电子工业中电沉积金镀层的应用与发展
|
摘要
金镀层具有良好的导电性、耐腐蚀性、稳定性等特点,在半导体、集成电路、电子元器件产品等方面具有重要的应用价值。随着电子产品零件表面镀金的重要性日益提升,国内外一直在提高镀金工艺技术的稳定性、镀层功能性方面进行了大量研究,而且在多种电子工业产品中的关键镀金技术研究方面开展的工作也越来越深入。从不同的角度综述了目前电子及相关行业中应用电镀金层及电镀金技术的情况,探讨了电镀金层及电镀金技术在电子工业领域的应用进展,分析了在不同基体材料表面沉积金层的技术(如制作薄膜基板的导带、线路板的接地通孔及上下层互连通孔、键合点、焊盘及空气桥等),介绍了镀金层的主要功能(如抗变色和抗化学腐蚀性能,低的接触电阻和导电性,高温下的抗氧化性能,贮存过程中的焊接性能,物理、机械性能等)。对电子行业现代化带动镀金技术的发展与需求,提出了开发和应用无氰镀金技术以及学科交叉对促进镀金技术发展的趋势,肯定了镀金技术对电子领域科技进步的贡献。
Due to good conductivity, corrosion resistance and good stability, gold plating is of important application value in semiconductors, integrated circuits, electronic component products, etc. As the importance of gold plating technology on electronic products increases, a lot of studies has been done both at home and abroad to improve stability of gold plating process and plating functionality. Moreover, more thorough work has been done to study gold plating technology in various electronic industry products. Application progress of gold plating and gold plating technology in the electronic and related industries was reviewed from different perspectives. The application of gold plating and plating technology in the field of electronic industry was discussed as well. Technologies of depositing gold plating on different substrates were analyzed(such as fabricating conduction band for thin film substrate, grounding through hole as well as upper and lower interconnected hole for circuit board, bonding points, bonding pads, air bridge, etc.). Main functions of the gold plating(resistance to discoloration and chemical corrosion, low electrical conductivity and contact resistance, high temperature oxidation resistance, welding properties after long-term storage, physical and mechanical properties, etc) were introduced. For the development and demand of promoting gold plating technologies being driven by electron industry modernization, it is proposed that development and application of cyanide-free gold plating technologies as well as subject crossing tend to promote development of gold plating technologies. In addition, con-tribution of gold plating technologies to technological progress in the field of electronics is affirmed.
Due to good conductivity, corrosion resistance and good stability, gold plating is of important application value in semiconductors, integrated circuits, electronic component products, etc. As the importance of gold plating technology on electronic products increases, a lot of studies has been done both at home and abroad to improve stability of gold plating process and plating functionality. Moreover, more thorough work has been done to study gold plating technology in various electronic industry products. Application progress of gold plating and gold plating technology in the electronic and related industries was reviewed from different perspectives. The application of gold plating and plating technology in the field of electronic industry was discussed as well. Technologies of depositing gold plating on different substrates were analyzed(such as fabricating conduction band for thin film substrate, grounding through hole as well as upper and lower interconnected hole for circuit board, bonding points, bonding pads, air bridge, etc.). Main functions of the gold plating(resistance to discoloration and chemical corrosion, low electrical conductivity and contact resistance, high temperature oxidation resistance, welding properties after long-term storage, physical and mechanical properties, etc) were introduced. For the development and demand of promoting gold plating technologies being driven by electron industry modernization, it is proposed that development and application of cyanide-free gold plating technologies as well as subject crossing tend to promote development of gold plating technologies. In addition, con-tribution of gold plating technologies to technological progress in the field of electronics is affirmed.
引文
[1]刘海萍,李宁,毕四富,等.无氰化学镀金技术的发展及展望[J].电镀与环保,2007,27(3):4-7.LIU Hai-ping,LI Ning,BI Si-fu,et al.Development and Prospect of Non-cyanide Electroless Gold Plating[J].Electroplating&Pollution Control,2007,27(3):4-7.
