Ni元素对SnCu0.7焊料合金性能的影响
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摘要
以SnCu0.7无铅焊料合金为基础,研究微量元素Ni含量对焊料合金微观组织、熔程、润湿性能的影响。将纯锡和中间合金Sn-10Cu和Sn-4Ni按质量比在270℃熔化,保温20min后搅拌均匀,浇铸冷却后制备成Sn-0.7Cu-xNi(x=0～0.09)焊料合金。通过光学显微镜(OM)观察焊料合金的显微组织,利用差示扫描量热分析仪(DSC)测定焊料合金熔点,采用润湿平衡法测定焊料的润湿性。结果表明,添加微量Ni可细化焊料组织,降低焊料合金的熔程,提高焊料的润湿性。在Ni含量为0.09%时,合金组织细化最为明显;在Ni含量为0.05%时,合金熔程最短,为4.6℃,且此时润湿性最大,润湿时间为0.71s、润湿力为1.03mN。
Sn-0.7 Cu lead-free solder alloy was selected as a base alloy,the effects of Ni content on microstructure,density,melting range and wettability of the solder alloy were investigated.The pure tin and master alloys Sn-10 Cu and Sn-4 Ni were melted at 270℃ according to the mass ratio.After 20 min insulation,the alloys were stirred evenly,and then the Sn-0.7 CuxNi(x=0—0.09)solder alloys were prepared after casting and cooling.The microstructure of the solder alloys was observed by an optical microscope(OM),the melting point of the solder alloys was measured by a differential scanning calorimetry(DSC),and the wettability of the solder on Cu substrate was investigated by the wetting balance testing method.The results show that adding trace amount of Ni could refine the microstructure of the solder alloys,reduce the melting range of the solder alloy,and improve the wettability of the solder.When the Ni content was 0.09%,the grain refinement was most obvious.When the Ni content was 0.05%,the melting range of the solder alloy was the shortest,which was 4.6℃.And adding trace amount of Ni could increase the wettability of the solders.At this time,the wettability of the solder was the best,the wetting time was 0.71 sand the wetting force was 1.03 mN.
Sn-0.7 Cu lead-free solder alloy was selected as a base alloy,the effects of Ni content on microstructure,density,melting range and wettability of the solder alloy were investigated.The pure tin and master alloys Sn-10 Cu and Sn-4 Ni were melted at 270℃ according to the mass ratio.After 20 min insulation,the alloys were stirred evenly,and then the Sn-0.7 CuxNi(x=0—0.09)solder alloys were prepared after casting and cooling.The microstructure of the solder alloys was observed by an optical microscope(OM),the melting point of the solder alloys was measured by a differential scanning calorimetry(DSC),and the wettability of the solder on Cu substrate was investigated by the wetting balance testing method.The results show that adding trace amount of Ni could refine the microstructure of the solder alloys,reduce the melting range of the solder alloy,and improve the wettability of the solder.When the Ni content was 0.09%,the grain refinement was most obvious.When the Ni content was 0.05%,the melting range of the solder alloy was the shortest,which was 4.6℃.And adding trace amount of Ni could increase the wettability of the solders.At this time,the wettability of the solder was the best,the wetting time was 0.71 sand the wetting force was 1.03 mN.
引文
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[11]YANG L,ZHANG Y,DAI J,et al.Microstructure,interfacial IMC and mechanical properties of Sn-0.7CuxAl(x=0~0.075%)lead-free solder alloy[J].Materials&Design,2015,67:209-216.
[12]ALI B,SABRI M F M,SAID S M,et al.Microstructural modification of Sn-0.7Cu solder alloys by Fe/Bi-addition for achieving high mechanical performance[J].Journal of Electronic Materials,2017,46:1-10.
[13]SIAHAAN E.Behavior of Sn-0.7Cu-xZn lead free solder on physical properties and micro structure[C]//Materials Science and Engineering Conference Series,2017:012044.
[14]TIAN S,LI S,ZHOU J,et al.Effect of indium addition on interfacial IMC growth and bending properties of eutectic Sn-0.7Cu solder joints[J].Journal of Materials Science Materials in Electronics,2017:1-13.
[15]YANG L,GE J,ZHANG Y,et al.Investigation on the microstructure,interfacial IMC layer,and mechanical properties of Cu/Sn-0.7Cu-xNi/Cu solder joints[J].Journal of Electronic Materials,2016,45(7):3766-3775.
[16]王青萌.微量元素对Sn-0.7Cu无铅钎料润湿性和高温抗氧化性的影响[D].重庆:重庆理工大学:2015:40-43.WANG Qingmeng.Influence of trace elements on the wettability and oxidation of liquid Sn-0.7Cu lead-free solder[D].Chongqing:Chongqing University of Technology,2015:40-43.
