人造金刚石表面化学镀球状镍钴磷合金的研究
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摘要
采用化学镀的方法在金刚石的表面镀覆镍钴磷合金,从而增强其与基体结合的能力,并使用扫描电子显微镜和X射线衍射仪研究不同沉积工艺对镀层性能的影响。结果表明:最佳配方为加入11.8 g/L的氯化钴,8.7 g/L的硫酸镍,18 g/L的次亚磷酸钠,50 g/L的柠檬酸钠,60 g/L的硫酸铵和0.1 g/L添加剂,在76℃条件下,用浓氨水调节镀液pH值至9.0,连续施镀2 h,在此配方和工艺下,可得到结合紧密的球状突起镀层;不低于400℃的热处理可使镀层中析出更多的稳定相Ni、Ni_3P、CoP和Co_2P。
To enhance the bonding strength between diamond and matrix, Ni-Co-P alloy is deposited onto the diamond surface by using electroless plating. The influence of different depositing parameters on the performance of the coated layer is studied by scanning electron microscope and X-ray diffraction. Results show that the best formula is cobalt chloride 11.8 g/L, nickel sulfate 8.7 g/L, sodium hypophosphite 18 g/L, sodium citrate 50 g/L, ammonium sulfate 60 g/L and addition agent 0.1 g/L and that the best parameters are solvent temperature 76 ℃, pH value 9.0 and coating for 2 h. At such formula and parameters the spherical protrusions are formed and strongly bonded to the diamonds. It is also found that if the coatings are heated at 400 ℃ or higher, there will precipitate stable phases such as Ni, Ni_3P, CoP and Co_2P.
To enhance the bonding strength between diamond and matrix, Ni-Co-P alloy is deposited onto the diamond surface by using electroless plating. The influence of different depositing parameters on the performance of the coated layer is studied by scanning electron microscope and X-ray diffraction. Results show that the best formula is cobalt chloride 11.8 g/L, nickel sulfate 8.7 g/L, sodium hypophosphite 18 g/L, sodium citrate 50 g/L, ammonium sulfate 60 g/L and addition agent 0.1 g/L and that the best parameters are solvent temperature 76 ℃, pH value 9.0 and coating for 2 h. At such formula and parameters the spherical protrusions are formed and strongly bonded to the diamonds. It is also found that if the coatings are heated at 400 ℃ or higher, there will precipitate stable phases such as Ni, Ni_3P, CoP and Co_2P.
引文
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[3] 曹晶晶, 袁庆龙, 冯旭东. Co2+与(Co2++Ni2+)摩尔浓度比对Ni–Co–P合金化学镀层组织与性能的影响 [J]. 材料保护, 2010, 43(6): 46–48.CAO Jingjing, YUAN Qinglong, FENG Xudong. Effect of molar ratio of metallic ions on microstructure and corrosion resistance of electroless Ni-Co-P alloy coatings [J]. Materials Protection, 2010, 43(6): 46-48.
[4] 宣天鹏, 郑晓桦, 邓宗钢. 镍钴离子浓度比对化学镀Co–Ni–P合金工艺的影响 [J].材料保护, 1997, 30(1): 20–21.XUAN Tianpeng, ZHENG Xiaohua, DENG Zonggang. Influence of ion concentration ratio of Ni to Co on process of electroless plating Co-Ni-P alloy [J]. Materials Protection, 1997, 30(1): 20-21.
[5] 陈思夫, 于爱兵. 用表面活化技术提高金刚石与镀层的结合性能 [J]. 机械科学与技术, 2005, 24(5): 609–611.CHEN Sifu, YU Aibing. Enhancing bonding strength between diamond grits and plating layer with surface activation technique [J]. Mechanical Science and Technology, 2005, 24(5): 609-611.
[6] 李宁, 袁国伟, 黎德育. 化学镀镍基合金理论与技术 [M]. 哈尔滨: 哈尔滨工业大学出版社, 2000.LI Ning, YUAN Guowei, LI Deyu. Theory and technology of electroless plating Ni-based alloy [M]. Harbin: Harbin Institute of Technology Press, 2000.
[7] 陈一岩, 王传琪, 徐娟, 等. 一种微米级金刚石化学镀搅拌装置: 中国 206599611 [P]. 2017–10–31.CHEN Yiyan, WANG Chuanqi, XU Juan, et al. A micrometer-level mixing device for electroless plating diamond: CN 206599611 [P]. 2017-10-31.
[2] 毕韶丹. 化学镀Ni–Co–P合金的工艺控制因素 [J]. 表面技术, 2004, 33(4): 46–47.BI Shaodan. Study on the control factors of electroless Ni-Co-P alloy plating [J]. Surface Technology, 2004, 33(4): 46–47.
[3] 曹晶晶, 袁庆龙, 冯旭东. Co2+与(Co2++Ni2+)摩尔浓度比对Ni–Co–P合金化学镀层组织与性能的影响 [J]. 材料保护, 2010, 43(6): 46–48.CAO Jingjing, YUAN Qinglong, FENG Xudong. Effect of molar ratio of metallic ions on microstructure and corrosion resistance of electroless Ni-Co-P alloy coatings [J]. Materials Protection, 2010, 43(6): 46-48.
[4] 宣天鹏, 郑晓桦, 邓宗钢. 镍钴离子浓度比对化学镀Co–Ni–P合金工艺的影响 [J].材料保护, 1997, 30(1): 20–21.XUAN Tianpeng, ZHENG Xiaohua, DENG Zonggang. Influence of ion concentration ratio of Ni to Co on process of electroless plating Co-Ni-P alloy [J]. Materials Protection, 1997, 30(1): 20-21.
[5] 陈思夫, 于爱兵. 用表面活化技术提高金刚石与镀层的结合性能 [J]. 机械科学与技术, 2005, 24(5): 609–611.CHEN Sifu, YU Aibing. Enhancing bonding strength between diamond grits and plating layer with surface activation technique [J]. Mechanical Science and Technology, 2005, 24(5): 609-611.
[6] 李宁, 袁国伟, 黎德育. 化学镀镍基合金理论与技术 [M]. 哈尔滨: 哈尔滨工业大学出版社, 2000.LI Ning, YUAN Guowei, LI Deyu. Theory and technology of electroless plating Ni-based alloy [M]. Harbin: Harbin Institute of Technology Press, 2000.
[7] 陈一岩, 王传琪, 徐娟, 等. 一种微米级金刚石化学镀搅拌装置: 中国 206599611 [P]. 2017–10–31.CHEN Yiyan, WANG Chuanqi, XU Juan, et al. A micrometer-level mixing device for electroless plating diamond: CN 206599611 [P]. 2017-10-31.