[2]杨维生.化学镀镍、金在印制电路板制造中的应用[J].化工新型材料,2002,30(2):24-26.YANG Wei-sheng.Application of Electroless Nickel and Immersion Gold in the Manufacturing of the Printed Circuit Board[J].New Chemical Materials,2002,30(2):24-26.
[3]邓清田,刘俊,王俊峰.印刷线路板中的选择性化学镍、金技术[J].电镀与涂饰,2003,22(5):27-29.DENG Qing-tian,LIU Jun,WANG Jun-feng.Technology of Selective Electroless Nickel Plating&Gold Immersion for Printed Circuit Board[J].EIectroplating&Finishing,2003,22(5):27-29.
[4]王川宝,王强栋,刘相伍.晶圆无氰电镀金厚度均匀性研究[J].世界有色金属,2016(4):173-175.WANG Chuan-bao,WANG Qiang-dong,LIU Xiangwu.Study on Thickness Uniformity of Cyanide Free Gold Plating on Wafer[J].World Nonferrous Metal,2016(4):173-175.
[5]刘兴宝,吴志勇,赵午云,等.高精度陶瓷镀金极杆的制造技术[J].机械设计与制造,2015(2):104-107.LIU Xing-bao,WU Zhi-yong,ZHAO Wu-yun,et al.The Manufacturing Technology of High Precision Ceramic Gilt Pole[J].Machinery Design&Manufacture,2015(2):104-107.
[6]何建新,李继红,张琳.某军用矩形电连接器镀金插孔表面发黑故障分析[J].表面技术,2013,42(3):94-96.HE Jian-xin,LI Ji-hong,ZHANG Lin.Failure Analysis of Certain Type Gold-plated Military Rectangular Electrical Connectors for Surface Discoloring[J].Surface Technology,2013,42(3):94-96.
[7]徐玉娟,宋路路,江洪涛.几种连接器局部镀金的保护方法[J].电镀与涂饰,2015,34(9):505-509.XU Yu-juan,SONG Lu-lu,JIANG Hong-tao.Protection Method for Gold Plating of Connectors[J].EIectroplating&Finishing,2015,34(9):505-509.
[8]WEISBERC,ALFRED M.Gold Plating[J].Metal Finishing,2012,110(9A):325-333.
[9]池建明,王丽娟.电连接器镀金工艺[J].电镀与涂饰,2002,21(5):34-36.CHI Jian-ming,WANG Li-juan.Gold Plating Process for Electric Coupler[J].EIectroplating&Finishing,2002,21(5):34-36.
[10]孙淼,徐加有.航空电连接器接触体局部镀金工艺研究[J].航空制造技术,2015(9):70-72.SUN Miao,XU Jia-you.Study of Selective Gold Plating on Aero Electrical Connector Contacts[J].Aeronautical Manufacturing Technology,2015(9):70-72.
[11]张波,匡加成,王良.不锈钢表面电镀金及真空镀氮化碳多层膜研究[J].电镀与精饰,2017,39(2):1-5.ZHANG Bo,KUANG Jia-cheng,WANG Liang.Electroplating of Gold and Vacuum Coating of Carbon Nitride on the Surface of Stainless Steel[J].Plating and Finishing,2017,39(2):1-5.
[12]CHEN Yi,LUO Jie,ZHONG Di-yuan,et al.Electroless Gold Plating on Printed Eircuit Board in Potassium Gold(I)Thiocyanate Bath[J].Electroplating and Finishing,2017,36(7):357-360.
[13]LIU Z W,WEST A C.Modeling of Galvanostatic Pulse and Pulsed Reverse Electroplating of Gold[J].Electrochimica Acta,2011,56:3328-3333.
[14]KIM D,KIM J,WANG G L,et al.Nucleation and Growth of Intermetallics and Gold Clusters on Thick Tin Layers in Electroplating Process[J].Mater Sci Eng A,2005,393:315-319.
[15]VRUBLEVSKAYA O N,VOROBEVA T N,VENGURA A V.Analysis of an Electrolyte for Gold Plating by Potentiometric Titration[J].Journal of Analytical Chemistry,2007,62(9):889-893.
