正弦振动引起的BGA焊点Sn-Cu金属间化合物失效机理
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摘要
研究不同回流焊工艺下得到的球栅阵列(BGA)焊点在正弦振动疲劳试验中的失效行为。借助扫描电镜观察在不同加热因子下形成的Sn-Cu金属间化合物的形态和厚度,运用有限元模拟分析球栅阵列焊点在正弦振动下的应力集中和分布。结果表明:当金属间化合物层的形态和厚度不同时,裂纹的萌生和扩展机理不同;随着金属间化合物层厚度的增加,焊点的振动疲劳寿命先是缓慢提高,随后急剧下降;当金属间化合物层的厚度为1.5～3.0μm时,接头的振动疲劳寿命达到最大值。
The sinusoidal vibration failure behavior of ball grid array(BGA) solder joints reflowed with different temperature profiles was studied. The morphologies and thickness of Sn-Cu intermetallic compound(IMC) formed under diverse heating factor were observed by scanning electron microscopy. The stress concentration and distribution of BGA solder joints under the sinusoidal vibration were analyzed by finite element simulation. The results show that the origin and propagation of cracks mechanism differs when the morphologies and thickness of IMC layer are different. The vibration fatigue lifetime of solder joints increases gradually at first and then drops rapidly with the increase of the thickness of IMC layer, reaching the maximum when the thickness of IMC layer is about 1.5-3.0 μm.
The sinusoidal vibration failure behavior of ball grid array(BGA) solder joints reflowed with different temperature profiles was studied. The morphologies and thickness of Sn-Cu intermetallic compound(IMC) formed under diverse heating factor were observed by scanning electron microscopy. The stress concentration and distribution of BGA solder joints under the sinusoidal vibration were analyzed by finite element simulation. The results show that the origin and propagation of cracks mechanism differs when the morphologies and thickness of IMC layer are different. The vibration fatigue lifetime of solder joints increases gradually at first and then drops rapidly with the increase of the thickness of IMC layer, reaching the maximum when the thickness of IMC layer is about 1.5-3.0 μm.
引文
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[19]KONG Yi-gang,KONG Zhi-gang,SHI Feng-min.Microstructure and mechanical property of Sn-Ag-Cu solder material[J].Rare Metals,2017,36(3):193-197.
[20]SHEN J,CHAN,Y C,LIU S.Growth mechanism of Ni3Sn4in a Sn/Ni liquid/solid interfacial reaction[J].Acta Materialia,2009,57(17):5196-5206.
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[23]SHEN J,ZHAI D,CAO Z,ZHAO M,PU Y.Fracture behaviors of Sn-Cu intermetallic compound layer in ball grid array induced by thermal shock[J].Journal of Electronic Materials,2014,43(2):567-578.
[24]SHANG J K,ZENG Q L,ZHANG L,ZHU Q S.Mechanical fatigue of Sn-rich Pb-free solder alloys[J].Journal of Materials Science Materials in Electronics,2007,18(1/3):211-227.
[25]GONG J,LIU C,CONWAY P P,SILBERSCHMIDT V V.Evolution of CuSn intermetallics between molten Sn AgCu solder and Cu substrate[J].Acta Materialia,2008,56(16):4291-4297.
[26]YANG Y,LI Y,LU H,CHEN J.Interdiffusion at the interface between Sn-based solders and Cu substrate[J].Microelectronics Reliability,2013,53(2):327-333.
[27]FIELDS R J,LOW S RⅢ,LUCEY G K.The metal science of joining[M].Warrendale,PA:TMS,1992:165-173.
[28]姚健,卫国强,石永华,谷丰.电迁移极性效应及其对Sn-3.0Ag-0.5Cu无铅焊点拉伸性能的影响[J].中国有色金属学报,2011,21(12):3094-3099.YAO Jian,WEI Guo-qiang,SHI Yong-hua,GU Feng.Polarity effect of electromigration and its influence on tensile properties of Sn-3.0Ag-0.5Cu lead-free solder joint[J].The Chinese Journal of Nonferrous Metals,2011,21(12):3094-3099.
[2]TONG H M,LAI Y S,WONG C P.Advanced flip chip package[M].USA:Springer,2013:31-45.
[3]杨淼森,孙凤莲,孔祥霞,周云芳.Sn-Ag-Cu无铅球栅阵列焊点塑性表征[J].中国有色金属学报,2015,25(11):3119-3126.YANG Miao-sen,SUN Feng-lian,KONG Xiang-xia,ZHOUYun-fang.Plastic characterization and performance of Sn-Ag-Cu lead-free BGA solder joint[J].The Chinese Journal of Nonferrous Metals,2015,25(11):3119-3126.
[4]KIM J M,WOO S W,CHANG Y S,KIM Y J,CHOI J B,JIK Y.Impact reliability estimation of lead free solder joint with IMC layer[J].Thin Solid Films,2009,517:4255-4259.
[5]LIU F,MENG G.Random vibration reliability of BGAlead-free solder joint[J].Microelectronics Reliability,2014,54(1):226-232.
[6]YU D,AL-YAFAWI A,NGUYEN T T,PARK S,CHUNG S.High-cycle fatigue life prediction for Pb-free BGA under random vibration loading[J].Microelectronics Reliability,2011,51(3):649-656.
