振动载荷下面向电子设备PHM的板级封装潜在故障分析方法
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摘要
面向电子设备故障预测与健康管理(Prognostics and Health Management,PHM),基于自适应谱峭度与核概率距离聚类提出一种振动载荷下板级封装潜在故障特征提取与模式辨识方法.首先,基于最大谱峭度原则利用经验模态分解的方法对电子组件的应变响应数据进行滤波,计算并重构包含潜在故障信息的包络谱形成故障征兆向量;其次,应用高斯径向基核函数概率距离方法,将非线性故障征兆数据映射到高维Hilbert空间,对其进行聚类分析形成表征板级封装健康状态与各故障模式的类中心;最后,根据实时监测的板级封装的包络谱数据计算与各中心的概率距离,判断其所属的状态从而实现对封装故障模式的早期辨识.通过试验分析,该方法可以有效辨识与预测板级封装即将发生的故障模式,为实现电子设备PHM提供了一种新式的思路与手段.
A pre-failure feature extraction and modes classification method of board-level package subjected to vibration loading is presented for prognostics and health management of electronics using adaptive spectrum kurtosis and kernel probability distance clustering. Firstly strain response data of electronic components is filtered by empirical mode decomposition method based on maximum spectrum kurtosis,and fault symptom vector is developed by computing and reconstructing the envelope spectrum which contains potential fault information. Secondly nonlinear fault symptom data is mapped and clustered in sparse Hilbert space based on Gaussian radical basis kernel probability distance method. Several cluster centers are formed with the characterizations of the board-level package health state and various failure modes. Finally the current state of board-level package is estimated on basis of its envelope spectrum by computing its probability distance,and the forthcoming failure mode is identified before it happen. The experimental analysis demonstrate the method can recognize and predict the upcoming failure mode of board-level package effectively and serve as a newapproach to achieve PHMof electronics.
A pre-failure feature extraction and modes classification method of board-level package subjected to vibration loading is presented for prognostics and health management of electronics using adaptive spectrum kurtosis and kernel probability distance clustering. Firstly strain response data of electronic components is filtered by empirical mode decomposition method based on maximum spectrum kurtosis,and fault symptom vector is developed by computing and reconstructing the envelope spectrum which contains potential fault information. Secondly nonlinear fault symptom data is mapped and clustered in sparse Hilbert space based on Gaussian radical basis kernel probability distance method. Several cluster centers are formed with the characterizations of the board-level package health state and various failure modes. Finally the current state of board-level package is estimated on basis of its envelope spectrum by computing its probability distance,and the forthcoming failure mode is identified before it happen. The experimental analysis demonstrate the method can recognize and predict the upcoming failure mode of board-level package effectively and serve as a newapproach to achieve PHMof electronics.
引文
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[16]Lee J H,Seo J S.Application of spectral kurtosis to the detection of tip vortex cavitation noise in marine propeller[J].Mechanical Systems and Signal Processing,2013,40(1):222-236.
[17]Chen B,Yan Z,Chen W.Defect detection for wheel-bearings w ith time-spectral kurtosis and entropy[J].Entropy,2014,16(1):607-626.
[18]赵妍,李志民,李天云.一种基于谱峭度的异步电机故障诊断方法[J].电工技术学报,2014,29(5):189-196.Zhao Yan,Li Zhimin,Li Tianyun.A method for fault diagnosis of induction motors based on spectral kurtosis[J].Transactions of China Electrotechnical Society,2014,29(5):189-196.(in Chinese)
[19]丁康,黄志东,林慧斌.一种谱峭度和Morlet小波的滚动轴承微弱故障诊断方法[J].振动工程学报,2014,27(1):128-134.Ding Kang,Huang Zhi-dong,Lin Hui-bin.A w eak fault diagnosis method for rolling element bearings based on M orlet w avelet and spectral kurtosis[J].Journal of Vibration Engineering,2014,27(1):128-134.(in Chinese)
[20]Wong E H,Seah S K W,Selvanayagam C S,et al.Highspeed cyclic bend tests and board-level drop tests for evaluating the robustness of solder joints in printed circuit board assemblies[J].Journal of Electronic M aterials,2009,38(6):884-895.
[21]刘芳,孟光,赵玫,等.板级跌落碰撞下无铅焊点的靠性研究[J].电子学报,2007,35(11):2084-2086.Liu Fang,M eng Guang,Zhao Wen,et al.Researches of lead-free solder joint reliability under board-level drop impact[J].Acta Electronica Sinica,2007,35(11):2084-2086.(in Chinese)
[22]Huang N E,Shen Z,Long S R,et al.The empirical mode decomposition and the Hilbert spectrum for nonlinear and non-stationary time series analysis[A].Proceedings of the Royal Society A:M athematical,Physical&Engineering Sciences[C].London,England:The Society,1998,454.903-995.
[23]田中大,高宪文,李琨.基于EMD与LS-SVM的网络控制系统时延预测方法[J].电子学报,2014,42(5):868-873.Tian Zhong-da,Gao Xian-w en,Li Kun.Time-delay prediction method of netw orked control system based on EM D and LS-SVM[J].Acta Electronica Sinica,2014,42(5):868-873.(in Chinese)
[24]Israel A B,Iyigun C.Probabilistic D-clustering[J].Journal of Classification,2008,25(1):5-26.