[16]刘仁志.镀金与无氰镀金应用述评[J].电镀与精饰,2013,35(5):23-26.LIU Ren-zhi.Gold-plated and Cyanide-free Goldplating Application Review[J].Plating and Finishing,2013,35(5):23-26.
[17]OKINAKA Y,HOSHINO M.Some Recent Topics in Gold Plating for Electronics Applications[J].Gold Bulletin,1998,31(1):3-13.
[18]GREEN T A.Gold Electrodeposition for Microelectronic,Optoelectronic and Microsystem Applications[J].Gold Bulletin,2007,40(2):105-114.
[19]TETSUYA O,YUTAKA O.Development of New Electrolytic and Electroless Gold Plating Processes for Electronics Aapplications[J].Science and Technology of Advanced Materials,2006(7):425-437.
[20]黄剑贞,朱琼霞,叶泽鹏.无氰镀金技术的研究进展[J].广东化工,2016,43(10):141.HUANG Jian-zhen,ZHU Qiong-xia,YE Ze-peng.Research Progress of Cyanide-free Gold-plating[J].Guangdong Chem,2016,43(10):141.
[21]TSENG H C,CHEN J Y,CHOU J H.An Effective Device Design for Thermal Management of Multifinger In Ga P/Ga As Collector-up HBTs[J].International Journal of Numerical Modelling,2013,26(5):443-447.
[22]WANG Zhan-hua,SHEN Zhuo-shen,MU Dao-bin.Effects of Gold Plating on the Resistance to High Temperature Discoloration of the Cavity for Ceramic Packages[J].J Univ Sci Technol Beijing,2004,11(1):52-56.
[23]成映星,付明,张华云.铍青铜零件电镀金工艺改进[J].电镀与环保,2016,36(2):55-56.CHENG Ying-xing,FU Ming,ZHANG Hua-yun.Improvement of Electric Gilding Process for Beryllium Bronze Parts[J].Electroplating&Pollution Control,2016,36(2):55-56.
[24]PU S H,HOLMES A S,YEATMAN E M.Stress in Electroplated Gold on Silicon Substrates and Its Dependence on Cathode Agitation[J].Microelectronic Engineering,2013,112:21-26.
[25]王梦兰,贾法龙,张礼知.石英毛细管内壁镀金工艺的研究[J].表面技术,2015,44(2):8-13.WANG Meng-lan,JIA Fa-long,ZHANG Li-zhi.Study of Gold Deposition on the Inner Wall of Quartz Capillary[J].Surface Technology,2015,44(2):8-13.
[26]陈月华,江徳凤,刘永永.金属镀金外壳抗盐雾腐蚀工艺的改进[J].表面技术,2015,44(6):93-97.CHEN Yue-hua,JIANG De-feng,LIU Yong-yong.Improvement of Anti-spray-salt Corrosion Mechanism of Metal Shells[J].Surface Technology,2015,44(6):93-97.
[27]杨宇辰,李明初,董义.镀金印制板可焊性工艺试验研究[J].质量与可靠性,2016,18(1):20-22.YANG Yu-chen,LI Ming-chu,DONG Yi.Experimental Study on Solderability of Gold Plated Printed Circuit Board[J].Quality and Reliability,2016,18(1):20-22.
[28]任万滨,王鹏,马晓明,等.电连接器镀金铜触点材料微动磨损特性的实验研究[J].电工技术学报,2013,28(12):119-124.REN Wan-bin,WANG Peng,MA Xiao-ming,et al.Experimental Research on Fretting Wear Characteristics of Au-plated Copper Contacts Used in Electrical Connectors[J].Transactions of China Electrotechnical Society,2013,28(12):119-124.
[29]ITO M,UNO M,TAKEYA J.Low-resistance Contacts of Electroless Plated Metals with High-mobility Organic Semiconductors:Novel Organic Field Effect Transistors with Solution Processed Electrodes[J].Organic Electronics December,2015,27:53-58.
