Wetting failure condition on rough surfaces
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摘要
Wetting states and processes attract plenty of interest of scientific and industrial societies. Air entrainment, i.e.,wetting failure, on smooth plate in wetting process has been investigated carefully before. Liquid bath entries of "rough"silicon wafers are studied experimentally in the present work, and the air entrainment condition is analyzed specially with the lubrication theory. The roughness effects on the moving contact lines are therefore explored. The contact line pinning is found to be the main reason for the dynamically enhanced hydrophobicity of rough surface, which implies an effective microscopic contact angle of θ_e = θ_Y + 90° where θY is the Young's contact angle of the material. Our results suggest that the solid surfaces can be considered as hydrophobic ones for a wide range of dynamic process, since they are normally rough. The work can also be considered as a starting point for investigating the high-speed advancing of moving contact line on rough surfaces.
Wetting states and processes attract plenty of interest of scientific and industrial societies. Air entrainment, i.e.,wetting failure, on smooth plate in wetting process has been investigated carefully before. Liquid bath entries of "rough"silicon wafers are studied experimentally in the present work, and the air entrainment condition is analyzed specially with the lubrication theory. The roughness effects on the moving contact lines are therefore explored. The contact line pinning is found to be the main reason for the dynamically enhanced hydrophobicity of rough surface, which implies an effective microscopic contact angle of θ_e = θ_Y + 90° where θY is the Young's contact angle of the material. Our results suggest that the solid surfaces can be considered as hydrophobic ones for a wide range of dynamic process, since they are normally rough. The work can also be considered as a starting point for investigating the high-speed advancing of moving contact line on rough surfaces.
Wetting states and processes attract plenty of interest of scientific and industrial societies. Air entrainment, i.e.,wetting failure, on smooth plate in wetting process has been investigated carefully before. Liquid bath entries of "rough"silicon wafers are studied experimentally in the present work, and the air entrainment condition is analyzed specially with the lubrication theory. The roughness effects on the moving contact lines are therefore explored. The contact line pinning is found to be the main reason for the dynamically enhanced hydrophobicity of rough surface, which implies an effective microscopic contact angle of θ_e = θ_Y + 90° where θY is the Young's contact angle of the material. Our results suggest that the solid surfaces can be considered as hydrophobic ones for a wide range of dynamic process, since they are normally rough. The work can also be considered as a starting point for investigating the high-speed advancing of moving contact line on rough surfaces.
引文
[1]Cheng Y T and Rodak D E 2005 Appl.Phys.Lett.86 144101
[2]Bush J W M and Hu D L 2006 Ann.Rev.Fluid Mech.38 339
[3]Prakash M,Qu′er′e D and Bush J W M 2008 Science 320 931
[4]Kumar S 2015 Ann.Rev.Fluid Mech.47 67
[5]Diebold A V,Watson A M,Holcomb S,Tabor C,Mast D,Dickey M Dand Heikenfeld J 2017 J.Micromech.Microeng.27 025010
[6]Garcia-Cordero J L and Fan Z H 2017 Lab A Chip 17 2150
[7]Huh C and Scriven L E 1971 J.Colloid Intf.Sci.35 85
[8]Zhao Y 2012 Physico-Mechanics for surfaces and interfaces(Peking:Science Press)(in Chinese)
[9]Eggers J 2004 Phys.Rev.Lett.93 094502
[10]Marchand A,Chan T S,Snoeijer J H and Andreotti B 2012 Phys.Rev.Lett.108 204501
[11]Chan T S,Srivastava S,Marchand A,Andreotti B,Biferale L,Toschi Fand Snoeijer J H 2013 Phys.Fluids 25 074105
[12]Qu′er′e D 2008 Ann.Rev.Mater.Res.38 71
[13]Liu M and Chen X P 2017 Phys.Fluids 29 082102
[14]Liu Y and Zhang X 2018 Chin.Phys.B 27 014401
[15]Xu L,Barcos L and Nagel S R 2007 Phys.Rev.E 76 066311
[16]Hao Y,Yuan W,Xie J,Shen Q and Chang H 2017 IEEE Sen.J.17 1246
[17]Zhao M H,Chen X P and Wang Q 2014 Sci.Rep.4 5376
[18]Duez C,Ybert C,Clanet C and Bocquet L 2007 Nat.Phys.3 180
[19]Qian T,Wang X and Sheng P 2006 J.Fluid Mech.564 333
[20]Yang F C,Chen X P and Yue P 2018 Phys.Fluids 30 012106
[21]Philip J R 1972 Z.Angew.Math.Phys.23 353
[2]Bush J W M and Hu D L 2006 Ann.Rev.Fluid Mech.38 339
[3]Prakash M,Qu′er′e D and Bush J W M 2008 Science 320 931
[4]Kumar S 2015 Ann.Rev.Fluid Mech.47 67
[5]Diebold A V,Watson A M,Holcomb S,Tabor C,Mast D,Dickey M Dand Heikenfeld J 2017 J.Micromech.Microeng.27 025010
[6]Garcia-Cordero J L and Fan Z H 2017 Lab A Chip 17 2150
[7]Huh C and Scriven L E 1971 J.Colloid Intf.Sci.35 85
[8]Zhao Y 2012 Physico-Mechanics for surfaces and interfaces(Peking:Science Press)(in Chinese)
[9]Eggers J 2004 Phys.Rev.Lett.93 094502
[10]Marchand A,Chan T S,Snoeijer J H and Andreotti B 2012 Phys.Rev.Lett.108 204501
[11]Chan T S,Srivastava S,Marchand A,Andreotti B,Biferale L,Toschi Fand Snoeijer J H 2013 Phys.Fluids 25 074105
[12]Qu′er′e D 2008 Ann.Rev.Mater.Res.38 71
[13]Liu M and Chen X P 2017 Phys.Fluids 29 082102
[14]Liu Y and Zhang X 2018 Chin.Phys.B 27 014401
[15]Xu L,Barcos L and Nagel S R 2007 Phys.Rev.E 76 066311
[16]Hao Y,Yuan W,Xie J,Shen Q and Chang H 2017 IEEE Sen.J.17 1246
[17]Zhao M H,Chen X P and Wang Q 2014 Sci.Rep.4 5376
[18]Duez C,Ybert C,Clanet C and Bocquet L 2007 Nat.Phys.3 180
[19]Qian T,Wang X and Sheng P 2006 J.Fluid Mech.564 333
[20]Yang F C,Chen X P and Yue P 2018 Phys.Fluids 30 012106
[21]Philip J R 1972 Z.Angew.Math.Phys.23 353