微电子领域中陶瓷劈刀研究与应用进展
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摘要
综述了陶瓷劈刀的研究与应用进展,主要包括陶瓷劈刀的成分、结构、工作过程、质量缺陷、应用领域,特别是在微电子领域中的应用,重点评述了当前陶瓷劈刀在制造新工艺和运用方面存在的主要问题,指出寻找制造陶瓷劈刀的新材料和改进陶瓷劈刀的成型工艺是目前陶瓷劈刀的研究重点,并提出了陶瓷劈刀今后的发展方向。
The research progress on bonding capillary is summarized,including its composition,structure,working process,quality defects,and application field especially in microelectronics.The existing problem of new manufacturing process and application of bonding capillary is discussed significantly.Based on the suggestion that finding new material and improving molding process shall be the research focuses,the future development trends for bonding capillary are finally depicted.
The research progress on bonding capillary is summarized,including its composition,structure,working process,quality defects,and application field especially in microelectronics.The existing problem of new manufacturing process and application of bonding capillary is discussed significantly.Based on the suggestion that finding new material and improving molding process shall be the research focuses,the future development trends for bonding capillary are finally depicted.
引文
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2 Goh K S,Zhong Z W.A new bonding-tool solution to improve stitch bondability[J].Microelectronic Eng,2007,84(1):173
3 Tee T Y,Ng H S,Yap D.Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications[J].Microelectronics Reliability,2003,43(7):1117
4 Goh K S,Zhong Z W.Two capillary solutions for ultrafine-pitch wire bonding and insulated wire bonding[J].Microelectronic Eng,2007,84(2):362
5 Oldervoll F,Strisland F.Wire bond failure mechanisms in plastic encapsulated microcircuits and ceramic hybrids at high temperatures[J].Microelectronics Reliability,2004,44(6):1009
6 Liu P S,Tong L Y,Wang J L,et al.Challenges and developments of copper wire bonding technology[J].Microelectronics Reliability,2012,52(6):1092
7 王彩媛,孙荣禄.芯片封装中铜丝键合技术的研究进展[J].材料导报,2009,23(专辑14):206
8 谢敬华,等.提高引线键合机超声系统性能的若干因素的分析[J].现代电子技术,2003(3):65
9 何俊,郭永进,林忠钦.劈刀运动历程对热超声键合界面变形的影响[J].上海交通大学学报,2008,42(5):716
10 吕雷,韩雷.超声键合换能系统中劈刀的振动特性分析[J].封装、测试与设备,2008,33(11):1020
11 Mayer M,Moon J T.Measuring stress next to Au ball bond during high temperature aging[J].Microelectronics Reliability,2009,49(7):771
12 Nan C Y,Mayer M,Zhou N,et al.Golden bump for 20micron diameter wire bond enhancement at reduced process temperature[J].Microelectronic Eng,2011,88(9):3024
13 Honma T,Kamata H,Tatami J.Microstructure of seal formed between a Nb wire and an Al2O3capillary melted by YAG laser radiation[J].Ceram Int,2013,39(5):4861
14 杨路,姜淑文,王志强,等.特种陶瓷烧结致密化工艺研究进展[J].材料导报:综述篇,2014,28(4):45
15 Prabhakaran K,Anand Melkeri,Gokhale N M,et al.Preparation of macroporous alumina ceramics using wheat particles as gelling and pore forming agent[J].Ceram Int,2007,33(1):77
16 杨利业.引线键合自动送线系统关键技术研究[D].天津:天津大学,2011
17 张小锋,于国强,姜林文.氧化铝陶瓷的应用[J].佛山陶瓷,2010,20(2):38
18 谭训彦,王昕,尹衍升,等.α-Al2O3的晶体结构与价电子结构[J].中国有色金属学报,2002,12(1):18
19 Kim I J,Kim H S,Seo M Y,et al.Advanced ceramics in wire bonding capillaries for semiconductor package technology[J].Mater Sci Eng,2008,498(1-2):129
20 Zhang C,Yang J,Qiu T,et al.Preparation of ZTA ceramic by aqueous gelcasting with a low-toxic monomer DMAA[J].Ceram Int,2012,38(4):3063