[30]刘云彦,李家峰,崔庆新,等.钼铜合金表面金镀层的制备及耐高温与焊接性能[J].材料保护,2017,50(3):47-50.LIU Yun-yan,LI Jia-feng,CUI Qing-xin,et al.Preparation of Gold Plating on Mo-Cu Alloy Surface and Evaluation of Its High-temperature Resistance and Welding Performance[J].Journal of Materials Protection,2017,50(3):47-50.
[31]GAUDION M.Nickel-Gold Plating of Copper PCB Traces and Signal Losses[J].Circuit World,2012,38(2):64-67.
[32]陆东梅,姚建铨,郑义,等.太赫兹波在金属镀层空芯圆波导中的传输特性[J].激光与红外,2007,37(12):1287-1289.LU Dong-mei,YAO Jian-quan,ZHENG Yi,et al.Transmission Characteristics of Hollow Metallic Filmcoated Circular Waveguide for THz Radiation[J].Laser&Infrared,2007,37(12):1287-1289.
[33]PU S H,HOLMES A S,YEATMAN E M.Stress in Electroplated Gold on Silicon Substrates and Its Dependence on Cathode Agitation[J].Microelectronic Engineering,2013,112:21-26.
[34]叶锦群,周定忠,张晃初.谈高频阶梯印制镀金插头线路板制作工艺[J].印制电路信息,2015(7):48-51.YE Jin-qun,ZHOU Ding-zhong,ZHANG Huang-chu.Discussion about Technology of High-frequency Step PCB with Gold Finger[J].Printed Circuit Information,2015(7):48-51.
[35]CHANG Le,ZHANG Zhi-jun,LI Yue,et al.60 GHz Air Substrate Leaky-wave Antenna Based on MEMS Micromachining Technology[J].IEEE Transactions on Components,Packaging and Manufacturing Technology,2016(11):1656-1662.
[36]CHANG Le,ZHANG Zhi-jun,LI Yue,et al.Air-filled Long Slot Leaky Wave Antenna Based on Folded Halfmode Waveguide Using Silicon Bulk Micromachining Technology for Millimeter-wave Band[J].IEEE Transactions on Antennas and Propagation,2017,65(7):3409-3418.
[37]GOSWAMI S A,KARIA D.Regular Paper:A Compact Monopole Antenna for Wireless Applications with Enhanced Bandwidth[J].International Journal of Electronics and Communications February,2017,72:33-39.
[38]SHARMA R K,KANERIYA R,PARGAIEN K C.Microwave Integrated Circuits Fabrication on Alumina Substrate Using Pattern up Direct Electroless Nickel and Immersion Au Plating and Study of Its Properties[J].Microelectronic Engineering,2013,108:45-49.
[39]PARVIZIAN M,RAHIMI-ASHTARI F,GOODARZI A,et al.Residual Stress Improvement of Platinum Thin Film in Au/Pt/Ti/p-Ga As Ohmic Contact by RF Sputtering Power[J].Applied Surface Science,2012,260:77-79.
[40]GEZERMAN A O,?ORBACIO?LU B D.Development of Alternative Environment Friendly Nickel and Gold Plating Baths[J].Surface Engineering,2015,31(9):641-649.
[41]张叶,吴剑,程熹.在硅橡胶表面无氰化学镀金研究[J].信息记录材料,2017,18(8):43-44.ZHANG Ye,WU Jian,CHENG Xi.Study on Cyanide Free Electroless Gold Plating on Silicone Rubber Surface[J].Information Recording Materials,2017,18(8):43-44.
[42]HUANG Ming-qi,LI Xian-tang,XIA Jian-wen,et al.A Conceivably Stable Non-cyanide Electroless Gold Plating for Electronic Packaging Application[J].Electronic Packaging Technology,2017(8):1173-1178.
[43]董振华,李德良,高林军,等.无氰沉金工艺的实践[J].电子工艺技术,2011,32(4):189-192.DONG Zhen-hua,LI De-liang,GAO Lin-jun,et al.New Cyanide-free Immersion Gold Process of PCB[J].Electronics Process Technology,2011,32(4):189-192.
