金属表面硅烷化技术概述
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摘要
随着金属表面钝化处理工艺中环保要求的日益严格,表面硅烷化技术现已成为一种新型绿色表面钝化工艺,该工艺通过有机硅材料在金属表面形成高致密的保护膜而实施对金属的高效保护,本文结合最新研究进展,分别从保护机理、新型结构有机硅烷及最新应用领域方面阐述了该技术的特点和新动态。
with the environmental concerns on the metal surface passivation process becoming more stricter,surface silanification has emerged as a novel green technique for metal passivation.This technique was effective for protecting the metal from corrosion,owing to a dense high performance membrane covered on the surface of metal.Based on the latest development on the surface salinication,the formation mechanism,silane materials with novel structure and the striking technical characteristic and new application fields were described.
with the environmental concerns on the metal surface passivation process becoming more stricter,surface silanification has emerged as a novel green technique for metal passivation.This technique was effective for protecting the metal from corrosion,owing to a dense high performance membrane covered on the surface of metal.Based on the latest development on the surface salinication,the formation mechanism,silane materials with novel structure and the striking technical characteristic and new application fields were described.
引文
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[19]Pan Guirong,Dale W Schaefer,Ooij Wim J van.[J].Thin Solid Films,2006,515(4):2771-2780.
[20]Hu Jiming,Liu Liang,Zhang Jianqing,et al.[J].Progress in Organic Coatings,2007,58(4):265-271.
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[22]黄令,林克发,杨防祖.[J].电化学,2005,11(2):188-192.
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[24]Zhu Haiying,Chen Shougang,Chen Yan,et al.[J].Journal of Molecular Structure,2009,928:40-45.
[25]刘峰,张旭华,齐海霞,等.[J].化学试剂,2009,31(7):538-540.
[26]张余宝,苗伟俊,齐海霞,等.[J].化工新型材料,2011,39(11):85-87.
[2]Kodaire M,Watanable S,Ito G,et al.Copper foil for printed circuit board,method for fabricating same,and trivalent chromium conversion for fabricating same:US 7344785[P],2008-03-18.
[3]松永哲广.表面处理铜箔及其制造方法、以及带有极薄底漆树脂层的表面处理铜箔:CN 200680020926[P],2008-6-4.
[4](美)E.P.普鲁特曼,等.硅烷和钛酸酯偶联剂[M].上海:上海科学技术出版社,1987.1-303.
[5]Arkles B.[J].Chem.Tech.,1977,7(12):766-778.
[6]廖俊,陈圣云,康宇峰.[J].化工新型材料,2001,29(9):26-28.
[7]Kinloch A J.Adhesion and adhesives:science and technology[M].London:Chapman and Hall Ltd,1987,18-56.
[8]Zucchi F,Frignani A,Grassi V.[J].Materials Chemistry and Physics,2008,110(2-3):263-268.
[9]Beccaria A M,Bertolotto C.[J].Electrochimica Acta,1997,42(9):1361-1371.
[10]Tremont R,Jesus-Cardona H De.[J].Journal of Applied Electrochemistry,2000,30(6):734-743.
[11]Haneda R,Nishihara H,Aramaki K.[J].Journal of the Electrochemical Society,1997,144(4):1215-1221.
[12]Montemor M F,Ferreira M G S.[J].Electrochimica Acta,2007,52(27):7486-7495.
[13]Palanivel V,Huang Y,Ooij W J van.[J].Progress in Organic Coatings,2005,53(2):153-168.
[14]Franquet A,Laet J de,Schram T.[J].Thin Solid Films,2001,384(1):37-45.
[15]Trabelsi W,Cecilio P,Ferreira M G S.[J].Progress in Organic Coatings,2005,54(4):276-284.
[16]Yuan Wei,Ooij Wim J van.[J].Journal of Colloid and Interface Science,1996,185(1):197-209.
[17]Zhu Danqing,Wim J van Ooij.[J].Progress in Organic Coatings,2004,49(1):42-53.
[18]Ooij W J van,Stacy M,Palanivel V.The use of organofunctional silanes as a major constituent in organic coatings for enhanced corrosion protection[M].Collumbus:ASTM Meeting,2002,165-173.
[19]Pan Guirong,Dale W Schaefer,Ooij Wim J van.[J].Thin Solid Films,2006,515(4):2771-2780.
[20]Hu Jiming,Liu Liang,Zhang Jianqing,et al.[J].Progress in Organic Coatings,2007,58(4):265-271.
[21]Li Guoli,Wang Xueming,Li Aiju,et al.[J].Surface and Coatings Technology,2007,201(24):9571-9578.
[22]黄令,林克发,杨防祖.[J].电化学,2005,11(2):188-192.
[23]Deflorian F,Rossi S,Fedrizzi L.[J].Progress in Organic Coatings,2008,110(63):338-344.
[24]Zhu Haiying,Chen Shougang,Chen Yan,et al.[J].Journal of Molecular Structure,2009,928:40-45.
[25]刘峰,张旭华,齐海霞,等.[J].化学试剂,2009,31(7):538-540.
[26]张余宝,苗伟俊,齐海霞,等.[J].化工新型材料,2011,39(11):85-87.