PCB组装板多器件焊点疲劳寿命跨尺度有限元计算
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摘要
随着电子设备向着小型化、多功能化方向发展,互连的可靠性越来越受到人们的重视。现有研究的分析对象大多为单个器件,而实际服役过程中,印制电路板(Printed circuit board,PCB)的形变、传热、受力情况都将对焊点可靠性产生影响。传统焊点可靠性有限元分析以单一器件为基础,而将仿真对象扩展为整个PCB板,对于提升焊点可靠性评估的准确性和有效性具有重要的意义。利用ANSYS有限元软件,对处于不同尺度的焊点、器件以及PCB板进行建模,分析再流焊载荷下各器件焊点的残余应力应变分布,讨论热循环后各器件焊点的危险位置,并根据修正的Coffin-Manson模型,给出各封装类型焊点的热循环寿命。通过与器件级焊点可靠性模拟结果的对比,说明板级有限元分析的必要性和不可替代性,进一步完善焊点可靠性有限元分析理论。
With the miniaturization and multifunction of electronic component, the interconnection reliability has attracted more and more attention. Individual component has been analyzed in previous works. However when it enters service, the deformation, the heat conduction and the load of printed circuit board(PCB) will make a difference to the reliability of solder joint. Traditional finite element analysis into the solder joint is based on the component itself, but it can improve the accuracy and effectiveness of reliability assess into the solder joint when changing the simulation object into the whole PCB. The multi-scale solder joints, components and PCB are modeled and analyzed using ANSYS finite element software. The residual strain and stress distribution of the solder joint after reflow process are analyzed. The dangerous positions of the solder joint are discussed and the fatigue lives of solder joints in different packages are calculated using modified Coffin-Manson model. Comparison between the board level and the component level results shows the necessity and irreplaceability of board level simulation and helps to perfect the finite element theory into the fatigue life of the solder joint.
With the miniaturization and multifunction of electronic component, the interconnection reliability has attracted more and more attention. Individual component has been analyzed in previous works. However when it enters service, the deformation, the heat conduction and the load of printed circuit board(PCB) will make a difference to the reliability of solder joint. Traditional finite element analysis into the solder joint is based on the component itself, but it can improve the accuracy and effectiveness of reliability assess into the solder joint when changing the simulation object into the whole PCB. The multi-scale solder joints, components and PCB are modeled and analyzed using ANSYS finite element software. The residual strain and stress distribution of the solder joint after reflow process are analyzed. The dangerous positions of the solder joint are discussed and the fatigue lives of solder joints in different packages are calculated using modified Coffin-Manson model. Comparison between the board level and the component level results shows the necessity and irreplaceability of board level simulation and helps to perfect the finite element theory into the fatigue life of the solder joint.
引文
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[14]王尚,田艳红,韩春,等.CBGA器件温度场分布对焊点疲劳寿命影响的有限元分析[J].焊接学报,2016,37(11):113-118.WANG Shang,TIAN Yanhong,HAN Chun,et al.Effect of thermal distribution in CBGA components to fatigue life of solder joint by FEA method[J].Transactions of the China Welding Institution,2016,37(11):113-118.
[15]JIANG T,DU C,XU L.Finite element analysis and fatigue life prediction of BGA mixed solder joints[C/CD]//2007 International Symposium on High Density Packaging and Microsystem Integration,June26-28,2007,Shanghai,China.
[16]田艳红,贺晓斌,杭春进,等.残余应力对混合组装BGA热循环可靠性影响[J].机械工程学报,2014,50(2):86-91.TIAN Yanhong,HE Xiaobin,HANG Chunjin,et al.Influence of the hybrid BGA residual stress after reflow on the thermal cycling reliability[J].Journal of Mechanical Engineering,2014,50(2):86-91.
[17]CHAI F,OSTERMAN M,PECHT M.Strain-range-based solder life predictions under temperature cycling with varying amplitude and mean[J].IEEE Transactions on Device and Materials Reliability,2014,14(1):351-357.
[18]MANSON S S.Behavior of materials under conditions of thermal stress[M].Michigan:University of Michigan Press,1953.
[19]ENGELMAIER W.Fatigue life of leadless chip carrier solder joints during power cycling[J].IEEE Transactions on Components Hybrids&Manufacturing Technology,2003,6(3):232-237.
