铈对Sn-0.7Cu焊料合金性能的影响
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摘要
以Sn-0.7Cu无铅焊料为基础,研究Ce元素含量对焊料合金微观组织、熔程、润湿性的影响。将纯锡和中间合金Sn-10Cu和Sn-1.8Ce按质量比在270℃熔化、保温20 min后搅拌均匀,浇铸冷却后制备成Sn-0.7Cu-xCe (x=0～0.3)焊料合金。通过光学显微镜观察焊料合金的显微组织,采用X射线衍射仪(XRD)进行焊料合金的物相分析,通过差示扫描量热分析仪(DSC)进行焊料合金熔点测定,采用铺展性试验法和润湿平衡法测定焊料的润湿性。结果表明:Ce元素可细化焊料合金组织,在Ce含量为0.1%时晶粒组织细化最明显;焊料合金的熔程随着Ce元素含量的增加而增加;焊料的润湿性随着Ce元素含量的增加先升高后降低, Ce元素含量为0.05%时最优,润湿时间为0.72 s,铺展面积为0.56 mm~2。
The Sn-0.7 Cu lead-free solder alloy was selected as a base alloy. The effects of Ce contents on microstructure,melting range and wettability of the solder alloy were investigated. The pure tin and master alloys Sn-10 Cu and Sn-1.8 Ce were melted at 270 ℃ according to the mass ratio. After 20 min insulation, the alloys were stirred evenly, and then the Sn-0.7 Cu-xCe(x=0～0.3) solder alloys were prepared after casting and cooling. The microstructure of the solder alloys was observed by optical microscope, and the phase analysis of the solder alloys was analyzed by X-ray diffractometer(XRD), and the melting point of the solder alloys was analyzed by differential scanning calorimetry(DSC), and the wettability of the solder on Cu substrate was investigated by spreading area method and wetting balance testing method. The results showed that when the Ce addition increased, the microstructure of the solders was gradually refined and became more uniform, and when the Ce content was 0.1%, the grain refinement was most obvious. The melting range of solder alloy increased with the increase of the Ce content. The wettability of solder alloy first increased and then decreased with the increase of Ce content. When the Ce content was 0.05%, the wettability of the solder was the best. And wetting time was 0.72 s and spreading area was 0.56 mm~2.
The Sn-0.7 Cu lead-free solder alloy was selected as a base alloy. The effects of Ce contents on microstructure,melting range and wettability of the solder alloy were investigated. The pure tin and master alloys Sn-10 Cu and Sn-1.8 Ce were melted at 270 ℃ according to the mass ratio. After 20 min insulation, the alloys were stirred evenly, and then the Sn-0.7 Cu-xCe(x=0～0.3) solder alloys were prepared after casting and cooling. The microstructure of the solder alloys was observed by optical microscope, and the phase analysis of the solder alloys was analyzed by X-ray diffractometer(XRD), and the melting point of the solder alloys was analyzed by differential scanning calorimetry(DSC), and the wettability of the solder on Cu substrate was investigated by spreading area method and wetting balance testing method. The results showed that when the Ce addition increased, the microstructure of the solders was gradually refined and became more uniform, and when the Ce content was 0.1%, the grain refinement was most obvious. The melting range of solder alloy increased with the increase of the Ce content. The wettability of solder alloy first increased and then decreased with the increase of Ce content. When the Ce content was 0.05%, the wettability of the solder was the best. And wetting time was 0.72 s and spreading area was 0.56 mm~2.
引文
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[11] 张宇航, 高瑞军, 孙福林, 韩振峰, 潘凯华, 钟茂山. Ce元素添加量对Sn-Zn-Cu无铅合金焊料的焊接组织和性能的影响 [J]. 材料研究与应用, 2014, 8(1): 35.Zhang Y H, Gao R J, Sun F L, Han Z F, Pan K H, Zhong M S. Effect of Ce on microstructure and properties of Sn-ZnCu lead-free solder alloy [J]. Materials Research and Application, 2014, 8(1): 35.
[12] 韩运侠, 张柯柯. 稀土元素对Sn-0.2Ag-0.7Cu钎料合金物理性能的影响 [J]. 电子元件与材料, 2008, 27(2): 42.Han Y X, Zhang K K. Effect of RE physical properties of Sn-0.2Ag-0.7Cu solder alloy [J]. Electronic Components and Materials, 2008, 27(2): 42.