[44]KICHIGIN V I,PETUKHOV I V,SHEVTSOV D I,et al.Electrodeposition of Coatings from Sulfite Goldplating Electrolyte and Their Properties[J].Russian Journal of Applied Chemistry,2015,88(12):1950.
[45]LI M,BAI Z,ZHANG F,et al.Red Shift of Side-polished Fiber Surface Plasmon Resonance Sensors with Silver Coating and Inhibition by Gold Plating[J].IEEE Photonics Journal,2017,9(3):1-13.
[46]MULLONI V,MARGESIN B,FARINELLI P,et al.Cycling Reliability of RF-MEMS Switches with GoldPlatinum Multilayers as Contact Material[J].Microsystem Technologies,2017,23(9):3843-3850.
[47]吴涛.脉冲镀金在半导体激光器中的应用及工艺优化[J].激光与红外,2015,45(6):631-634.WU Tao.Application and Process Optimization of Pulse Au-plating in Semiconductor Laser[J].Laser&Infrared,2015,45(6):631-634.
[48]LIN Kuan-ting,HSIEH Jian-yu,CHEN Yu-jen,et al.Gold Plating Carbon Nano Tube Antenna Integrated with Voltage Control Oscillator[J].Piers Proceedings,2013,65:1726-1729.
[49]姜丽,胡以俊,丛淑敏,等.支架用钴铬合金表面镀金对变异链球菌粘附的影响[J].北京口腔医学,2016,24(5):259-261.JIANG Li,HU Yi-jun,CONG Shu-min,et al.Effect of Gold-Plating Treatment of Co-Cr Alloy on Adhesion of Streptococcus Mutans[J].Beijing Journal of Stomatology,2016,24(5):259-261.
[50]刘东光,胡江华.细间距图形电路无氰化学镀金工艺研究[J].电子与封装,2013(5):31-33.LIU Dong-guang,HU Jiang-hua.Study of Cyanidefree Electroless Gold Plating for Patterned Circuits with Fine-pitch[J].Electronics and Packaging,2013(5):31-33.
[2]杨维生.化学镀镍、金在印制电路板制造中的应用[J].化工新型材料,2002,30(2):24-26.YANG Wei-sheng.Application of Electroless Nickel and Immersion Gold in the Manufacturing of the Printed Circuit Board[J].New Chemical Materials,2002,30(2):24-26.
[3]邓清田,刘俊,王俊峰.印刷线路板中的选择性化学镍、金技术[J].电镀与涂饰,2003,22(5):27-29.DENG Qing-tian,LIU Jun,WANG Jun-feng.Technology of Selective Electroless Nickel Plating&Gold Immersion for Printed Circuit Board[J].EIectroplating&Finishing,2003,22(5):27-29.
[4]王川宝,王强栋,刘相伍.晶圆无氰电镀金厚度均匀性研究[J].世界有色金属,2016(4):173-175.WANG Chuan-bao,WANG Qiang-dong,LIU Xiangwu.Study on Thickness Uniformity of Cyanide Free Gold Plating on Wafer[J].World Nonferrous Metal,2016(4):173-175.
[5]刘兴宝,吴志勇,赵午云,等.高精度陶瓷镀金极杆的制造技术[J].机械设计与制造,2015(2):104-107.LIU Xing-bao,WU Zhi-yong,ZHAO Wu-yun,et al.The Manufacturing Technology of High Precision Ceramic Gilt Pole[J].Machinery Design&Manufacture,2015(2):104-107.
[6]何建新,李继红,张琳.某军用矩形电连接器镀金插孔表面发黑故障分析[J].表面技术,2013,42(3):94-96.HE Jian-xin,LI Ji-hong,ZHANG Lin.Failure Analysis of Certain Type Gold-plated Military Rectangular Electrical Connectors for Surface Discoloring[J].Surface Technology,2013,42(3):94-96.
[7]徐玉娟,宋路路,江洪涛.几种连接器局部镀金的保护方法[J].电镀与涂饰,2015,34(9):505-509.XU Yu-juan,SONG Lu-lu,JIANG Hong-tao.Protection Method for Gold Plating of Connectors[J].EIectroplating&Finishing,2015,34(9):505-509.
