小尺寸高容量MLCC切割侧裂问题的解决方法
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摘要
为了解决小尺寸高容量MLCC的切割侧裂问题,深入分析了侧裂原因,优化了瓷浆配方、内电极印刷厚度以及层压、切割工艺。结果发现:瓷浆中合适的黏合剂和增塑剂添加量可以提高介质膜片的黏接性,适当减小内电极印刷厚度可以减小电容坯块的厚度差,优化层压工艺可以有效提高电容坯块的致密性,优化切割工艺可以减小芯片所受的应力。通过上述措施解决了切割侧裂问题。
In order to solve the problem of cutting side crack of small size and high capacity MLCC, the causes of side crack were analyzed in depth, and the formulation of ceramic slurry, the printing thickness of inner electrode, lamination process and cutting process was performed. The results show that proper amount of binders and plasticizers in ceramic slurry can enhance adhesion of dielectric film. Properly reducing printing thickness of inner electrodes can reduce thickness difference in greenpressing. Optimization of the lamination process can enhance density of green-pressing. Optimization of cutting process can reduce stress onto green-chip. By measures mentioned above, the problem of cutting side crack is solved.
In order to solve the problem of cutting side crack of small size and high capacity MLCC, the causes of side crack were analyzed in depth, and the formulation of ceramic slurry, the printing thickness of inner electrode, lamination process and cutting process was performed. The results show that proper amount of binders and plasticizers in ceramic slurry can enhance adhesion of dielectric film. Properly reducing printing thickness of inner electrodes can reduce thickness difference in greenpressing. Optimization of the lamination process can enhance density of green-pressing. Optimization of cutting process can reduce stress onto green-chip. By measures mentioned above, the problem of cutting side crack is solved.
引文
[1]陈长云,李筱瑜,祝忠勇.高比容MLCC关键制作技术研究[J].电子工艺技术, 2011, 32(4):229-232.
[2]卓金丽,安可荣,陆亨.01005型MLCC关键制备工艺研究[J].电子工艺技术, 2018(1):46-48.
[3]卢艺森,刘新,肖培义. Ni电极片式多层陶瓷电容器产生开裂的几种因素分析[J].电子质量, 2008(9):35-37.
[4]刘新,李筱瑜,陈长云. MLCC制作过程中分层开裂原因分析[J].电子工艺技术,2011, 32(6):335-337.
[5]陈长云,李筱瑜. MLCC内电极厚度对其性能影响的研究[J].电子工艺技术, 2011, 32(2):105-107.
[6]张尹,赖永雄,肖培义,等.MLCC制造中产生内部开裂的研究[J].电子元件与材料,2005, 24(05):52-54.
[7]许耿睿,林伟强.片式电容层压机的结构原理及其工艺[J].电子工艺技术, 2006, 27(6):364-365.
[2]卓金丽,安可荣,陆亨.01005型MLCC关键制备工艺研究[J].电子工艺技术, 2018(1):46-48.
[3]卢艺森,刘新,肖培义. Ni电极片式多层陶瓷电容器产生开裂的几种因素分析[J].电子质量, 2008(9):35-37.
[4]刘新,李筱瑜,陈长云. MLCC制作过程中分层开裂原因分析[J].电子工艺技术,2011, 32(6):335-337.
[5]陈长云,李筱瑜. MLCC内电极厚度对其性能影响的研究[J].电子工艺技术, 2011, 32(2):105-107.
[6]张尹,赖永雄,肖培义,等.MLCC制造中产生内部开裂的研究[J].电子元件与材料,2005, 24(05):52-54.
[7]许耿睿,林伟强.片式电容层压机的结构原理及其工艺[J].电子工艺技术, 2006, 27(6):364-365.