金刚石线锯电解磨削切割多晶硅片的试验研究
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摘要
基于金刚石线锯切割系统,开展了金刚线电解磨削切割多晶硅片试验。结果表明:电解磨削复合加工方法在机械磨削的同时复合了阳极氧化和腐蚀,在硅片表面产生了机械损伤缺陷和电化学腐蚀缺陷。酸制绒时腐蚀反应在两种类型缺陷处顺利进行,形成均匀致密的绒面结构,有效降低硅片表面反射率,有利于后续电池片光电转换效率的提高。
The polycrystalline silicon wafers were sliced by electrochemical grinding method based on the diamond wire saw system. The electrochemical grinding experimental results show that the etching happens at the defects that caused by grinding and electrochemical reaction during the process of texturing. And the uniform and dense microstructure was formed on the surface of polycrystalline silicon wafer by acid wet texturing. The microstructure can reduce the surface reflectivity effectively and is better for the improvement of photoelectric conversion efficiency for cells.
The polycrystalline silicon wafers were sliced by electrochemical grinding method based on the diamond wire saw system. The electrochemical grinding experimental results show that the etching happens at the defects that caused by grinding and electrochemical reaction during the process of texturing. And the uniform and dense microstructure was formed on the surface of polycrystalline silicon wafer by acid wet texturing. The microstructure can reduce the surface reflectivity effectively and is better for the improvement of photoelectric conversion efficiency for cells.
引文
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[4]曾明,周玉梅,郭长文.固着磨料多线锯研究进展[J].超硬材料工程,2007,19(5):1-5.
[5]李妙.金刚石线锯切割多晶硅片表面特性与制绒方法研究[D].南昌:南昌大学,2014.
[6]陈文浩,李妙,刘小梅,等.金刚石切割多晶硅片切割痕性质与消除方法研究[J].人工晶体学报,2014,43(2):314-320.
[7]汪炜,刘正埙.硅片的磨削/电解复合多线切割加工方法:CN201010141727.3[P].2010-04-08.
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[9]鲍官培,周翟和,章恺,等.太阳能硅片游离磨料电解磨削多线切割表面完整性研究[J].机械工程学报,2016,52(11):201-206.