基于热场分析的LED日间行车灯优化设计
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摘要
针对LED日间行车灯的设计需求,提出通过热场仿真分析实现其热性能优化设计的方法。首先,根据LED日间行车灯的结构建立其有限元仿真模型,通过实验观测LED日间行车灯工作中的温度分布情况,并以实验观测结果验证仿真模型的有效性;然后,基于以上模型仿真分析日间行车灯的灯珠间距、铝基板厚度与LED灯珠结温之间的关系;以上述关系为约束条件,结合生产成本,得出在LED灯珠一定的情况下,灯珠间距为37 mm、铝基板厚度为1 mm的最优化设计方案,使LED日间行车灯能够可靠工作且成本更低。
A new method was presented to design the LED automotive light,such as the LED daytime running light( DRL) based on the thermal analysis. Firstly,a LED was modeling by COMSOL software. And an experiment was carried out to acquire the distribution of temperature on the surface of LED. The testing results show that the LED model is valid for the thermal analysis. Then based on the model,the relationships between LED junction temperature and the interval of LEDs,and thickness of MCPCB were discussed detailedly. Finally,considering the costs,the proposed design of the LED DRL is that the interval between LEDs is 37 mm and the thickness of MCPCB is 1 mm.
A new method was presented to design the LED automotive light,such as the LED daytime running light( DRL) based on the thermal analysis. Firstly,a LED was modeling by COMSOL software. And an experiment was carried out to acquire the distribution of temperature on the surface of LED. The testing results show that the LED model is valid for the thermal analysis. Then based on the model,the relationships between LED junction temperature and the interval of LEDs,and thickness of MCPCB were discussed detailedly. Finally,considering the costs,the proposed design of the LED DRL is that the interval between LEDs is 37 mm and the thickness of MCPCB is 1 mm.
引文
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[3]TSAI M Y,TANG C Y,WANG C H,et al..Investigation on some parameters affecting optical degradation of LED packages during high-temperature aging[J].IEEE Trans.Dev.Mater.Reliab.,2015,15(3):335-341.
[4]张建新,杨庆新,牛萍娟,等.LED板状肋片散热器性能的方向效应[J].发光学报,2015,36(7):846-853.ZHANG J X,YANG Q X,NIU P J,et al..Orientation effects on heat dissipation performance of plate-fin heat sink for LED application[J].Chin.J.Lumin.,2015,36(7):846-853.(in Chinese)
[5]XU K K.Electro-optical modulation processes in Si-PMOSFET LEDs operating in the avalanche light emission mode[J].IEEE Trans.Electron.Dev.,2014,61(6):2085-2092.
[6]YIN L Q,YANG L Q,XU G M,et al..Effects of die-attach materials on the optical durability and thermal performances of HP-LED[C].Proceedings of The 12th International Conference on Electronic Packaging Technology and High Density Packaging,Shanghai,2011:1-4.
[7]周驰,左敦稳,孙玉利.自然对流下LED集成芯片整体式热管散热器性能实验研究[J].发光学报,2014,35(11):1394-1400.ZHOU C,ZUO D W,SUN Y L.Experimental investigation of integrated heat pipe heat sink for multi-chip LED module in natural convection[J].Chin.J.Lumin.,2014,35(11):1394-1400.(in Chinese)
[8]KUMAR S K,WARN S C,LEE R.LED thermal management of an automotive electronic control module with display[C].Proceedings of The 14th IEEE Electronics Packaging Technology Conference,Singapore,2012:764-769.
[9]WANG J,ZHAO X J,CAI Y X,et al..Thermal model design and analysis of high-power LED headlamp cooling device based on the thermoelectric effect[J].IEEE Trans.Comp.,Packag.Manufact.Technol.,2015,5(5):641-649.
[10]https://scholar.google.com/citations?view_op=view_citation&hl=en&user=0m-BVq UAAAAJ&citation_for_view=0m-BVq UAAAAJ:M3NEmzRMIk IC[EB/OL].[2015-10-23]
[11]YOON S W,PARK H K,OH J H,et al..Full extraction of 2D photonic crystal assisted Y3Al5O12∶Ce ceramic plate phosphor for highly efficient white LEDs[J].IEEE Photon.J.,2014,6(1):230281.
[12]CHEN H T,CHOY W C H,HUI S Y.Characterization,modeling,and analysis of organic light-emitting diodes with different structures[J].IEEE Trans.Power Electron.,2016,31(1):581-592.
[13]HU S H,YU G Y,CEN Y C.Optimized thermal design of new reflex LED headlamp[J].Appl.Opt.,2012,51(22):5563-5566.
[14]CLARKE R,JACOB P,ERDOGAN O,et al..Thermal modeling of 3-D stacked DRAM over Si Ge HBT Bi CMOS CPU[J].IEEE Access,2015,3:43-54.
[15]LEE E K,VISWANATHAN H,POMPILI D.Model-based thermal anomaly detection in cloud datacenters[C].Proceedings of 2013 IEEE International Conference on Distributed Computing in Sensor Systems,Cambridge,2013:191-198.
[16]SHABANY Y.Heat Transfer:Thermal Management of Electronics[M].Boca Raton:CRC Press,2009.
[17]SURE A,SARMA K R,PARAMANANDAM K,et al..Thermal modeling of organic light-emitting diode display panels[J].J.Display Technol.,2015,11(12):1048-1055.
[18]陈军斌,杨悦.最优化方法[M]北京:中国石化出版社,2011.CHEN J B,YANG R.Method of Optimization[M].Beijing:China Petrochemical Press,2011.(in Chinese)
[19]CHEN R S,CHENG H E,HUANG C H,et al..Design of thermal dissipation for the array power LED by using the RSM with genetic algorithm[J].Model.Numer.Simul.Mater.Sci.,2013,3(1):12-26.
[20]MOLER C B.MATLAB数值计算[M].张志涌,译.北京:北京航空航天大学出版社,2015.MOLER C B.MATLAB Numerical Computation[M].ZHANG Z Y,transl.Beijing:Beijing University of Aeronautics and Astronautics Press,2015.(in Chinese)