[13] 周公度, 段连运主编. 结构化学基础 (第3版) [M]. 北京: 北京大学出版社, 2002.Zhou G D, Duan L Y. Structural Chemistry Foundation (3rd Edition) [M]. Beijing: Peking University Press, 2002.
[14] 薛松柏, 钱乙余, 赵振清, 董健. 银基钎料中铈与杂质元素铅、 铋作用机制 [J]. 中国稀土学报, 2002, 20(5): 436.Xue S B, Q Y Y, Zhao Z Q, Dong J. Mechanism of interaction relation between rare earth element cerium and impurity elements lead and bismuth in Ag-based filler metal [J]. Journal of the Chinese Society of Rare Earths, 2002, 20(5): 436.
[15] 沈艳兰, 顾小龙, 徐时清, 金霞. Ce的添加对SnAgCu系钎料组织和性能的影响 [J]. 中国计量大学学报, 2011, 22(2): 194.Shen Y L, Gu X L, Xu S Q, Jin X. Influence of rare earth element cerium on the structure and properties of SnAgCu solders [J]. Journal of China University of Metrology, 2011, 22(2): 194.
[16] 栗慧, 卢斌, 王娟辉. 微量Ce对SnAgCu焊料与铜基界面IMC的影响 [J]. 电子元件与材料, 2009, 28(4): 40.Li H, Lu B, Wang J H. Effect of microamount Ce on the interfacial IMC between SnAgCu solder and Cu substrate [J]. Electronic Components and Materials, 2009, 28(4): 40.
[17] 栗慧, 卢斌, 王娟辉. 微量稀土元素对Sn3.0Ag0.5Cu无铅焊料合金组织与性能的影响 [J]. 热加工工艺, 2011, 40(9): 31.Li H, Lu B, Wang J H. Effect of rare earth on microstructure and properties of Sn_3Ag_(0.5)Cu lead-free solder alloy [J]. Hot Working Technology, 2011, 40(9): 31.
[2] 周敏波, 马骁, 张新平. 稀土改性Sn-Cu-Ni无铅钎料的凝固过冷行为与组织演化 [J]. 稀有金属材料与工程, 2011, 40(s2): 25.Zhou M B, Ma X, Zhang X P. Influence of rare earth La-Ce additions on undercooling behavior and microstructure evolution of Sn-Cu-Ni solders [J]. Rare Metal Materials and Engineering, 2011, 40(s2): 25.
[3] 卢斌, 王娟辉, 栗慧, 朱华伟, 焦羡贺. 微量铈对Sn-0.7Cu-0.5Ni焊料合金组织与性能的影响 [J]. 中国稀土学报, 2007, 25(2): 217.Lu B, Wang J H, Li H, Zhu H W, Jiao X H. Effect of cerium on microstructure and properties of Sn-0.7Cu-0.5Ni lead-free solder alloy [J]. Journal of the Chinese Society of Rare Earths, 2007, 25(2): 217.
[4] 卢斌, 王娟辉, 栗慧, 朱华伟, 焦宪贺. 添加0.10%Ce对Sn-0.7Cu-0.5Ni焊料与Cu基板间界面IMC的影响 [J]. 中国有色金属学报, 2007, 17(3): 390.Lu B, Wang J H, Li H, Zhu H W, Jiao X H. Effect of 0.10% Ce on intermetallic compounds at Sn-0.7Cu-0.5Ni/Cu interface [J]. Chinese Journal of Nonferrous Metals, 2007, 17(3): 390.
[5] 陈海燕, 揭晓华, 张海燕, 郭黎. 添加0.05%(La+Ce)对SnXCuNi焊料与Cu基板间界面组织的影响 [J]. 材料工程, 2011(9): 29.Chen H Y, Jie X H, Zhang H Y, Guo L. Effects of adding 0.05%(La+Ce) on Intermetallic compounds at Sn-X-Cu-Ni/Cu interface [J]. Journal of Materials Engineering, 2011(9): 29.
