电子封装用导热环氧树脂基复合材料的研究进展
|
摘要
环氧树脂是电子封装的常用材料,但其热导率仅有0.2W/(m·K)左右,添加高导热填料是提高环氧树脂导热性能的常用手段。对电子封装用导热环氧树脂基复合材料的导热机理和导热模型进行了综述,介绍了几种常用填料对复合材料导热性能的影响,并对电子封装用导热环氧树脂基复合材料未来的发展方向进行了展望,指出目前仍有许多问题需要解决,所制备的材料热导率不能满足应用要求,导热机理和模型也还需要进行更深入的研究。
Epoxy resin is a common material for electronic packaging,but its thermal conductivity is only about 0.2 W/(m·K).Adding high thermal conductivity filler is a common means to improve the thermal conductivity of epoxy resin.The thermal conductivity mechanism,thermal conductivity model of epoxy resin composite for electronic packaging were reviewed,and the influence of related fillers on the thermal conductivity of composite was presented.The future development direction of epoxy resin composite for electronic packaging was prospected.It was pointed out that there were still many problems to be solved,the thermal conductivity of the prepared materials could not meet the application requirements,and the thermal conductivity mechanism and model also needed to be further studied.
Epoxy resin is a common material for electronic packaging,but its thermal conductivity is only about 0.2 W/(m·K).Adding high thermal conductivity filler is a common means to improve the thermal conductivity of epoxy resin.The thermal conductivity mechanism,thermal conductivity model of epoxy resin composite for electronic packaging were reviewed,and the influence of related fillers on the thermal conductivity of composite was presented.The future development direction of epoxy resin composite for electronic packaging was prospected.It was pointed out that there were still many problems to be solved,the thermal conductivity of the prepared materials could not meet the application requirements,and the thermal conductivity mechanism and model also needed to be further studied.
引文
[1]郝志勇,等.热固性树脂,2008(1):45-48.Hao Zhiyong,et al.Thermosetting Resin,2008(1):45-48.
[2]石志想,等.复合材料学报,2011(6):8-13.Shi Zhixiang,et al.Acta Materiae Compositae Sinica,2011(6):8-13.
[3]祝渊,等.无机材料学报,2007,22(6):1 201-1 205.Zhu Yuan,et al.Journal of Inorganic Materials,2007,22(6):1 201-1 205.
[4]Li A,et al.Polymers,2017,9:437-453.
[5]Li Jing,et al.Coatings,2017,7(7):94-104.
[6]李宾,等.化工学报,2009(10):2 650-2 655.Li Bin,et al.Journal of Chemical Industry and Engineering(China),2009(10):2 650-2 655.
[7]Xu X,et al.Advanced Materials,2018,30(17):1 705 544-1 705 553.
[8]李珺鹏,等.材料导报,2012(3):69-72.Li Junpeng,et al.Materials Review,2012(3):69-72.
[9]石彤非,等.高分子材料科学与工程,1994(3):8-13.Shi Tongfei,et al.Polymeric Materials Science and Engineering,1994(3):8-13.
[10]王璞玉,等.材料导报,2010(9):108-112.Wang Puyu,et al.Materials Review,2010(9):108-112.
[11]Zhai S,et al.International Journal of Heat and Mass Transfer,2018,117:358-374.
[12]闫刚,等.玻璃钢/复合材料,2006(3):50-52.Yan Gang,et al.Fiber Reinforced Plastics/Composites,2006(3):50-52.
[13]Lee E S,et al.Journal of the American Ceramic Society,2008,91(4):1 169-1 174.
[14]赵广辉,等.工程应用塑料,2009,37(7):15-18.Zhao Guanghui,et al.Engineering Plastics Application,2009,37(7):15-18.
[15]Yu C,et al.Composites:Part A,2017(98):25-31.
[16]Hu Jiantao,et al.ACS Applied Materials&Interfaces,2017,9(15):13 544-13 553.
[17]He Yongming,et al.Physica Status Solidi(a),2014,211(3):677-684.
[18]Yung K C,et al.Journal of Applied Polymer Science,2010(1):528-534.
