一种运载火箭用大功率电动伺服驱动器的散热设计
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摘要
散热对电子设备的性能有着直接的影响,散热器被广泛应用于电子产品的热设计,以改善其散热能力,因此散热器应作为关键部件进行设计。针对航天领域使用的大功率电动伺服驱动器的散热问题,提出了通过热力学理论计算、指导散热器结构设计的方法。首先,通过理论计算结果确定散热器的结构尺寸,然后通过三维建模软件对散热器进行建模,并利用热仿真软件对所设计的散热器进行热仿真,最后搭建了伺服驱动器的热试验环境。仿真结果和试验数据均验证了该设计方法的正确性。
Heat dissipation has a direct impact on the performance of electronic equipment.Radiator is widely used in the thermal design of electronic products to improve its heat dissipation capacity,so the radiator should be designed as a key component.Aiming at the problem of heat dissipation of high-power electric servo drivers used in aerospace,a method to guide the design of radiator structure by thermodynamic calculation is proposed.Firstly,the structure size of the radiator was determined by theoretical calculation results.Then the radiator was modeled by 3D modeling software,and the designed radiator was simulated by thermal simulation software.Finally,the thermal environment test of the servo driver was built.Simulation results and experimental data verified the correctness of the design method.
Heat dissipation has a direct impact on the performance of electronic equipment.Radiator is widely used in the thermal design of electronic products to improve its heat dissipation capacity,so the radiator should be designed as a key component.Aiming at the problem of heat dissipation of high-power electric servo drivers used in aerospace,a method to guide the design of radiator structure by thermodynamic calculation is proposed.Firstly,the structure size of the radiator was determined by theoretical calculation results.Then the radiator was modeled by 3D modeling software,and the designed radiator was simulated by thermal simulation software.Finally,the thermal environment test of the servo driver was built.Simulation results and experimental data verified the correctness of the design method.
引文
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[3]ZHANG Y,ZENG G,HOFFMAN C.Enhanced hot spot cooling using bonded superlattice microcoolers with a trench structure[J].IEEE Transactions on Components,Packaging and Manufacturing Technology,2008,31(3):552-558.
[4]WU Y B,LIU G Y,XU N H,et al.Thermal resistance analysis and simulation of IGBT module with high power density[J].Applied Mechanics and Materials,2013(303-306):1902-1907.
[5]GUO D P,YAO R T,QIAO Q D.CFD numerical simulation of drift diffusion of the NPP's cooling tower[C].The5th IEEE International Conference on Bioinformatics&Biomedical Engineering,Wuhan,2011:1-5.
[6]刘会.基于Icepak的一种射频电源芯片散热器改进设计[J].机械工程与自动化,2017,3:92-94.LIU H.Optimal design of RF power supply heat sink with Icepak[J].Mechanical Engineering&Automation,2017,3:92-94(in Chinese).
[7]CAMPBELL M I,AMON C H,CAGAN J.Optimal threedimensional placement of heat generating electronic components[J].Journal of Electronic Packaging,1997,119(2):106-113.
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