[8]WEISBERC,ALFRED M.Gold Plating[J].Metal Finishing,2012,110(9A):325-333.
[9]池建明,王丽娟.电连接器镀金工艺[J].电镀与涂饰,2002,21(5):34-36.CHI Jian-ming,WANG Li-juan.Gold Plating Process for Electric Coupler[J].EIectroplating&Finishing,2002,21(5):34-36.
[10]孙淼,徐加有.航空电连接器接触体局部镀金工艺研究[J].航空制造技术,2015(9):70-72.SUN Miao,XU Jia-you.Study of Selective Gold Plating on Aero Electrical Connector Contacts[J].Aeronautical Manufacturing Technology,2015(9):70-72.
[11]张波,匡加成,王良.不锈钢表面电镀金及真空镀氮化碳多层膜研究[J].电镀与精饰,2017,39(2):1-5.ZHANG Bo,KUANG Jia-cheng,WANG Liang.Electroplating of Gold and Vacuum Coating of Carbon Nitride on the Surface of Stainless Steel[J].Plating and Finishing,2017,39(2):1-5.
[12]CHEN Yi,LUO Jie,ZHONG Di-yuan,et al.Electroless Gold Plating on Printed Eircuit Board in Potassium Gold(I)Thiocyanate Bath[J].Electroplating and Finishing,2017,36(7):357-360.
[13]LIU Z W,WEST A C.Modeling of Galvanostatic Pulse and Pulsed Reverse Electroplating of Gold[J].Electrochimica Acta,2011,56:3328-3333.
[14]KIM D,KIM J,WANG G L,et al.Nucleation and Growth of Intermetallics and Gold Clusters on Thick Tin Layers in Electroplating Process[J].Mater Sci Eng A,2005,393:315-319.
[15]VRUBLEVSKAYA O N,VOROBEVA T N,VENGURA A V.Analysis of an Electrolyte for Gold Plating by Potentiometric Titration[J].Journal of Analytical Chemistry,2007,62(9):889-893.
[16]刘仁志.镀金与无氰镀金应用述评[J].电镀与精饰,2013,35(5):23-26.LIU Ren-zhi.Gold-plated and Cyanide-free Goldplating Application Review[J].Plating and Finishing,2013,35(5):23-26.
[17]OKINAKA Y,HOSHINO M.Some Recent Topics in Gold Plating for Electronics Applications[J].Gold Bulletin,1998,31(1):3-13.
[18]GREEN T A.Gold Electrodeposition for Microelectronic,Optoelectronic and Microsystem Applications[J].Gold Bulletin,2007,40(2):105-114.
[19]TETSUYA O,YUTAKA O.Development of New Electrolytic and Electroless Gold Plating Processes for Electronics Aapplications[J].Science and Technology of Advanced Materials,2006(7):425-437.
[20]黄剑贞,朱琼霞,叶泽鹏.无氰镀金技术的研究进展[J].广东化工,2016,43(10):141.HUANG Jian-zhen,ZHU Qiong-xia,YE Ze-peng.Research Progress of Cyanide-free Gold-plating[J].Guangdong Chem,2016,43(10):141.
[21]TSENG H C,CHEN J Y,CHOU J H.An Effective Device Design for Thermal Management of Multifinger In Ga P/Ga As Collector-up HBTs[J].International Journal of Numerical Modelling,2013,26(5):443-447.
[22]WANG Zhan-hua,SHEN Zhuo-shen,MU Dao-bin.Effects of Gold Plating on the Resistance to High Temperature Discoloration of the Cavity for Ceramic Packages[J].J Univ Sci Technol Beijing,2004,11(1):52-56.
[23]成映星,付明,张华云.铍青铜零件电镀金工艺改进[J].电镀与环保,2016,36(2):55-56.CHENG Ying-xing,FU Ming,ZHANG Hua-yun.Improvement of Electric Gilding Process for Beryllium Bronze Parts[J].Electroplating&Pollution Control,2016,36(2):55-56.
