thickness difference in greenpressing. Optimization of the lamination process can enhance density of green-pressing. Optimization of cutting process can reduce stress onto green-chip. By measures mentioned above, the problem of cutting side crack is solved.
引文
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