21 Tian Y H,Wang C Q,Lum I,et al.Investigation of ultrasonic copper wire wedge bonding on Au/Ni plated Cu substrates at ambient temperature[J].J Mater Processing Technol,2008,208(1-3):179
22 Hou T,Su C H,Chang H Z.Using neural networks and immune algorithms to find the optimal parameters for an IC wire bonding process[J].Expert Systems Applications,2008,34(1):427
23 邱睿.超细间距引线键合第一键合点影响因素研究[D].武汉:华中科技大学,2005
24 Goh K S,Zhong Z W.Development of capillaries for wire bonding of low-k ultra-fine-pitch devices[J].Microelectronic Eng,2006,83(10):2009
25 姚莉.劈刀对金丝键合的影响[J].混合微电子技术,2003,9(2):31
26 李明芬,陈益新,李付成.一种劈刀结构:中国,CN203205387U[P].2013-09-18
27 Ly N,Xu D E,Song W H,et al.More uniform Pd distribution in free-air balls of Pd-coated Cu bonding wire using movable flame-off electrode[J].Microelectronics Reliability,2015,55(1):201
28 潘峰,颜向乙,郑轩,等.全自动键合机工艺调试方法[J].电子工业专用设备,2009(5):46
29 Tseng T W,Hung F Y,Lui T S.Microstructure,tensile and electrical properties of gold-coated silver bonding wire[J].Microelectronics Reliability,2015,55(3-4):608
30 Lopez C,Chai L,Shaikh A,et al.Wire bonding characteristics of gold conductors for low temperature co-fired ceramic applications[J].Microelectronics Reliability,2004,44(2):287
31 吕磊.引线键合工艺介绍及质量检验[J].测试与测量,2008(158):53
32 Zhong Z W,Goh K S.Investigation of ultrasonic vibrations of wire-bonding capillaries[J].Microelectronics J,2006,37(2):107
33 Burger J,Dietler G,Binggeli M,et al.Aspects of the surface roughness of ceramic bonding tools on a nanometer scale investigated with atomic force microscopy[J].Thin Solid Films,1994,253(1-2):308
34 周红军,韩雷,王彦芳.引线成形中劈刀反向运动对引线影响的研究[J].封装、测试与设备,2010,35(2):186
35 冯武卫,范虹,孟庆丰,等.引线键合系统键合工具振动特性研究[J].振动与冲击,2007,26(7):106
36 姚钢,韩雷.劈刀安装长度对引线键合强度影响的实验研究[J].压电与声光,2008,30(4):414
37 Gomes J,Mayer M,Lin B.Development of a fast method for optimization of Au ball bond process[J].Microelectronics Reliability,2015,55(3-4):602
38 姚飞闪.金丝球焊过程及工艺探讨[J].机电信息,2009,9(30):30
39 斯芳虎.LED金线键合工艺的质量控制[J].电子质量,2010,31(4):44
40 Shinkawa.Introduction of capillary cleaning system[EB/OL].(2012-2-24)[2012-10-26].http://wenku.baidu.com/link?url=PiuJ-9MEbzWesPgR6owVaalrHm-GJpC9-T8VbWfBDfu0ubbtk9A5QLBCkL_qtu59GTZGCz0jp-JTPLwo2a3N_t7YznyZ2yiK6fpe4dK6rTn43.html
2 Goh K S,Zhong Z W.A new bonding-tool solution to improve stitch bondability[J].Microelectronic Eng,2007,84(1):173
3 Tee T Y,Ng H S,Yap D.Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications[J].Microelectronics Reliability,2003,43(7):1117
4 Goh K S,Zhong Z W.Two capillary solutions for ultrafine-pitch wire bonding and insulated wire bonding[J].Microelectronic Eng,2007,84(2):362
5 Oldervoll F,Strisland F.Wire bond failure mechanisms in plastic encapsulated microcircuits and ceramic hybrids at high temperatures[J].Microelectronics Reliability,2004,44(6):1009
6 Liu P S,Tong L Y,Wang J L,et al.Challenges and developments of copper wire bonding technology[J].Microelectronics Reliability,2012,52(6):1092
7 王彩媛,孙荣禄.芯片封装中铜丝键合技术的研究进展[J].材料导报,2009,23(专辑14):206
8 谢敬华,等.提高引线键合机超声系统性能的若干因素的分析[J].现代电子技术,2003(3):65
9 何俊,郭永进,林忠钦.劈刀运动历程对热超声键合界面变形的影响[J].上海交通大学学报,2008,42(5):716
10 吕雷,韩雷.超声键合换能系统中劈刀的振动特性分析[J].封装、测试与设备,2008,33(11):1020
11 Mayer M,Moon J T.Measuring stress next to Au ball bond during high temperature aging[J].Microelectronics Reliability,2009,49(7):771