[24]PU S H,HOLMES A S,YEATMAN E M.Stress in Electroplated Gold on Silicon Substrates and Its Dependence on Cathode Agitation[J].Microelectronic Engineering,2013,112:21-26.
[25]王梦兰,贾法龙,张礼知.石英毛细管内壁镀金工艺的研究[J].表面技术,2015,44(2):8-13.WANG Meng-lan,JIA Fa-long,ZHANG Li-zhi.Study of Gold Deposition on the Inner Wall of Quartz Capillary[J].Surface Technology,2015,44(2):8-13.
[26]陈月华,江徳凤,刘永永.金属镀金外壳抗盐雾腐蚀工艺的改进[J].表面技术,2015,44(6):93-97.CHEN Yue-hua,JIANG De-feng,LIU Yong-yong.Improvement of Anti-spray-salt Corrosion Mechanism of Metal Shells[J].Surface Technology,2015,44(6):93-97.
[27]杨宇辰,李明初,董义.镀金印制板可焊性工艺试验研究[J].质量与可靠性,2016,18(1):20-22.YANG Yu-chen,LI Ming-chu,DONG Yi.Experimental Study on Solderability of Gold Plated Printed Circuit Board[J].Quality and Reliability,2016,18(1):20-22.
[28]任万滨,王鹏,马晓明,等.电连接器镀金铜触点材料微动磨损特性的实验研究[J].电工技术学报,2013,28(12):119-124.REN Wan-bin,WANG Peng,MA Xiao-ming,et al.Experimental Research on Fretting Wear Characteristics of Au-plated Copper Contacts Used in Electrical Connectors[J].Transactions of China Electrotechnical Society,2013,28(12):119-124.
[29]ITO M,UNO M,TAKEYA J.Low-resistance Contacts of Electroless Plated Metals with High-mobility Organic Semiconductors:Novel Organic Field Effect Transistors with Solution Processed Electrodes[J].Organic Electronics December,2015,27:53-58.
[30]刘云彦,李家峰,崔庆新,等.钼铜合金表面金镀层的制备及耐高温与焊接性能[J].材料保护,2017,50(3):47-50.LIU Yun-yan,LI Jia-feng,CUI Qing-xin,et al.Preparation of Gold Plating on Mo-Cu Alloy Surface and Evaluation of Its High-temperature Resistance and Welding Performance[J].Journal of Materials Protection,2017,50(3):47-50.
[31]GAUDION M.Nickel-Gold Plating of Copper PCB Traces and Signal Losses[J].Circuit World,2012,38(2):64-67.
[32]陆东梅,姚建铨,郑义,等.太赫兹波在金属镀层空芯圆波导中的传输特性[J].激光与红外,2007,37(12):1287-1289.LU Dong-mei,YAO Jian-quan,ZHENG Yi,et al.Transmission Characteristics of Hollow Metallic Filmcoated Circular Waveguide for THz Radiation[J].Laser&Infrared,2007,37(12):1287-1289.
[33]PU S H,HOLMES A S,YEATMAN E M.Stress in Electroplated Gold on Silicon Substrates and Its Dependence on Cathode Agitation[J].Microelectronic Engineering,2013,112:21-26.
[34]叶锦群,周定忠,张晃初.谈高频阶梯印制镀金插头线路板制作工艺[J].印制电路信息,2015(7):48-51.YE Jin-qun,ZHOU Ding-zhong,ZHANG Huang-chu.Discussion about Technology of High-frequency Step PCB with Gold Finger[J].Printed Circuit Information,2015(7):48-51.
[35]CHANG Le,ZHANG Zhi-jun,LI Yue,et al.60 GHz Air Substrate Leaky-wave Antenna Based on MEMS Micromachining Technology[J].IEEE Transactions on Components,Packaging and Manufacturing Technology,2016(11):1656-1662.
[36]CHANG Le,ZHANG Zhi-jun,LI Yue,et al.Air-filled Long Slot Leaky Wave Antenna Based on Folded Halfmode Waveguide Using Silicon Bulk Micromachining Technology for Millimeter-wave Band[J].IEEE Transactions on Antennas and Propagation,2017,65(7):3409-3418.