[6] 唐坤, 闫焉服, 郭晓晓, 赵快乐, 盛阳阳. 微量Ag对Sn0.7Cu力学性能影响 [J]. 河南科技大学学报: 自然科学版, 2010, 31(3): 4.Tang K, Yan Y F, Guo X X, Zhao K L, Sheng Y Y. Effect of trace Ag on mechanical properties of Sn0.7Cu [J]. Journal of Henan University of Science and Technology: Natural Science, 2010, 31(3): 4.
[7] 王瑾. 微量Ni, Ge元素改善Sn-0.7Cu无铅合金焊料性能的机理研究 [J]. 印制电路信息, 2009, (s1): 324.Wang J. The mechanism study of Sn-0.7Cu lead-free solders properties modified by Ni、 Ge microelements [J]. Printed Circuit Information, 2009, (s1): 324.
[8] Nogita K. Stabilisation of CuSn by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys [J]. Intermetallics, 2010, 18(1): 145.
[9] El-Daly A A, Hammad A E. Development of high strength Sn–0.7Cu solders with the addition of small amount of Ag and In [J]. J. Alloys Compd., 2011, 509(34): 8554.
[10] 李广东, 郝虎, 史耀武, 夏志东, 雷永平. 微量元素对Sn-0.7Cu无铅钎料抗氧化性能的影响 [J]. 电子元件与材料, 2007, 26(11): 49.Li G D, Hao H, Shi Y W, Xia Z D, Lei Y P. Effect of the microelements on the oxidation-resistance of Sn-0.7Cu lead-free solder [J]. Electronic Components and Materials, 2007, 26(11): 49.
[11] 张宇航, 高瑞军, 孙福林, 韩振峰, 潘凯华, 钟茂山. Ce元素添加量对Sn-Zn-Cu无铅合金焊料的焊接组织和性能的影响 [J]. 材料研究与应用, 2014, 8(1): 35.Zhang Y H, Gao R J, Sun F L, Han Z F, Pan K H, Zhong M S. Effect of Ce on microstructure and properties of Sn-ZnCu lead-free solder alloy [J]. Materials Research and Application, 2014, 8(1): 35.
[12] 韩运侠, 张柯柯. 稀土元素对Sn-0.2Ag-0.7Cu钎料合金物理性能的影响 [J]. 电子元件与材料, 2008, 27(2): 42.Han Y X, Zhang K K. Effect of RE physical properties of Sn-0.2Ag-0.7Cu solder alloy [J]. Electronic Components and Materials, 2008, 27(2): 42.
[13] 周公度, 段连运主编. 结构化学基础 (第3版) [M]. 北京: 北京大学出版社, 2002.Zhou G D, Duan L Y. Structural Chemistry Foundation (3rd Edition) [M]. Beijing: Peking University Press, 2002.
[14] 薛松柏, 钱乙余, 赵振清, 董健. 银基钎料中铈与杂质元素铅、 铋作用机制 [J]. 中国稀土学报, 2002, 20(5): 436.Xue S B, Q Y Y, Zhao Z Q, Dong J. Mechanism of interaction relation between rare earth element cerium and impurity elements lead and bismuth in Ag-based filler metal [J]. Journal of the Chinese Society of Rare Earths, 2002, 20(5): 436.
[15] 沈艳兰, 顾小龙, 徐时清, 金霞. Ce的添加对SnAgCu系钎料组织和性能的影响 [J]. 中国计量大学学报, 2011, 22(2): 194.Shen Y L, Gu X L, Xu S Q, Jin X. Influence of rare earth element cerium on the structure and properties of SnAgCu solders [J]. Journal of China University of Metrology, 2011, 22(2): 194.
[16] 栗慧, 卢斌, 王娟辉. 微量Ce对SnAgCu焊料与铜基界面IMC的影响 [J]. 电子元件与材料, 2009, 28(4): 40.Li H, Lu B, Wang J H. Effect of microamount Ce on the interfacial IMC between SnAgCu solder and Cu substrate [J]. Electronic Components and Materials, 2009, 28(4): 40.
[17] 栗慧, 卢斌, 王娟辉. 微量稀土元素对Sn3.0Ag0.5Cu无铅焊料合金组织与性能的影响 [J]. 热加工工艺, 2011, 40(9): 31.Li H, Lu B, Wang J H. Effect of rare earth on microstructure and properties of Sn_3Ag_(0.5)Cu lead-free solder alloy [J]. Hot Working Technology, 2011, 40(9): 31.