12 Nan C Y,Mayer M,Zhou N,et al.Golden bump for 20micron diameter wire bond enhancement at reduced process temperature[J].Microelectronic Eng,2011,88(9):3024
13 Honma T,Kamata H,Tatami J.Microstructure of seal formed between a Nb wire and an Al2O3capillary melted by YAG laser radiation[J].Ceram Int,2013,39(5):4861
14 杨路,姜淑文,王志强,等.特种陶瓷烧结致密化工艺研究进展[J].材料导报:综述篇,2014,28(4):45
15 Prabhakaran K,Anand Melkeri,Gokhale N M,et al.Preparation of macroporous alumina ceramics using wheat particles as gelling and pore forming agent[J].Ceram Int,2007,33(1):77
16 杨利业.引线键合自动送线系统关键技术研究[D].天津:天津大学,2011
17 张小锋,于国强,姜林文.氧化铝陶瓷的应用[J].佛山陶瓷,2010,20(2):38
18 谭训彦,王昕,尹衍升,等.α-Al2O3的晶体结构与价电子结构[J].中国有色金属学报,2002,12(1):18
19 Kim I J,Kim H S,Seo M Y,et al.Advanced ceramics in wire bonding capillaries for semiconductor package technology[J].Mater Sci Eng,2008,498(1-2):129
20 Zhang C,Yang J,Qiu T,et al.Preparation of ZTA ceramic by aqueous gelcasting with a low-toxic monomer DMAA[J].Ceram Int,2012,38(4):3063
21 Tian Y H,Wang C Q,Lum I,et al.Investigation of ultrasonic copper wire wedge bonding on Au/Ni plated Cu substrates at ambient temperature[J].J Mater Processing Technol,2008,208(1-3):179
22 Hou T,Su C H,Chang H Z.Using neural networks and immune algorithms to find the optimal parameters for an IC wire bonding process[J].Expert Systems Applications,2008,34(1):427
23 邱睿.超细间距引线键合第一键合点影响因素研究[D].武汉:华中科技大学,2005
24 Goh K S,Zhong Z W.Development of capillaries for wire bonding of low-k ultra-fine-pitch devices[J].Microelectronic Eng,2006,83(10):2009
25 姚莉.劈刀对金丝键合的影响[J].混合微电子技术,2003,9(2):31
26 李明芬,陈益新,李付成.一种劈刀结构:中国,CN203205387U[P].2013-09-18
27 Ly N,Xu D E,Song W H,et al.More uniform Pd distribution in free-air balls of Pd-coated Cu bonding wire using movable flame-off electrode[J].Microelectronics Reliability,2015,55(1):201
28 潘峰,颜向乙,郑轩,等.全自动键合机工艺调试方法[J].电子工业专用设备,2009(5):46
29 Tseng T W,Hung F Y,Lui T S.Microstructure,tensile and electrical properties of gold-coated silver bonding wire[J].Microelectronics Reliability,2015,55(3-4):608
30 Lopez C,Chai L,Shaikh A,et al.Wire bonding characteristics of gold conductors for low temperature co-fired ceramic applications[J].Microelectronics Reliability,2004,44(2):287
31 吕磊.引线键合工艺介绍及质量检验[J].测试与测量,2008(158):53
32 Zhong Z W,Goh K S.Investigation of ultrasonic vibrations of wire-bonding capillaries[J].Microelectronics J,2006,37(2):107
33 Burger J,Dietler G,Binggeli M,et al.Aspects of the surface roughness of ceramic bonding tools on a nanometer scale investigated with atomic force microscopy[J].Thin Solid Films,1994,253(1-2):308
34 周红军,韩雷,王彦芳.引线成形中劈刀反向运动对引线影响的研究[J].封装、测试与设备,2010,35(2):186
35 冯武卫,范虹,孟庆丰,等.引线键合系统键合工具振动特性研究[J].振动与冲击,2007,26(7):106
36 姚钢,韩雷.劈刀安装长度对引线键合强度影响的实验研究[J].压电与声光,2008,30(4):414
37 Gomes J,Mayer M,Lin B.Development of a fast method for optimization of Au ball bond process[J].Microelectronics Reliability,2015,55(3-4):602
38 姚飞闪.金丝球焊过程及工艺探讨[J].机电信息,2009,9(30):30
39 斯芳虎.LED金线键合工艺的质量控制[J].电子质量,2010,31(4):44
40 Shinkawa.Introduction of capillary cleaning system[EB/OL].(2012-2-24)[2012-10-26].http://wenku.baidu.com/link?url=PiuJ-9MEbzWesPgR6owVaalrHm-GJpC9-T8VbWfBDfu0ubbtk9A5QLBCkL_qtu59GTZGCz0jp-JTPLwo2a3N_t7YznyZ2yiK6fpe4dK6rTn43.html