[19]Zhi C Y,et al.Pure and Applied Chemistry,2010,82(11):2 175-2 183.
[20]Fu Yuanxiang,et al.International Journal of Thermal Sciences,2014(86):276-283.
[21]Sun Xiaobo,et al.Journal of Electronic Packaging,2011(2):161-190.
[22]Messina E,et al.ACS Applied Materials&Interfaces,2016,35(8):23 244-23 259.
[23]Raza M A,et al.Journal of Materials Science,2012,47(2):1 059-1 070.
[24]Singh A K,et al.Polymers for Advanced Technologies,2017,28(12):1 523-1 960.
[25]Olifirov L K,et al.Composites Part A:Applied Science and Manufacturing,2017,101:344-352.
[26]Zhao Bo,et al.Electronic Materials Letters,2017,13(6):512-517.
[27]祁蓉,等.材料导报,2016(S1):82-86.Qi Rong,et al.Materials Review,2016(S1):82-86.
[2]石志想,等.复合材料学报,2011(6):8-13.Shi Zhixiang,et al.Acta Materiae Compositae Sinica,2011(6):8-13.
[3]祝渊,等.无机材料学报,2007,22(6):1 201-1 205.Zhu Yuan,et al.Journal of Inorganic Materials,2007,22(6):1 201-1 205.
[4]Li A,et al.Polymers,2017,9:437-453.
[5]Li Jing,et al.Coatings,2017,7(7):94-104.
[6]李宾,等.化工学报,2009(10):2 650-2 655.Li Bin,et al.Journal of Chemical Industry and Engineering(China),2009(10):2 650-2 655.
[7]Xu X,et al.Advanced Materials,2018,30(17):1 705 544-1 705 553.
[8]李珺鹏,等.材料导报,2012(3):69-72.Li Junpeng,et al.Materials Review,2012(3):69-72.
[9]石彤非,等.高分子材料科学与工程,1994(3):8-13.Shi Tongfei,et al.Polymeric Materials Science and Engineering,1994(3):8-13.
[10]王璞玉,等.材料导报,2010(9):108-112.Wang Puyu,et al.Materials Review,2010(9):108-112.
[11]Zhai S,et al.International Journal of Heat and Mass Transfer,2018,117:358-374.
[12]闫刚,等.玻璃钢/复合材料,2006(3):50-52.Yan Gang,et al.Fiber Reinforced Plastics/Composites,2006(3):50-52.
[13]Lee E S,et al.Journal of the American Ceramic Society,2008,91(4):1 169-1 174.
[14]赵广辉,等.工程应用塑料,2009,37(7):15-18.Zhao Guanghui,et al.Engineering Plastics Application,2009,37(7):15-18.
[15]Yu C,et al.Composites:Part A,2017(98):25-31.
[16]Hu Jiantao,et al.ACS Applied Materials&Interfaces,2017,9(15):13 544-13 553.
[17]He Yongming,et al.Physica Status Solidi(a),2014,211(3):677-684.
[18]Yung K C,et al.Journal of Applied Polymer Science,2010(1):528-534.
[19]Zhi C Y,et al.Pure and Applied Chemistry,2010,82(11):2 175-2 183.
[20]Fu Yuanxiang,et al.International Journal of Thermal Sciences,2014(86):276-283.
[21]Sun Xiaobo,et al.Journal of Electronic Packaging,2011(2):161-190.
[22]Messina E,et al.ACS Applied Materials&Interfaces,2016,35(8):23 244-23 259.
[23]Raza M A,et al.Journal of Materials Science,2012,47(2):1 059-1 070.
[24]Singh A K,et al.Polymers for Advanced Technologies,2017,28(12):1 523-1 960.
[25]Olifirov L K,et al.Composites Part A:Applied Science and Manufacturing,2017,101:344-352.
[26]Zhao Bo,et al.Electronic Materials Letters,2017,13(6):512-517.
[27]祁蓉,等.材料导报,2016(S1):82-86.Qi Rong,et al.Materials Review,2016(S1):82-86.