摘要
针对芯片封装小型化和高密度组装的技术趋势和行业要求,文章介绍了南京国博电子有限公司新研发的一款2~6 GHz无源限幅器模块,采用4 mm×4 mm×1.5 mm金属陶瓷无引脚表贴(QFN)封装,可伐盖板平行缝焊工艺,气密结构,在10 us脉宽、10%占空比脉冲条件下,耐受100 W输入功率,限幅电平不超过15 d Bm,该产品具有体积小、重量轻、承受功率大、可靠性高、一致性好等特点。
With the trend of microchip packaging and high-density assembly technology and industry requirements,this paper introduces a new 2-6 GHz passive limiter module developed by Nanjing Guobo Co.,Ltd., which uses 4 mm×4 mm×1.5 mm metal ceramic quad flat non-leaded(QFN)package and airtight structure with parallel seam weldingtechnology. Under the condition of lous pulse width and 10% duty cycle pulse, the input power of 100 W is tolerated,and the limit level is no more than 15 d Bm. This product has the characteristics of small size, light weight, high affordable power, high reliability and good consistency.
引文
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