磁控溅射银/铜双层膜的电性能和结合强度
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摘要
采用磁控溅射工艺在微波腔体耦合器内壁沉积了银/铜双层膜,并对该膜的电性能以及膜基结合强度等进行了研究。结果表明:采用磁控溅射法沉积的银/铜双层膜和基体的结合强度可达5.0 MPa;其中,内壁沉积有2μm银/2μm铜双层膜的耦合器的电性能最佳,耦合度为5.75~6.20dB,隔离度为31.02dB,端口驻波值为24.43dB,均达到了电镀的指标,插入损耗小于1.70dB,优于电镀的;该工艺用银量少,无污染,可替代电镀在微波器件表面沉积功能镀层。
Ag/Cu double-layer film was doposited on internal wall of coupled cavity by magnetron sputtering process,and the electrical performance of the film and the film-substrate adhesion strength were studied.The results show that the adhesion strength between the double film and the substrate up to 5.0MPa.The coupled cavity with2μm Cu/2μm Ag has the best eletrical performance,its coupling-degree was between 5.75 dB and 6.20 dB,isolation and port standing wave were 31.02 dB and 24.43 dB,respectively,these parameters were all up to the electroplating standard.Insertion losses of the coupled cavity was less than 1.70 dB,completely better than the electroplating standard.The process of low Ag coating costs and non-polluting could be used as an alternative method for the plating process.
Ag/Cu double-layer film was doposited on internal wall of coupled cavity by magnetron sputtering process,and the electrical performance of the film and the film-substrate adhesion strength were studied.The results show that the adhesion strength between the double film and the substrate up to 5.0MPa.The coupled cavity with2μm Cu/2μm Ag has the best eletrical performance,its coupling-degree was between 5.75 dB and 6.20 dB,isolation and port standing wave were 31.02 dB and 24.43 dB,respectively,these parameters were all up to the electroplating standard.Insertion losses of the coupled cavity was less than 1.70 dB,completely better than the electroplating standard.The process of low Ag coating costs and non-polluting could be used as an alternative method for the plating process.
引文
[1]HASHIMOTO S,HIRANO T O.Development of coating materials of high conductivity Ag layer for electroplating technologies[C]//MRS Proceedings.[S.l.]:Materials Research Society,2012:195-200.
[2]高晓明,孙嘉奕,胡明,等.低温沉积银和银铜膜的耐原子氧性能[J].机械工程材料,2013,37(11):55-59.
[3]陈步明,郭忠诚.化学镀研究现状及发展趋势[J].电镀与精饰,2011,33(11):11-15.
[4]PARLIAMENT E U,COUNCIL E U.Directive 2002/95/EC on the restriction of the use of certain hazardous substances in electrical and electronic equipment[J].Official J Eur Union,2003,46:19-23.
[5]刘仁志.波导产品银镀层厚度的确定[J].电镀与精饰,2006,28(3):31-34.
[6]HIRAOKA T,TOKUMTTSU T,AIKAWA M.Very small wide-band MMIC magic T′s using microstrip lines on a thin dielectric film[J].IEEE Transactions on Microwave Theory and Techniques,1989,37(10):1569-1575.
[7]梁昌举.多层金属镀膜导波结构传输特性的研究[D].西安:西安电子科技大学,2010:22-23.
[8]马远远.铁氧体陶瓷无害金属化技术的研究[D].杭州:浙江大学,2008:26-28.
[9]王德苗,岑嘉宝.钛酸钡基PTC陶瓷溅射金属化研究[J].真空,2010(2):78-80.
[10]BRAUN R,LANGE A,HOVSEPIAN P.Oxidation behaviour of TiAlYN/CrN and CrAlYN/CrN nanoscale multilayer coatings with Al2O3topcoat deposited on gammaTiAl alloys[J].Materials at High Temperatures,2011,28(4):324-335.
[11]沈小虎,王德苗.铁氧体表面耐高温Ni-V/Ag复合金属化薄膜的研究[J].真空科学与技术学报,2013,34(3):266-271.
[12]LUNDIN D,SARAKINOS K.An introduction to thin film processing using high-power impulse magnetron sputtering[J].Journal of Materials Research,2012,27(5):780-792.
[13]孙向明.微量Ag对无氧铜性能的影响[J].机械工程材料,2002,26(2):31-34.
[14]胡如南,张立茗.我国电镀工艺环保现状及其发展建议[J].材料保护,2000,33(1):46-50.
[15]陈志良,赵述华,周建民,等.典型电镀污染场地重金属污染特征与生态风险评价[J].环境污染与防治,2013,35(10):1-4,11.
[2]高晓明,孙嘉奕,胡明,等.低温沉积银和银铜膜的耐原子氧性能[J].机械工程材料,2013,37(11):55-59.
[3]陈步明,郭忠诚.化学镀研究现状及发展趋势[J].电镀与精饰,2011,33(11):11-15.
[4]PARLIAMENT E U,COUNCIL E U.Directive 2002/95/EC on the restriction of the use of certain hazardous substances in electrical and electronic equipment[J].Official J Eur Union,2003,46:19-23.
[5]刘仁志.波导产品银镀层厚度的确定[J].电镀与精饰,2006,28(3):31-34.
[6]HIRAOKA T,TOKUMTTSU T,AIKAWA M.Very small wide-band MMIC magic T′s using microstrip lines on a thin dielectric film[J].IEEE Transactions on Microwave Theory and Techniques,1989,37(10):1569-1575.
[7]梁昌举.多层金属镀膜导波结构传输特性的研究[D].西安:西安电子科技大学,2010:22-23.
[8]马远远.铁氧体陶瓷无害金属化技术的研究[D].杭州:浙江大学,2008:26-28.
[9]王德苗,岑嘉宝.钛酸钡基PTC陶瓷溅射金属化研究[J].真空,2010(2):78-80.
[10]BRAUN R,LANGE A,HOVSEPIAN P.Oxidation behaviour of TiAlYN/CrN and CrAlYN/CrN nanoscale multilayer coatings with Al2O3topcoat deposited on gammaTiAl alloys[J].Materials at High Temperatures,2011,28(4):324-335.
[11]沈小虎,王德苗.铁氧体表面耐高温Ni-V/Ag复合金属化薄膜的研究[J].真空科学与技术学报,2013,34(3):266-271.
[12]LUNDIN D,SARAKINOS K.An introduction to thin film processing using high-power impulse magnetron sputtering[J].Journal of Materials Research,2012,27(5):780-792.
[13]孙向明.微量Ag对无氧铜性能的影响[J].机械工程材料,2002,26(2):31-34.
[14]胡如南,张立茗.我国电镀工艺环保现状及其发展建议[J].材料保护,2000,33(1):46-50.
[15]陈志良,赵述华,周建民,等.典型电镀污染场地重金属污染特征与生态风险评价[J].环境污染与防治,2013,35(10):1-4,11.