表面镀钨金刚石/铜复合材料的有限元模拟
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摘要
利用有限元分析软件ANSYS,对表面镀钨金刚石/铜复合材料进行了数值模拟,研究了金刚石体积分数、金刚石粒径及镀层厚度对表面镀钨金刚石/铜复合材料导热系数和热膨胀系数的影响。结果表明:随着金刚石体积分数的增加、金刚石粒径的增大、镀层厚度的减小,复合材料的导热系数呈现出增加的趋势,与文献数据的变化趋势相符,热膨胀系数受金刚石体积分数影响最大,金刚石粒径选在150～200μm较为合适。
The tungsten-coated diamond/copper composites were simulated by the finite element analysis software ANSYS in this paper. The effects of diamond volume fraction, diamond particle size, and tungsten coating thickness on the thermal conductivity and thermal expansion coefficient of the diamond/copper composites were investigated. The results show that, the thermal conductivity of the composites increases as the increase of the diamond volume fraction and diamond particle size and as the decrease in the coating thickness of tungsten. The thermal expansion coefficient is mainly controlled by the volume fraction of diamond. The simulation results fit the literature data very well. The simulation results also indicate that the diamond particle size in 150～200 μm is optimal.
The tungsten-coated diamond/copper composites were simulated by the finite element analysis software ANSYS in this paper. The effects of diamond volume fraction, diamond particle size, and tungsten coating thickness on the thermal conductivity and thermal expansion coefficient of the diamond/copper composites were investigated. The results show that, the thermal conductivity of the composites increases as the increase of the diamond volume fraction and diamond particle size and as the decrease in the coating thickness of tungsten. The thermal expansion coefficient is mainly controlled by the volume fraction of diamond. The simulation results fit the literature data very well. The simulation results also indicate that the diamond particle size in 150～200 μm is optimal.
引文
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[5]Ma S D,Zhao N Q,Shi C S,et al.Mo2C coating on diamond:Different effects on thermal conductivity of diamond/Al and diamond/Cu composites.Appl Surf Sci,2017,402:372
[6]Tang M Q,Huang M,Luo X Y.Research of diamond titanium coating.Powder Metall Ind,2006,16(2):15(唐明强,黄漫,罗锡裕.金刚石镀钛层的研究.粉末冶金工业,2006,16(2):15)
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[9]Chu K,Jia C C,Guo H,et al.On the thermal conductivity of Cu-Zr/diamond composites.Mater Des,2013,45(45):36
[10]Bai G Z,Li N,Wang X T,et al.High thermal conductivity of Cu-B/diamond composites prepared by gas pressure infiltration.J Alloys Compd,2018,735:1648
[11]Yoshida K,Morigami H.Thermal properties of diamond/copper composite material.Microelectron Reliab,2004,44(2):303
[12]Hong Q N,Reng S B,Cheng Z B,et al.Effects of Co on properties of diamond/Cu composites by infiltration.Powder Metall Technol,2015,33(1):49(洪庆楠,任淑彬,陈志宝,等.Co对熔渗法制备金刚石/Cu复合材料性能的影响.粉末冶金技术,2015,33(1):49)
[13]Zhang C,Cai Z Y,Tang Y G,et al.Microstructure and thermal behavior of diamond/Cu composites:Effects of surface modification.Diamond Relat Mater,2018,86:98
[14]Zhang Y J.Simulation Research on Thermal Conductivity of Diamond/Cu Composites for Electronic Packaging[Dissertation].Nanchang:Nanchang Hangkong University,2017(张永杰.电子封装用金刚石/铜复合材料导热性能的数值模拟研究[学位论文].南昌:南昌航空大学,2017)
[15]Flaque J,Rios A,Martin-Meizoso A,et al.Effect of diamond shapes and associated thermal boundary resistance on thermal conductivity of diamond-based composites.Comput Mater Sci,2007,41(2):156
[16]Rape A,Gott K,Kulkarni A,et al.Simulation of matrix conductivity in copper-diamond composites sintered by field assisted sintering technology.Comput Mater Sci,2015,110:29
[17]Yang W L,Peng K,Zhou L P,et al.Finite element simulation and experimental investigation on thermal conductivity of diamond/aluminium composites with imperfect interface.Comput Mater Sci,2014,83:375
[18]Abyzov A M,Kidalov S V,Shakhov F M.High thermal conductivity composites consisting of diamond filler with tungsten coating and copper(silver)matrix.J Mater Sci,2010,46(5):1424
[19]Ma C A.Preparation,Characterization and Electrochemial Properties of Catalytic of High Activity Tungsthn Carbide[Dissertation].Shanghai:Shanghai University,2005(马淳安.高活性碳化钨催化材料的制备、表征及电化学性能研究[学位论文].上海:上海大学,2005)
[20]Wang L H,Li J W,Che Z F,et al.Combining Cr pre-coating and Cr alloying to improve the thermal conductivity of diamond particles reinforced Cu matrix composites.J Alloys Compd,2018,749:1098