[17]刘全坤.材料成形基本原理[M].2版.北京:机械工业出版社,2010:18-25.LIU Quankun.Basic principles of material forming[M].2nd edition.Beijing:Machinery Industry Press,2010:18-25.
[2]黄琴宝,葛盼盼.铟对SnCu钎料合金性能的影响研究[J].铸造技术,2018,39(6):1315-1317.HUANG Qinbao,GE Panpan.Effect of indium on properties of SnCu soldering alloy[J].Foundry Technology,2018,39(6):1315-1317.
[3]廖春丽.稀土元素Er对SnCu基无铅钎料组织与性能的影响[J].铸造技术,2017,38(11):2734-2379.LIAO Chunli.Influence of rare earth Er on microstructures and properties of SnCu lead-free solder[J].Foundry Technology,2017,38(11):2734-2379.
[4]HASNINE M,TOLLA B,KARASAWA M,et al.Effect of Ge addition on wettability,copper dissolution,microstructural and mechanical behavior of SnCu-Ge solder alloy[J].Journal of Materials Science Materials in Electronics,2017,28(21):16106-16119.
[5]朱路,杨莉,陈慧明,等.微量Zn颗粒对Sn-0.7Cu-xZn钎料焊点组织及力学性能的影响[J].热加工工艺,2017,46(23):30-34.ZHU Lu,YANG Li,CHEN Huiming,et al.Effects of minor Zn particles on microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint[J].Hot Working Technology,2017,46(23):30-34.
[6]戴军,刘政,杨莉,等.纳米Ag颗粒对Sn-0.7CuxAg钎料组织及性能的影响[J].热加工工艺,2018,47(3):33-36.DAI Jun,LIU Zheng,YANG Li,et al.Effect of nano Ag particles on microstructure and properties of Sn-0.7Cu-xAg solders[J].Hot Working Technology,2018,47(3):33-36.
[7]宋兵兵,杨莉,蒋立诚,等.时效温度对Sn-0.7CuxFe钎焊接头可靠性的影响[J].焊接,2017(11):17-20.SONG Bingbing,YANG Li,JIANG Licheng,et al.Effect of aging temperature on reliability of soldered joint with Sn-0.7Cu-xFe filler metal[J].Welding&Joining,2017(11):17-20.
[8]CHENG F,MA Z,WANG Y,et al.Creep Behaviors of Sn0.7Cu0.1Co0.05Ni/Cu soldering joints[J].IEEETransactions on Components,Packaging and Manufacturing Technology,2014,4(12):2058-2065.
[9]SHUANG T,SAIPENG L,JIAN Z,et al.Effect of indium addition on interfacial IMC growth and bending properties of eutectic Sn-0.7Cu solder joints[J].Journal of Materials Science Materials in Electronics,2017,28(21):16120-16132.
[10]李广东,郝虎,史耀武,等.微量元素对Sn-0.7Cu无铅钎料抗氧化性能的影响[J].电子元件与材料,2007,26(11):49-52.LI Guangdong,HAO Hu,SHI Yaowu,et al.Effect of the microelements on the oxidation-resistance of Sn-0.7Cu lead-free solder[J].Electronic Components and Materials,2007,26(11):49-52.
[11]YANG L,ZHANG Y,DAI J,et al.Microstructure,interfacial IMC and mechanical properties of Sn-0.7CuxAl(x=0~0.075%)lead-free solder alloy[J].Materials&Design,2015,67:209-216.
[12]ALI B,SABRI M F M,SAID S M,et al.Microstructural modification of Sn-0.7Cu solder alloys by Fe/Bi-addition for achieving high mechanical performance[J].Journal of Electronic Materials,2017,46:1-10.
[13]SIAHAAN E.Behavior of Sn-0.7Cu-xZn lead free solder on physical properties and micro structure[C]//Materials Science and Engineering Conference Series,2017:012044.
[14]TIAN S,LI S,ZHOU J,et al.Effect of indium addition on interfacial IMC growth and bending properties of eutectic Sn-0.7Cu solder joints[J].Journal of Materials Science Materials in Electronics,2017:1-13.
[15]YANG L,GE J,ZHANG Y,et al.Investigation on the microstructure,interfacial IMC layer,and mechanical properties of Cu/Sn-0.7Cu-xNi/Cu solder joints[J].Journal of Electronic Materials,2016,45(7):3766-3775.
[16]王青萌.微量元素对Sn-0.7Cu无铅钎料润湿性和高温抗氧化性的影响[D].重庆:重庆理工大学:2015:40-43.WANG Qingmeng.Influence of trace elements on the wettability and oxidation of liquid Sn-0.7Cu lead-free solder[D].Chongqing:Chongqing University of Technology,2015:40-43.
[17]刘全坤.材料成形基本原理[M].2版.北京:机械工业出版社,2010:18-25.LIU Quankun.Basic principles of material forming[M].2nd edition.Beijing:Machinery Industry Press,2010:18-25.