复合电沉积技术制备金属基-微粒薄膜的研究进展
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  • 英文篇名:Research Progress of Preparation of Metal Matrix-microparticle Film by Composite Electrodeposition Technology
  • 作者:王晓丽 ; 周昭昌 ; 黄大志
  • 英文作者:WANG Xiaoli;CHOU Chauchang;HUANG Dazhi;Jiangsu Key Laboratory of Function Control Technology for Advanced Materials, Huaihai Institute of Technology;Doctoral Degree Program in Ocean Engineering Technology, College of Engineering, Taiwan Ocean University;Department of Mechanical & Mechatronic Engineering, Taiwan Ocean University;Marine Resources Development Institute of Jiangsu, Huaihai Institute of Technology;
  • 关键词:复合电沉积 ; 金属基-微粒 ; 团聚 ; 结合力 ; 软件仿真
  • 英文关键词:composite electrodeposition;;metal-based particle;;agglomeration;;adhesion;;software simulation
  • 中文刊名:SJGY
  • 英文刊名:Hot Working Technology
  • 机构:淮海工学院江苏省先进材料功能调控技术重点实验室;台湾海洋大学工学院;台湾海洋大学机械与机电工程学系;淮海工学院江苏省海洋资源开发研究院;
  • 出版日期:2018-12-08 15:49
  • 出版单位:热加工工艺
  • 年:2018
  • 期:v.47;No.500
  • 基金:江苏省先进材料功能调控技术重点实验室资助项目(JKLF CTAM1705);; 淮海工学院自然科学基金项目(Z2017007);; 连云港市科技项目(CG1608)
  • 语种:中文;
  • 页:SJGY201822005
  • 页数:6
  • CN:22
  • ISSN:61-1133/TG
  • 分类号:24-28+34
摘要
总结了多年来复合电沉积技术的研究成果。介绍了复合镀层的电沉积实现方法。从镀层材料、沉积机理、多层膜的制备、软件仿真等方面研究了金属基和其他颗粒的共沉积。在减小颗粒团聚、提升镀层颗粒含量方面,给出了解决方法;同时在增强镀层与固体颗粒结合力,以及提高镀膜与基体结合力方面提出了实用的参考方法,为后续制备高强度、高耐磨性及高膜基结合力或颗粒把持力的复合膜层奠定了基础。
        The research results of composite electrodeposition technologies over the years were summarized. The application methods for composite electrodeposition were introduced. From the aspects of coating materials, deposition mechanism, the preparation of multilayer films and software simulation, the co-deposition of metal bases and other particles was studied. The solutions for reducing the agglomeration of particles and increasing the content of coating particles were provided. At the same time, the practical reference methods for enhancing the bonding force between the coating and the solid particles and increasing the bonding force between the coating and the substrate were proposed. It can lay the foundation for fabricating composite film with high strength, high wear resistance and high film-based bonding force or good granular holding power.
引文
[1]Alki re R C.High-speed selective electroplating with single circular jets[J].Electrochem Soc,1982,129:2424-2432.
    [2]Tian Z J,Wang D S,Wang G F,et al.Microstructure and properties of nanocrystalline nickel coatings prepared by pulse jet electrodeposition[J].Transactions of Nonferrous Metals Society of China,2010,20(6):1037-1042.
    [3]姚昶劦.连续复合电镀磨盘式超精密抛光机之研发及硅晶圆抛光特性[D].广州:中山大学.2002.
    [4]Zhao Kailin,Shen L D,Qiu M B,et al.Preparation and properties of nanocomposite coatings by pulsed current-jet electrodeposition[J].Int.J.Electrochem Sci.,2017,12:8578-8590.
    [5]Qu N.Pulse co-electrodeposition of nano Al2O3whiskers nickel composite coating[J].Scripta Materialia,2004,50(8):1131-1134.
    [6]Thiemig D,Bund Andereas L R.Influence of pulse plating parameters on the electrocodeposition of matrix metal nanocomposites[J].Electrochimica,2007,52:7362-7371.
    [7]陈绍军.超声电沉积制备镍基纳米复合材料的结构与性能[J].热加工工艺,2014,43(8):114-116.
    [8]牛晓敏,夏亚涛.超声波在电沉积过程中的应用[J].热加工工艺,2010,39(24):228-230.
    [9]Qiu W Q,Hu Z G,Liu Z W,et al.Preparation and characterization of diamond film on Cu substrate using Cu-diamond composite interlayer[J].TransNonferrous Met Soc.China,2014,24:758-763.
    [10]王朝阳,郑精武,蔡伟.铜-金刚石复合电镀制备新型切割线的工艺[J].电镀与涂饰,2014,33(1):17-20.