[37]GOSWAMI S A,KARIA D.Regular Paper:A Compact Monopole Antenna for Wireless Applications with Enhanced Bandwidth[J].International Journal of Electronics and Communications February,2017,72:33-39.
[38]SHARMA R K,KANERIYA R,PARGAIEN K C.Microwave Integrated Circuits Fabrication on Alumina Substrate Using Pattern up Direct Electroless Nickel and Immersion Au Plating and Study of Its Properties[J].Microelectronic Engineering,2013,108:45-49.
[39]PARVIZIAN M,RAHIMI-ASHTARI F,GOODARZI A,et al.Residual Stress Improvement of Platinum Thin Film in Au/Pt/Ti/p-Ga As Ohmic Contact by RF Sputtering Power[J].Applied Surface Science,2012,260:77-79.
[40]GEZERMAN A O,?ORBACIO?LU B D.Development of Alternative Environment Friendly Nickel and Gold Plating Baths[J].Surface Engineering,2015,31(9):641-649.
[41]张叶,吴剑,程熹.在硅橡胶表面无氰化学镀金研究[J].信息记录材料,2017,18(8):43-44.ZHANG Ye,WU Jian,CHENG Xi.Study on Cyanide Free Electroless Gold Plating on Silicone Rubber Surface[J].Information Recording Materials,2017,18(8):43-44.
[42]HUANG Ming-qi,LI Xian-tang,XIA Jian-wen,et al.A Conceivably Stable Non-cyanide Electroless Gold Plating for Electronic Packaging Application[J].Electronic Packaging Technology,2017(8):1173-1178.
[43]董振华,李德良,高林军,等.无氰沉金工艺的实践[J].电子工艺技术,2011,32(4):189-192.DONG Zhen-hua,LI De-liang,GAO Lin-jun,et al.New Cyanide-free Immersion Gold Process of PCB[J].Electronics Process Technology,2011,32(4):189-192.
[44]KICHIGIN V I,PETUKHOV I V,SHEVTSOV D I,et al.Electrodeposition of Coatings from Sulfite Goldplating Electrolyte and Their Properties[J].Russian Journal of Applied Chemistry,2015,88(12):1950.
[45]LI M,BAI Z,ZHANG F,et al.Red Shift of Side-polished Fiber Surface Plasmon Resonance Sensors with Silver Coating and Inhibition by Gold Plating[J].IEEE Photonics Journal,2017,9(3):1-13.
[46]MULLONI V,MARGESIN B,FARINELLI P,et al.Cycling Reliability of RF-MEMS Switches with GoldPlatinum Multilayers as Contact Material[J].Microsystem Technologies,2017,23(9):3843-3850.
[47]吴涛.脉冲镀金在半导体激光器中的应用及工艺优化[J].激光与红外,2015,45(6):631-634.WU Tao.Application and Process Optimization of Pulse Au-plating in Semiconductor Laser[J].Laser&Infrared,2015,45(6):631-634.
[48]LIN Kuan-ting,HSIEH Jian-yu,CHEN Yu-jen,et al.Gold Plating Carbon Nano Tube Antenna Integrated with Voltage Control Oscillator[J].Piers Proceedings,2013,65:1726-1729.
[49]姜丽,胡以俊,丛淑敏,等.支架用钴铬合金表面镀金对变异链球菌粘附的影响[J].北京口腔医学,2016,24(5):259-261.JIANG Li,HU Yi-jun,CONG Shu-min,et al.Effect of Gold-Plating Treatment of Co-Cr Alloy on Adhesion of Streptococcus Mutans[J].Beijing Journal of Stomatology,2016,24(5):259-261.
[50]刘东光,胡江华.细间距图形电路无氰化学镀金工艺研究[J].电子与封装,2013(5):31-33.LIU Dong-guang,HU Jiang-hua.Study of Cyanidefree Electroless Gold Plating for Patterned Circuits with Fine-pitch[J].Electronics and Packaging,2013(5):31-33.