摘要
在导光板模具钢上加工的微结构阵列的精度决定导光板的质量。在精密撞点机上加工导光板模具的过程中,需对加工的微结构阵列在位检测,因导光板模具取下再放回机床时加工条件已发生改变,后续撞点加工已无任何意义。通过Halcon研究的精密撞点机在位检测系统可以高精度的检测微结构阵列直径和圆心距,在检测系统设计中采用了阈值分割、圆孔填充、开运算等算子和运用了亚像素边缘提取和最小二乘法拟合圆等理论。通过高精度的白光干涉仪和设计的检测系统分别对相同的微结构阵列进行检测,通过检测数据对比验证了测量系统满足设计要求。
The quality of the light guide plate is determined by the accuracy of the microstructure array processed on the light guide plate mold steel. In the process of precision hitting machine processing light guide plate mold,the processing of the microstructure of the array is in-situ measurement,if the light guide plate mold was removed and then back to the machine,the processing conditions had changed,there was no meaning hitting the follow-up points. The aperture measurement and aperture distance of the microstructure array can be measured with high precision by the research of Halcon. The algorithm of threshold segmentation,holes filling and opening circle were used in the measurement system design,and the sub-pixel edge extraction and least squares fitting circle method were also usd. The high precision white light interferometer and the designed detection system respectively measure the same microstructure array,by comparing the data,it is verified that the measurement system meets the design requirements.
引文
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