[2]Rezvanizaniani S M,Liu Z,Chen Y,et al.Review and recent advances in battery health monitoring and prognostics technologies for electric vehicle(EV)safety and mobility[J].Journal of Power Sources,2014,256(1):110-124.
[3]Mosallam A,Medjaher K,Zerhouni N.Nonparametric time series modeling for industrial prognostics and health management[J].The International Journal of Advanced M anufacturing Technology,2013,69(5-8):1685-1699.
[4]Steinberg D S.Vibration Analysis for Electronic Equipment(3rd Edition)[R].New York:Wiley,2000.
[5]Zeng Z,Li X,Li M,et al.Analysis of power consumption on laser solder joints of electric connector[J].Chinese Journal of Electronics,2014,23(4):666-668.
[6]Hokka J,Mattila T T,Xu H,et al.Thermal cycling reliability of Sn-Ag-Cu solder interconnections—part 2:failure mechanisms[J].Journal of Electronic M aterials,2013,42(6):963-972.
[7]余慧,吴昊,陈更生,等.一种堆叠式3D IC的最小边界热分析方法[J].电子学报,2012,40(5):865-869.Yu Hui,Wu Hao,Chen Geng-sheng,et al.A minimal boundary thermal analysis method for stacked 3D IC[J].Acta Electronica Sinica,2012,40(5):865-869.(in Chinese)
[8]Wu M L.Vibration-induced fatigue life estimation of ball grid array packaging[J].Journal of M icromechanics and M icroengineering,2009,19(6):065005.
[9]Yeh C L,Lai Y S.Effects of solder alloy constitutive relationships on impact force responses of package-level solder joints under ball impact test[J].Journal of Electronic M aterials,2006,35(10):1892-1901.
[10]Hokka J,Mattila T T,Li J,et al.A novel impact test system for more efficient reliability testing[J].M icroelectronics Reliability,2010,50(8):1125-1133.
[11]Mirman B.Tools for stress analysis of microelectronic structures[J].Journal of Electronic Packaging,2000,122(3):280-282.
[12]Lall P,Gupta P,Goebel K.Decorrelated feature space and neural nets based framew ork for failure modes clustering in electronics subjected to mechanical shock[J].IEEE Transactions on Reliability,2012,61(4):884-899.
[13]Caers J F J,Wong E H,Seah S K W,et al.A study of crack propagation in Pb-free solder joints under drop impact[A].Proceedings of IEEE 58th Electronic Components and Technology Conference[C].USA:IEEE Press,2008.1166-1171.
[14]Wong E H,Seah S K W,Van Driel W D,et al.Advances in the drop-impact reliability of solder joints for mobile applications[J].M icroelectronics Reliability,2009,49(2):139-149.
[15]Antoni J.The spectral kurtosis:a useful tool for characterizing non-stationary signals[J].M echanical Systems and Signal Processing,2006,20(2):282-307.
[16]Lee J H,Seo J S.Application of spectral kurtosis to the detection of tip vortex cavitation noise in marine propeller[J].Mechanical Systems and Signal Processing,2013,40(1):222-236.
[17]Chen B,Yan Z,Chen W.Defect detection for wheel-bearings w ith time-spectral kurtosis and entropy[J].Entropy,2014,16(1):607-626.
[18]赵妍,李志民,李天云.一种基于谱峭度的异步电机故障诊断方法[J].电工技术学报,2014,29(5):189-196.Zhao Yan,Li Zhimin,Li Tianyun.A method for fault diagnosis of induction motors based on spectral kurtosis[J].Transactions of China Electrotechnical Society,2014,29(5):189-196.(in Chinese)
[19]丁康,黄志东,林慧斌.一种谱峭度和Morlet小波的滚动轴承微弱故障诊断方法[J].振动工程学报,2014,27(1):128-134.Ding Kang,Huang Zhi-dong,Lin Hui-bin.A w eak fault diagnosis method for rolling element bearings based on M orlet w avelet and spectral kurtosis[J].Journal of Vibration Engineering,2014,27(1):128-134.(in Chinese)
[20]Wong E H,Seah S K W,Selvanayagam C S,et al.Highspeed cyclic bend tests and board-level drop tests for evaluating the robustness of solder joints in printed circuit board assemblies[J].Journal of Electronic M aterials,2009,38(6):884-895.
[21]刘芳,孟光,赵玫,等.板级跌落碰撞下无铅焊点的靠性研究[J].电子学报,2007,35(11):2084-2086.Liu Fang,M eng Guang,Zhao Wen,et al.Researches of lead-free solder joint reliability under board-level drop impact[J].Acta Electronica Sinica,2007,35(11):2084-2086.(in Chinese)
[22]Huang N E,Shen Z,Long S R,et al.The empirical mode decomposition and the Hilbert spectrum for nonlinear and non-stationary time series analysis[A].Proceedings of the Royal Society A:M athematical,Physical&Engineering Sciences[C].London,England:The Society,1998,454.903-995.
[23]田中大,高宪文,李琨.基于EMD与LS-SVM的网络控制系统时延预测方法[J].电子学报,2014,42(5):868-873.Tian Zhong-da,Gao Xian-w en,Li Kun.Time-delay prediction method of netw orked control system based on EM D and LS-SVM[J].Acta Electronica Sinica,2014,42(5):868-873.(in Chinese)
[24]Israel A B,Iyigun C.Probabilistic D-clustering[J].Journal of Classification,2008,25(1):5-26.