Ti230合金电阻点焊接头组织与显微硬度研究
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摘要
对0.7 mm厚的Ti230合金板电阻点焊接头的组织及显微硬度进行了研究。结果表明:Ti230板材焊接过程中易发生结合线伸入,并且结合线伸入附近同时存在裂纹,结合线伸入产生的原因是焊接参数选择不合理。通过改变试验参数,即增加压力,减小热量输出可以明显改善结合线伸入现象;Ti230合金的组织为等轴状α基体+金属间化合物Ti2Cu粒子,焊缝处组织为铸态组织,Cu元素完全固溶到基体;焊缝处的显微硬度明显高于基体的显微硬度,可能是由于焊接后未进行热处理,存在较大焊接应力,且Cu元素在基体中较高的固溶度。
The microstructure and microhardness of 0.7 mm thick Ti230 alloy plate resistance spot welding joint were studied. The results show that the junction line entering phenomenon is easy to occur during the welding process of Ti230 plate, and it has cracks nearby the junction line. The reason for junction line entering phenomenon is unsuitable welding parameters. By changing the welding parameters such as increasing pressure, reducing heat output can obviously improve the junction line entering phenomenon. The microstructure of Ti230 alloy is equiaxed α matrix and intermetallic compound Ti2 Cu particles. The weld microstructure is cast structure and the Cu element is dissolved into the matrix. The microhardness of the weld is significantly higher than that of the matrix, which may be due to great welding stress caused by no heat treatment after welding and high solid solubility of Cu elements in matrix.
The microstructure and microhardness of 0.7 mm thick Ti230 alloy plate resistance spot welding joint were studied. The results show that the junction line entering phenomenon is easy to occur during the welding process of Ti230 plate, and it has cracks nearby the junction line. The reason for junction line entering phenomenon is unsuitable welding parameters. By changing the welding parameters such as increasing pressure, reducing heat output can obviously improve the junction line entering phenomenon. The microstructure of Ti230 alloy is equiaxed α matrix and intermetallic compound Ti2 Cu particles. The weld microstructure is cast structure and the Cu element is dissolved into the matrix. The microhardness of the weld is significantly higher than that of the matrix, which may be due to great welding stress caused by no heat treatment after welding and high solid solubility of Cu elements in matrix.
引文
[1]马鸿海,冯军宁.热处理工艺对Ti230合金薄板组织和性能的影响[J].稀有金属快报,2007,26(11):27-30.
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[4]程东海,周叶平,陈益平,等.电阻焊接头的结合线伸入研究[J].焊接生产应用,2011(7):46-49.
[5]何文,陈益平,朱富强.影响高温合金电阻缝焊结合线伸入的若干因素及对策[J].第十五次全国焊接学术会议论文集.2010.
[2]赵熹华.压力焊[M].北京:机械工业出版社,2003.
[3]郭瑞鹏,杨战利,李远.电阻焊在工业生产中的应用及发展现状[J].机械制造文摘-焊接分册,2015(1):35-38.
[4]程东海,周叶平,陈益平,等.电阻焊接头的结合线伸入研究[J].焊接生产应用,2011(7):46-49.
[5]何文,陈益平,朱富强.影响高温合金电阻缝焊结合线伸入的若干因素及对策[J].第十五次全国焊接学术会议论文集.2010.