共阴极肖特基二极管热阻测试方法研究
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摘要
以共阴极肖特基二极管为研究对象,开展单管芯热阻和双管芯热阻测试研究。通过对共阴极二极管的简单介绍,引入传统热阻测试、有限元仿真、热阻矩阵三种方式,进行相同测试条件下的稳态热阻测试,发现传统热阻忽略了热源之间的热耦合,因此传统热阻测试方法不适合于双管芯稳态热阻测试。采用ANSYS 17.0数值模拟方法,对单管芯和双管芯稳态热阻进行仿真,仿真结果验证了热阻矩阵测试双管芯热阻的准确性。从而得出采用热阻矩阵方法进行多热源器件稳态热阻测试是合适的。
The common cathode schottky diode is used as the research object for test research of the single pipe core thermal resistance and double tube core thermal resistance. The traditional thermal resistance test, the finite element simulation and the thermal resistance matrix are introduced for the steady state thermal resistance test under the same test environment. It is found that the thermal coupling between the heat source is ignored by the traditional thermal resistance. So the traditional method is not suitable for the double tube core steady state thermal resistance test. By using the numerical simulation method of ANSYS17.0, the simulation is conducted for the steady state thermal resistance of the single pipe core and the double one, which shows the accuracy of thermal resistance matrix in double tube core thermal resistance, and thethermal resistance matrix is appropriate for steady state of the heat source device thermal resistance test.
The common cathode schottky diode is used as the research object for test research of the single pipe core thermal resistance and double tube core thermal resistance. The traditional thermal resistance test, the finite element simulation and the thermal resistance matrix are introduced for the steady state thermal resistance test under the same test environment. It is found that the thermal coupling between the heat source is ignored by the traditional thermal resistance. So the traditional method is not suitable for the double tube core steady state thermal resistance test. By using the numerical simulation method of ANSYS17.0, the simulation is conducted for the steady state thermal resistance of the single pipe core and the double one, which shows the accuracy of thermal resistance matrix in double tube core thermal resistance, and thethermal resistance matrix is appropriate for steady state of the heat source device thermal resistance test.
引文
[1]Li ting.Power schottky diode and the key technology research[D].Harbin engineering university,2012.8.
[2]JEDEC Standard EIA/JESD51-1,Integrated Circuit Thermal Measurement Method Electrical Test Method(Single semiconductor Device)[S].1995.
[3]Rosten,Harvey,Lasance C J M.The Development of Libraries of Thermal Models of Electronics Components for an Integrated Design Environment[A].Proceedings of the IEPS Conference[C].Atlanta,Georgia,138147.
[4]Teng weirong,Ju changchao.An investigation of thermal testing and analgsis for power MOSFET device[J].Electronice and packaging,October 2011.
[5]Bar-Cohen.Thermal management of air-and liquid-cooled multiple modules[J].IEEE Trans Compon,hybird-manuf technol,1987,CHMT-10(2):6265.
[6]Sullhan R,Monaghan T,Agarwal A.Thermal Moduling and analysis of Multiple Modules[A].Process of the 7th Annual IEEE Muti-chip Module conference[C].1992.1822.
[7]Joiner B,Adams V.Measurement and Simulation of Junction to Board Thermal Resistance and Its Application in Thermal Modeling[A].Proc of SEMITHERM[C].1999,San Diego.2226.
[8]Zhu junjie.The research of thermal resistance measurement for power chip and the design of test system[D].Southeast university,April 2013.
[2]JEDEC Standard EIA/JESD51-1,Integrated Circuit Thermal Measurement Method Electrical Test Method(Single semiconductor Device)[S].1995.
[3]Rosten,Harvey,Lasance C J M.The Development of Libraries of Thermal Models of Electronics Components for an Integrated Design Environment[A].Proceedings of the IEPS Conference[C].Atlanta,Georgia,138147.
[4]Teng weirong,Ju changchao.An investigation of thermal testing and analgsis for power MOSFET device[J].Electronice and packaging,October 2011.
[5]Bar-Cohen.Thermal management of air-and liquid-cooled multiple modules[J].IEEE Trans Compon,hybird-manuf technol,1987,CHMT-10(2):6265.
[6]Sullhan R,Monaghan T,Agarwal A.Thermal Moduling and analysis of Multiple Modules[A].Process of the 7th Annual IEEE Muti-chip Module conference[C].1992.1822.
[7]Joiner B,Adams V.Measurement and Simulation of Junction to Board Thermal Resistance and Its Application in Thermal Modeling[A].Proc of SEMITHERM[C].1999,San Diego.2226.
[8]Zhu junjie.The research of thermal resistance measurement for power chip and the design of test system[D].Southeast university,April 2013.