超高分子量聚乙烯耐热性改性研究进展
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摘要
综述了近年来对超高分子量聚乙烯(PE–UHMW)的耐热性改性研究进展,介绍了物理改性(与无机物、有机物、纳米材料共混)、化学改性(过氧化物、偶联剂、辐射交联改性)和聚合填充复合改性在PE–UHMW的耐热性改性方面的应用,讨论了不同PE–UHMW的耐热性改性方法的改性效果及改性机理,并对PE–UHMW的耐热性改性的发展趋势做了展望。
The progress in heat resistance modification of ultrahigh molecular weight polyethylene(PE–UHMW) in recent years was reviewed. The modification was divided into three categories :modifying heat resistance of PE–UHMW through physical blending modification with inorganic substance,organic polymer and nanometer material,chemical crosslinking modification with peroxide,coupling agent and radiation and polymer filled composite modification. The effect and mechanism of different modification methods were discussed. The development trend of heat resistance modification of PE–UHMW was also prospected.
The progress in heat resistance modification of ultrahigh molecular weight polyethylene(PE–UHMW) in recent years was reviewed. The modification was divided into three categories :modifying heat resistance of PE–UHMW through physical blending modification with inorganic substance,organic polymer and nanometer material,chemical crosslinking modification with peroxide,coupling agent and radiation and polymer filled composite modification. The effect and mechanism of different modification methods were discussed. The development trend of heat resistance modification of PE–UHMW was also prospected.
引文
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[3]Martínez-Morlanes M J,etal.Composites Science and Technology,2011,71(3):282–288.
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[5]张恒,等.材料导报,2016,30(5):33–39.Zhang Heng,et al.Materials Review,2016,30(5):33–39.
[6]彭学成.填充改性超高分子量聚乙烯复合材料及加工研究[D].北京:北京化工大学,2006:38–39.Peng Xuecheng.Study on modification and properties of ultra high molecular weight polyethylene composites filled with filler[D].Beijing:Beijing University of Chemical Technology,2006:38–39.
[7]马赟喆,等.北京化工大学学报,2010,37(2):49–53.Ma Yunzhe,et al.Journal of Beijing University of Chemical Technology,2010,37(2):49–53.
[8]陈涛.UHMWPE耐热降磨改性研究[D].武汉:武汉理工大学,2005:24–26.Chen Tao.Study on modification of UHMWPE heat and wear resistance[D].Wuhan:Wuhan University of Technology,2005:24–26.
[9]秦建华,等.武汉工程大学学报,2014,36(6):25–27.Qin Jianhua,et al.Journal of Wuhan Institute of Technology,2014,36(6):25–27.
[10]郝绘坤.超高分子量聚乙烯耐高温改性研究[D].武汉:武汉工程大学,2014:33–36.Hao Huikun.Study on high temperature modification of ultra high molecular weight polyethylene[D].Wuhan:Wuhan University of Technology,2014:33–36.
[11]张迪.超高分子量聚乙烯复合材料的成分组织与性能研究[D].长春:长春理工大学,2010:45–47.Zhang Di.Study on microstructure and properties of ultra high molecular weight polyethylene composites[D].Changchun:Changchun University of Science and Technology,2010:45–47.
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[13]Atanasov A,et al.Polymers and Polymer Composites,2006,14(4):413–420.
[14]童铭康,等.铜粉填充UHMWPE材料导热性能的研究[C]//第十一届中国工程塑料复合材料技术研讨会论文集.泰安:工程塑料应用杂志社,2010:73–75.Tong Mingkang,et al.Study on thermal conductivity of UHMWPE filled with copper powder[C]//Proceedings of the eleventh China engineering plastics composites technology conference.Taian:The Magazine House of Engineering Plastics Application,2010:73–75.
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[16]黄丽,等.北京化工大学学报,2005,32(3):38–41.Huang Li,et al.Journal of Beijing University of Chemical Technology,2005,32(3):38–41.
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[18]Babiker M E,et al.Arabian Journal for Science and Engineering,2013,38(3):479–490.
[19]宋宁,等.工程塑料应用,2016,44(2):129–133.Song Ning,et al.Engineering Plastics Application,2016,44(2):129–133.
[20]刘婷,等.中国塑料,2015(4):30–35.Liu Ting,et al.China Plastics,2015(4):30–35.
[21]He S,et al.Journal of Applied Polymer Science,2015,132(43):39–45.
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[33]苏荣锦.高性能超高分子量聚乙烯复合材料的制备与性能研究[D].株洲:湖南工业大学,2012:55–57.Su Rongjin.Study on preparation and properties of high performanceultrahigh molecular weight polyethylene composites[D].Zhuzhou:Hunan University of Technology,2012:55–57.
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[35]吴向阳,等.一种超高分子量聚乙烯材料及其制备方法:中国,200710172538.0[P].2009-06-24.Wu Xiangyang,et al.A preparation method of ultra high molecular weight polyethylene m-aterial:China,200710172538.0[P].2009-06-24.
[36]张永冰.有机硅氧烷交联改性超高分子量聚乙烯[D].北京:北京化工大学,2011:47–49.Zhang Yongbing.Crosslinking modified ultra high molecular weight polyethylene with organo siloxane[D].Beijing:Beijing University of Chemical Technology,2011:47–49.
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