摘要
利用半导体激光宽带对环形零件局部进行表面淬火处理,并利用蔡司光学显微镜和HXD-1000TMC型维氏硬度计对处理后的零件进行显微组织观察和硬度分析。结果表明,通过高功率、多次扫描、辅助气冷的方法获得优良的表面改性层;当激光功率为1100 W,扫描速度4.5 mm/s,经三次激光宽带扫描处理后,硬化层深度> 500μm,表面硬度> 600 HV0.1。
The local surface of an aerospace typicalannular part was treated by semiconductor laser quenching,the microstructure and hardness were analyzed by ZEISS optical microscope and HXD-1000 TMC Vickers hardness tester.The results show that excellent surface modification layer can be obtained by high power,multiple scan and auxiliary air cooling.After 3 wide-band laser scanning with laser power of 1100 W and scanning speed of 4.5 mm/s,the hardened layer depth is more than 500 μm,and the surface hardness is higher than 600 HV0.1.
引文
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