基于约束电解的不锈钢表面微凹坑阵列加工技术研究
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摘要
利用约束电解微加工技术在不锈钢表面上加工出微凹坑阵列图案。首先对影响凝胶弹性模量的因素进行了分析,制备了具有纳米级孔隙的高强度聚丙烯酰胺凝胶模板,随后使用优化的聚丙烯酰胺凝胶模板在不锈钢表面进行约束电解刻蚀加工。实验结果显示:在不锈钢表面上加工出的微凹坑直径在212μm左右,与母模板上的微凹坑相比,误差仅为6%,取得了良好的加工效果。
In this paper,micropits array patterns are fabricated on stainless steel surface by using confined electrochemical micromachining technology. Factors affecting the elastic modulus of gel were analyzed,and high strength polyacrylamide gel template with nanoscale pores was prepared firstly. Then,confined electrochemical etching was carried out on stainless steel surface by using optimized polyacrylamide gel template. The experimental results show that the diameter of micropits machined on the stainless steel surface is about 212 μm,and the relative error is only 6% prepared with the micropits on the mould,and good processing effect is achieved.
In this paper,micropits array patterns are fabricated on stainless steel surface by using confined electrochemical micromachining technology. Factors affecting the elastic modulus of gel were analyzed,and high strength polyacrylamide gel template with nanoscale pores was prepared firstly. Then,confined electrochemical etching was carried out on stainless steel surface by using optimized polyacrylamide gel template. The experimental results show that the diameter of micropits machined on the stainless steel surface is about 212 μm,and the relative error is only 6% prepared with the micropits on the mould,and good processing effect is achieved.
引文
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[2]陈宝钦.微光刻与微纳米加工技术[J].微纳电子技术,2011,48(1):1-5.
[3]朱荻,王明环,明平美,等.微细电化学加工技术[J].纳米技术与精密工程,2005,3(2):151-155.
[4]Landolt D,Chauvy P F,Zinger O. Electrochemical micromachining,polishing and surface structuring of metals:fundamental aspects and new developments[J]. Electrochimica Acta,2003,48(20):3185-3201.
[5]Zhu D,Qu N S,Li H S,et al. Electrochemical micromachining of microstructures of micro hole and dimple array[J]. CIRP Annals-Manufacturing Technology,2009,58(1):177-180.
[6]杜海涛,曲宁松,李寒松,等.电解转印法加工凹坑阵列结构实验研究[J].机械工程学报,2010,46(3):172-178.
[7] Grzybowski B A,Bishop K J M. Micro and nanoprinting into solids using reaction-diffusion etching and hydrogel stamps[J]. Small,2009,5(1):22-29.
[8]Zhang L,Zhuang J L,Ma X Z,et al. Microstructuring of p-Si(100)by localized electrochemical polishing using patterned agarose as a stamp[J]. Electrochemistry Communications,2007,9(10):2529-2533.
[9]张朝阳,朱荻,王明环,等.超短脉冲电流微细电解加工技术研究[J].中国机械工程,2005,16(14):1295-1298.