微量元素Ce对Sn-0.7Cu-0.05Ni无铅焊料合金性能的影响
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摘要
以Sn-0.7Cu-0.05Ni无铅焊料合金为基础,研究Ce元素含量对合金微观组织、熔程、润湿性和力学性能的影响.将纯锡和中间合金Sn-10Cu、Sn-4Ni、Sn-1.8Ce按质量比在270℃熔化,保温20 min后搅拌均匀,浇铸冷却后制备成Sn-0.7Cu-0.05Ni-x Ce(x=0~0.09)焊料合金.通过光学显微镜观察焊料合金的显微组织,通过差示扫描量热分析仪(DSC)进行焊料合金熔点测定,采用铺展性试验法表征焊料的润湿性,采用万能材料试验机测试焊料的力学性能.结果表明:微量的Ce可细化晶粒,在Ce含量为0.03%时,组织最为细化;随着Ce含量的增加合金的固相线温度下降,但熔程增加;随着Ce含量的增加,铺展面积先增大再减小,在Ce含量为0.05%时,铺展面积最大,润湿性最好.
Sn-0.7 Cu-0.05 Ni lead-free solder alloy was selected as a base alloy,and the effects of Ce contents on microstructure,melting range,wettability and mechanical property of the solder alloy were investigated. The pure tin and master alloys Sn-10 Cu、Sn-4 Ni、Sn-1.8 Ce were melted at 270 ℃ according to the mass ratio. After 20 min insulation,the alloys were stirred evenly,and then the Sn-0.7 Cu-0.05 Ni-x Ce(x = 0-0.09) solder alloys were prepared after casting and cooling. The microstructure of the solder alloys were observed by optical microscope; the melting point of the solder alloys were analyzed by differential scanning calorimetry(DSC); the wettability of the solder on Cu substrate was investigated by spreading area method; and the mechanical property of the solder alloys were analyzed by universal material experiment machine.The results show that adding trace amount of Ce could refine the microstructure of the solder alloys. And when the Ce content was 0.03 %,the grain refinement was most obvious. The fusion start temperature of solder alloy decrease with the increase of the Ce content,but the melting range of solder alloy increase with the increase of the Ce content. The spreading area of solder alloy first increase and then decrease with the increase of Ce content. When the Ce content was 0. 05 %,the spreading area was the maximum,and the wettability of the solder was the best.
Sn-0.7 Cu-0.05 Ni lead-free solder alloy was selected as a base alloy,and the effects of Ce contents on microstructure,melting range,wettability and mechanical property of the solder alloy were investigated. The pure tin and master alloys Sn-10 Cu、Sn-4 Ni、Sn-1.8 Ce were melted at 270 ℃ according to the mass ratio. After 20 min insulation,the alloys were stirred evenly,and then the Sn-0.7 Cu-0.05 Ni-x Ce(x = 0-0.09) solder alloys were prepared after casting and cooling. The microstructure of the solder alloys were observed by optical microscope; the melting point of the solder alloys were analyzed by differential scanning calorimetry(DSC); the wettability of the solder on Cu substrate was investigated by spreading area method; and the mechanical property of the solder alloys were analyzed by universal material experiment machine.The results show that adding trace amount of Ce could refine the microstructure of the solder alloys. And when the Ce content was 0.03 %,the grain refinement was most obvious. The fusion start temperature of solder alloy decrease with the increase of the Ce content,but the melting range of solder alloy increase with the increase of the Ce content. The spreading area of solder alloy first increase and then decrease with the increase of Ce content. When the Ce content was 0. 05 %,the spreading area was the maximum,and the wettability of the solder was the best.
引文
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[11]李广东,郝虎,史耀武,等.微量元素对Sn-0.7Cu无铅钎料抗氧化性能的影响[J].电子元件与材料,2007,26(11):49-52.
[12]Saleh N A,Ramli M I I,Salleh M A A M.Effect of Zinc Additions on Sn-0.7 Cu-0.05 Ni Lead-Free Solder Alloy[C]//IOP Conference Series:Materials Science and Engineering.IOP Publishing,2017,238(1):012012.
[13]孟工戈,康敏,仇爱梅.稀土Sm对Sn-Cu-Ni钎料熔点、润湿性和界面组织的影响[J].电焊机,2016,46(1):18-22.
[14]Belyakov S A,Xian J W,Sweatman K,et al.Influence of bismuth on the solidification of Sn-0.7 Cu-0.05 Ni-x Bi/Cu joints[J].Journal of Alloys and Compounds,2017,701:321-334.
[15]张宇航,高瑞军,孙福林,等.Ce元素添加量对Sn-Zn-Cu无铅合金焊料的焊接组织和性能的影响[J].材料研究与应用,2014(1):35-38.
[2]易江龙,张宇鹏,许磊,等.微量锗对Sn-0.7Cu-0.05Ni钎料微观组织与性能的影响[J].电子元件与材料,2012,31(3):53-56.
[3]周敏波,马骁,张新平.稀土改性Sn-Cu-Ni无铅钎料的凝固过冷行为与组织演化[J].稀有金属材料与工程,2011(s2):25-30.
[4]卢斌,王娟辉,栗慧,等.微量铈对Sn-0.7Cu-0.5Ni焊料合金组织与性能的影响[J].中国稀土学报,2007,25(2):217-223.
[5]卢斌,王娟辉,栗慧,等.添加0.10%Ce对Sn-0.7Cu-0.5Ni焊料与Cu基板间界面IMC的影响[J].中国有色金属学报,2007,17(3):390-395.
[6]陈海燕,揭晓华,张海燕,等.添加0.05%(La+Ce)对Sn XCu Ni焊料与Cu基板间界面组织的影响[J].材料工程,2011(9):29-32.
[7]唐坤,闫焉服,郭晓晓,等.微量Ag对Sn0.7Cu力学性能影响[J].河南科技大学学报(自然科学版),2010,31(3):4-7.
[8]王瑾.微量Ni,Ge元素改善Sn-0.7Cu无铅合金焊料性能的机理研究[J].印制电路信息,2009(s1):324-329.
[9]Nogita K.Stabilisation of Cu6Sn5 by Ni in Sn-0.7 Cu-0.05 Ni lead-free solder alloys[J].Intermetallics,2010,18(1):145-149.
[10]El-Daly A A,Hammad A E.Development of high strength Sn-0.7 Cu solders with the addition of small amount of Ag and In[J].Journal of Alloys and Compounds,2011,509(34):8554-8560.
[11]李广东,郝虎,史耀武,等.微量元素对Sn-0.7Cu无铅钎料抗氧化性能的影响[J].电子元件与材料,2007,26(11):49-52.
[12]Saleh N A,Ramli M I I,Salleh M A A M.Effect of Zinc Additions on Sn-0.7 Cu-0.05 Ni Lead-Free Solder Alloy[C]//IOP Conference Series:Materials Science and Engineering.IOP Publishing,2017,238(1):012012.
[13]孟工戈,康敏,仇爱梅.稀土Sm对Sn-Cu-Ni钎料熔点、润湿性和界面组织的影响[J].电焊机,2016,46(1):18-22.
[14]Belyakov S A,Xian J W,Sweatman K,et al.Influence of bismuth on the solidification of Sn-0.7 Cu-0.05 Ni-x Bi/Cu joints[J].Journal of Alloys and Compounds,2017,701:321-334.
[15]张宇航,高瑞军,孙福林,等.Ce元素添加量对Sn-Zn-Cu无铅合金焊料的焊接组织和性能的影响[J].材料研究与应用,2014(1):35-38.