    [11]马云.硅基底喷射电沉积铜/钴多层膜的研究[D].南京:南京航空航天大学,2013.
    [12]Du L,Xu B,Dong S,et al.Study of tribological characteristics and wear mechanism of nano-particle strengthened nickel-based composite coatings under abrasive contaminant lubrication[J].Wear,2004,257(9/10):1058-1063.
    [13]Zoikis-Kara thanasis,Pavlatou E A,Spyrellis N.Pulse electrodeposition of Ni-P matrix composite coatings reinforced by SiC pa rticles[J].Journal of Alloys and Compounds,2010,494(1/2):396-403.
    [14]Chen L,Wang L,Zeng Z.Influence of pulse frequency on the microstructure and wear resistance of electrodeposited Ni-Al2O3composite coatings[J].Surface and Coatings Technology,2006,201(3/4):599-605.
    [15]Nap覥oszek-Bilnik I,Budniok A,覵osiewicz B,et al.Electrodeposition of composite Ni-based coatings with the addition of Ti or/and Al particles[J].Thin Solid Films,2005,474(1/2):146-153.
    [16]Pavlatou E A,Stroumbouli M,Gyftou P,et al.Hardening effect induced by incorporation of SiC particles in nickel electrodeposits[J].Journal of Applied Electrochemistry,2005,36(4):385-394.
    [17]Gül H,K覦l覦觭F,Aslan S,et al.Characteristics of electro-co-deposited Ni-Al2O3nano-particle reinforced metal matrix composite(MMC)coatings[J].Wear,2009,267(5/8):976-990.
    [18]Wu G,Li N,Zhou D,et al.Electrodeposited Co-Ni-Al2O3composite coatings[J].Surface and Coatings Technology,2004,176(2):157-164.
    [19]Zheng X,Wang M,Song H,et al.Effect of ultrasonic power and pulse-on time on the particle content and mechanical property of Co-Cr3C2composite coatings by jet electrodeposition[J].Surface and Coatings Technology,2017,325:181-189.
    [20]Tudela I,Zhang Y,Pal M,et al.Ultrasound-assisted electrodeposition of composite coatings with particles[J].Surface and Coatings Technology,2014,259(Part C):363-373.
    [21]冯拉俊,同培茹,雷阿利.耐磨纳米复合镀层的电镀方法[D].西安:西安理工大学,2013.
    [22]Walsh F C,Ponce de Leon.A review of the electrodeposition of metal matrix composite coatings by inclusion of particles in a metal layer:an established and diversifying technology[J].Transactions of the IMF,2014,92(2):83-98.
    [23]陈文东,何主亮.钻石磨料及电镀钻石工具:CN103215011B[P].2014.
    [24]潘太军,陈婧,陈杨,等.一种表面电沉积纳米稀土改性钴基复合镀层的制备方法:CN104975326B[P].2017.
    [25]杨钦鹏,汤皎宁.钴,磷,聚四氟乙烯复合镀层性能研究[J].润滑与密封,2008(1):85-88.
    [26]游阳明,张国庆.电沉积制备纳米迭层薄膜材料[J].电镀与精饰,1995,17(4):20-23.
    [27]姚素薇,桂峰,张卫国.电沉积纳米金属多层膜研究[J].天津大学学报(自然科学与工程技术版),2001,34(2):261-264.
    [28]Dulal S M S I,Charles E A.Electrodeposition and composition modulation of Co-Ni(Cu)/Cu multilayers[J].Journal of Alloys and Compounds,2008,455(1/2):274-279.
    [29]Rajasekaran N,Mohan S.Preparation,corrosion and structural properties of Cu-Ni multilayers from sulphate/citrate bath[J].Corrosion Science,2009,51(9):2139-2143.
    [30]Hattori T,Kaneko Y,Hashimoto S.Wear-induced microstructure in Ni/Cu nano-multilayers[J].Journal of Materials Science,2008,43(11):38-42.
    [31]Pandya D,Gupta P,Kashyap S C,et al.Electrodeposition and characterization of Cu/Co multilayers:effect of individua Co and Cu layers on GMR magnitude and behavior[J].Journa of Magnetism and Magnetic Materials,2009,321(8):974-978.
    [32]谭军,谢天生,张广平.Cu-Ni多层膜纳米压痕下微观变形结构的研究[J].电子显微学报,2005,24(4):278-278.
    [33]姚素薇,赵瑾,张卫国,等.单晶硅上电沉积Cu/Co纳米多层膜及其巨磁电阻效[J].应化工学报,2004,55(3):414-417.
    [34]Micale G,Montante G,Grisafi F A,et al.CFD Simulation of particle distribution in stirred vessels[J].Chemical Engineering Research and Design,2000,78(3):435-444.

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