[21]Huang X,Xu Y J,Yi X,et al.Effect of particle size,grade and coating thickness of diamond coated with chromium film on thermal properties of diamond/Cu composite.Powder Metall Ind,2018,28(3):53(黄霞,徐燕军,尹翔,等.镀铬金刚石粒度、品级和膜厚对金刚石/铜复合材料热物性能的影响.粉末冶金工业,2018,28(3):53)
[22]Zhang C,Wang R C,Cai Z Y,et al.Low-temperature densification of diamond/Cu composite prepared from dual-layer coated diamond particles.J Mater Sci Mater Electron,2015,26(1):185
[2]Hanada K,Matsuzaki K,Sano T.Thermal properties of diamond particle-dispersed Cu composites.J Mater Process Technol,2004,153-154(22):514
[3]Zhang C,Wang R C,Peng C Q,et al.Effects of tungsten coating layer on thermal conductivity of diamond-copper composites.Rare Met Mater Eng,2016,45(10):2692(张纯,王日初,彭超群,等.表面镀钨层对金刚石/铜复合材料导热系数的影响.稀有金属材料与工程,2016,45(10):2692)
[4]Zain-ul-abdein M,Raza K,Khalid F A,et al.Numerical investigation of the effect of interfacial thermal resistance upon the thermal conductivity of copper/diamond composites.Mater Des,2015,86:248
[5]Ma S D,Zhao N Q,Shi C S,et al.Mo2C coating on diamond:Different effects on thermal conductivity of diamond/Al and diamond/Cu composites.Appl Surf Sci,2017,402:372
[6]Tang M Q,Huang M,Luo X Y.Research of diamond titanium coating.Powder Metall Ind,2006,16(2):15(唐明强,黄漫,罗锡裕.金刚石镀钛层的研究.粉末冶金工业,2006,16(2):15)
[7]Ma H B,Bai H,Xue C,et al.Research on preparation and properties of boron-coated diamond?metal matrix composite.Cemented Carbide,2017,34(5):314(马洪兵,白华,薛晨,等.镀硼金刚石?金属基复合材料的制备及其性能研究.硬质合金,2017,34(5):314)
[8]Ren X T,Dong Y H,Zhang R Q,et al.Effect of salt bath plating temperature on microstructure and properties of diamond-Cr/Cu composites.Trans Mater Heat Treat,2017,38(1):1(任学堂,董应虎,张瑞卿,等.盐浴镀覆温度对diamond-Cr/Cu复合材料组织性能的影响.材料热处理学报,2017,38(1):1)
[9]Chu K,Jia C C,Guo H,et al.On the thermal conductivity of Cu-Zr/diamond composites.Mater Des,2013,45(45):36
[10]Bai G Z,Li N,Wang X T,et al.High thermal conductivity of Cu-B/diamond composites prepared by gas pressure infiltration.J Alloys Compd,2018,735:1648
[11]Yoshida K,Morigami H.Thermal properties of diamond/copper composite material.Microelectron Reliab,2004,44(2):303
[12]Hong Q N,Reng S B,Cheng Z B,et al.Effects of Co on properties of diamond/Cu composites by infiltration.Powder Metall Technol,2015,33(1):49(洪庆楠,任淑彬,陈志宝,等.Co对熔渗法制备金刚石/Cu复合材料性能的影响.粉末冶金技术,2015,33(1):49)
[13]Zhang C,Cai Z Y,Tang Y G,et al.Microstructure and thermal behavior of diamond/Cu composites:Effects of surface modification.Diamond Relat Mater,2018,86:98
[14]Zhang Y J.Simulation Research on Thermal Conductivity of Diamond/Cu Composites for Electronic Packaging[Dissertation].Nanchang:Nanchang Hangkong University,2017(张永杰.电子封装用金刚石/铜复合材料导热性能的数值模拟研究[学位论文].南昌:南昌航空大学,2017)
[15]Flaque J,Rios A,Martin-Meizoso A,et al.Effect of diamond shapes and associated thermal boundary resistance on thermal conductivity of diamond-based composites.Comput Mater Sci,2007,41(2):156
[16]Rape A,Gott K,Kulkarni A,et al.Simulation of matrix conductivity in copper-diamond composites sintered by field assisted sintering technology.Comput Mater Sci,2015,110:29
[17]Yang W L,Peng K,Zhou L P,et al.Finite element simulation and experimental investigation on thermal conductivity of diamond/aluminium composites with imperfect interface.Comput Mater Sci,2014,83:375
[18]Abyzov A M,Kidalov S V,Shakhov F M.High thermal conductivity composites consisting of diamond filler with tungsten coating and copper(silver)matrix.J Mater Sci,2010,46(5):1424
[19]Ma C A.Preparation,Characterization and Electrochemial Properties of Catalytic of High Activity Tungsthn Carbide[Dissertation].Shanghai:Shanghai University,2005(马淳安.高活性碳化钨催化材料的制备、表征及电化学性能研究[学位论文].上海:上海大学,2005)
[20]Wang L H,Li J W,Che Z F,et al.Combining Cr pre-coating and Cr alloying to improve the thermal conductivity of diamond particles reinforced Cu matrix composites.J Alloys Compd,2018,749:1098
[21]Huang X,Xu Y J,Yi X,et al.Effect of particle size,grade and coating thickness of diamond coated with chromium film on thermal properties of diamond/Cu composite.Powder Metall Ind,2018,28(3):53(黄霞,徐燕军,尹翔,等.镀铬金刚石粒度、品级和膜厚对金刚石/铜复合材料热物性能的影响.粉末冶金工业,2018,28(3):53)
[22]Zhang C,Wang R C,Cai Z Y,et al.Low-temperature densification of diamond/Cu composite prepared from dual-layer coated diamond particles.J Mater Sci Mater Electron,2015,26(1):185