[7]李雪梅,孙凤莲,张浩,辛瞳.微焊点Cu/SAC305/C固-液界面反应及电迁移行为[J].焊接学报,2016,37(9):61-64.LI Xue-mei,SUN Feng-lian,ZHANG Hao,XIN Tong.Micro-solder joints Cu/SAC305/Cu solid-liquid interfacial reaction and electromigration behavior[J].Transactions of the China Welding Institution,2016,37(9):61-64.
[8]LIU F,LU Y,WANG Z,ZHANG Z.Numerical simulation and fatigue life estimation of BGA packages under random vibration loading[J].Microelectronics Reliability,2015,55(12):2777-2785.
[9]XIE X J.Fatigue life prediction of board level solder joints for special equipment under vibration loads[J].Electronic Components and Materials,2016,35(6):98-102.
[10]CHOI C,DASGUPTA A.Effect of temperature on vibration durability of SAC305 printed wiring assemblies[C]//Thermal and Thermomechanical Phenomena in Electronic Systems.IEEE,2012:745-752.
[11]CHE F,PANG J H.Vibration reliability test and finite element analysis for flip chip solder joints[J].Microelectronics Reliability,2009,49(7):754-760.
[12]CHEN Y S,WANG C S,YANG Y J.Combining vibration test with finite element analysis for the fatigue life estimation of PBGA components[J].Microelectronics Reliability,2008,48(4):638-644.
[13]MAIO D D,HUNT C P.High-frequency vibration tests of Sn-Pb and lead-free solder joints[C]//Electronics System-Integration Technology Conference.IEEE,2008:819-824.
[14]SONA M,PRABHU K N.Review on microstructure evolution in SAC solders and its effect on mechanical integrity of solder joints[J].Journal of Materials Science(Materials in Electronics),2013,24(9):3149-3169.
[15]YONG H K,YOO S,CHANG W L.Evaluation of lead-free solder reliability under vibration at elevated temperature[J].International Journal of Materials&Structural Integrity,2014,8(1/2/3):53.
[16]TU P L,CHAN Y C,HUNG K C,LAI J K L.Comparative study of micro-BGA reliability under bending stress[J].IEEETransactions on Advanced Packaging,2000,23(4):750-756.
[17]LAURILA T,VUORINEN V,KIVILAHTI J K.Interfacial reactions between lead-free solders and common base materials[J].Cheminform,2006,37(30):1-60.
[18]鞠国魁,韦习成,孙鹏,刘建影.界面金属间化合物对铜基Sn-3.0Ag-0.5Cu焊点拉伸断裂性能的影响[J].中国有色金属学报,2007,17(12):1936-1942.JU Guo-kui,WEI Xi-cheng,SUN Peng,LIU Jian-ying.Effects of interfacial IMC on tensile fracture behavior of Sn-3.0Ag-0.5Cu solder joints on copper substrates[J].The Chinese Journal of Nonferrous Metals,2007,17(12):1936-1942.
[19]KONG Yi-gang,KONG Zhi-gang,SHI Feng-min.Microstructure and mechanical property of Sn-Ag-Cu solder material[J].Rare Metals,2017,36(3):193-197.
[20]SHEN J,CHAN,Y C,LIU S.Growth mechanism of Ni3Sn4in a Sn/Ni liquid/solid interfacial reaction[J].Acta Materialia,2009,57(17):5196-5206.
[21]PAWE?KIEWICZ M,DANIELEWSKI M,JANCZAK-RUSCH J.Intermetallic layer growth kinetics in Sn-Ag-Cu system using diffusion multiple and reflow techniques[J].Advanced Engineering Materials,2015,17(4):512-522.
[22]LEE H T,CHEN M H,JAO H M,LIAO T L.Influence of interfacial intermetallic compound on fracture behavior of solder joints[J].Materials Science and Engineering A,2003,358(1):134-141.
[23]SHEN J,ZHAI D,CAO Z,ZHAO M,PU Y.Fracture behaviors of Sn-Cu intermetallic compound layer in ball grid array induced by thermal shock[J].Journal of Electronic Materials,2014,43(2):567-578.
[24]SHANG J K,ZENG Q L,ZHANG L,ZHU Q S.Mechanical fatigue of Sn-rich Pb-free solder alloys[J].Journal of Materials Science Materials in Electronics,2007,18(1/3):211-227.
[25]GONG J,LIU C,CONWAY P P,SILBERSCHMIDT V V.Evolution of CuSn intermetallics between molten Sn AgCu solder and Cu substrate[J].Acta Materialia,2008,56(16):4291-4297.
[26]YANG Y,LI Y,LU H,CHEN J.Interdiffusion at the interface between Sn-based solders and Cu substrate[J].Microelectronics Reliability,2013,53(2):327-333.
[27]FIELDS R J,LOW S RⅢ,LUCEY G K.The metal science of joining[M].Warrendale,PA:TMS,1992:165-173.
[28]姚健,卫国强,石永华,谷丰.电迁移极性效应及其对Sn-3.0Ag-0.5Cu无铅焊点拉伸性能的影响[J].中国有色金属学报,2011,21(12):3094-3099.YAO Jian,WEI Guo-qiang,SHI Yong-hua,GU Feng.Polarity effect of electromigration and its influence on tensile properties of Sn-3.0Ag-0.5Cu lead-free solder joint[J].The Chinese Journal of Nonferrous Metals,2011,21(12):3094-3099.