[2]黄圆,田艳红,江智,等.脉冲电流快速烧结纳米铜焊膏连接铜镍基板研究[J].机械工程学报,2017,53(4):34-42.HUANG Yuan,TIAN Yanhong,JIANG Zhi,et al.Rapidly sintering of nano copper paste and interconnection of copper and nickel substrate by pulse current[J].Journal of Mechanical Engineering,2017,53(4):34-42.
[3]MIAO H,MEI Q,YUAN J,et al.Low cycle fatigue and strengthening mechanism of cold extruded large diameter internal thread of Q460 steel[J].Chinese Journal of Mechanical Engineering,2016,29(3):556-563.
[4]ZHANG L,HAN J,HE C,et al.Reliability behavior of lead-free solder joint in electronic components[J].Journal of Materials Science:Materials in Electronics,2013,24(1):172-190.
[5]孔祥霞,孙凤莲,杨淼森,等.Bi和Ni元素对Cu/SAC/Cu微焊点体钎料蠕变性能的影响[J].机械工程学报,2017,53(2):53-60.KONG Xiangxia,SUN Fenglian,YANG Miaosen,et al.Effect of Bi and Ni concentration on the creep behavior of the bulks of Cu/SAC/Cu micro solder joints[J].Journal of Mechanical Engineering,2017,53(2):53-60.
[6]CHE F X,PANG J H L.Fatigue reliability analysis of Sn-Ag-Cu solder joints subject to thermal cycling[J].IEEE Transactions on Device and Materials Reliability,2013,13(1):36-49.
[7]LI X,LI Z,SHEN H,et al.The analysis on thermal fatigue life of LCCC package based on strain fatigue model and FEM[C/CD]//2015 Prognostics and System Health Management Conference,October 21-23,2015,Beijing,China.
[8]NIESSNER M,SCHUETZ G,BIRZER C,et al.Accurate prediction of SnAgCu solder joint fatigue of QFPpackages for thermal cycling[C/CD]//15th International Conference on Thermal,Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,April 7-9,2014,Ghent,Belgium.
[9]REN C,ZENG C,SHAO J,et al.Analysis of the influence of SOP lead shape on solder joint reliability[C/CD]//15th International Conference on Electronic Packaging Technology,August 12-15,2014,Chengdu,China.
[10]TEE T Y,ZHONG Z.Board level solder joint reliability analysis and optimization of pyramidal stacked die BGApackages[J].Microelectronics Reliability,2004,44(12):1957-1965.
[11]MERCADO L L,SARIHAN V.Predictive design of flip-chip PBGA for high reliability and low cost[C]//49th Electronic Components and Technology Conference,June1-4,1999,San Diego,CA,USA.
[12]PERKINS A,SITARAMAN S K.Universal fatigue life prediction equation for ceramic ball grid array(CBGA)packages[J].Microelectronics Reliability,2007,47(12):2260-2274.
[13]HOSSAIN M M,JAGARKAL S G,AGONAFER D,et al.Design optimization and reliability of PWB level electronic package[J].Journal of Electronic Packaging,2007,129(1):9-18.
[14]王尚,田艳红,韩春,等.CBGA器件温度场分布对焊点疲劳寿命影响的有限元分析[J].焊接学报,2016,37(11):113-118.WANG Shang,TIAN Yanhong,HAN Chun,et al.Effect of thermal distribution in CBGA components to fatigue life of solder joint by FEA method[J].Transactions of the China Welding Institution,2016,37(11):113-118.
[15]JIANG T,DU C,XU L.Finite element analysis and fatigue life prediction of BGA mixed solder joints[C/CD]//2007 International Symposium on High Density Packaging and Microsystem Integration,June26-28,2007,Shanghai,China.
[16]田艳红,贺晓斌,杭春进,等.残余应力对混合组装BGA热循环可靠性影响[J].机械工程学报,2014,50(2):86-91.TIAN Yanhong,HE Xiaobin,HANG Chunjin,et al.Influence of the hybrid BGA residual stress after reflow on the thermal cycling reliability[J].Journal of Mechanical Engineering,2014,50(2):86-91.
[17]CHAI F,OSTERMAN M,PECHT M.Strain-range-based solder life predictions under temperature cycling with varying amplitude and mean[J].IEEE Transactions on Device and Materials Reliability,2014,14(1):351-357.
[18]MANSON S S.Behavior of materials under conditions of thermal stress[M].Michigan:University of Michigan Press,1953.
[19]ENGELMAIER W.Fatigue life of leadless chip carrier solder joints during power cycling[J].IEEE Transactions on Components Hybrids&Manufacturing Technology,2003,6(3):232-237.