薄壁金属与非金属环形粘接件粘接质量超声检测方法研究
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  • 英文篇名:Study on Ultrasonic Detection Method of Thin-walled Metal and Non-metal Annular Adhesive Specimen Adhesive Quality
  • 作者:凡丽梅 ; 王从科 ; 郑杰 ; 李增翼 ; 赵付宝 ; 李金鹿
  • 英文作者:FAN Limei;WANG Congke;ZHENG Jie;LI Zengyi;ZHAO Fubao;LI Jinlu;CNGC Institute 53;Tiannuo Photoelectric Materials Co.,LTD;
  • 关键词:薄壁金属 ; 非金属环形粘接件 ; 粘接量 ; 超声C扫描 ; 接触式超声脉冲回波法
  • 英文关键词:thin-walled metal;;non-metal annular adhesive specimen;;adhesive quality;;ultrasonic C-scan imaging;;ultrasonic pulse-echo contact method
  • 中文刊名:CSJS
  • 英文刊名:Journal of Test and Measurement Technology
  • 机构:中国兵器工业集团第五三研究所;天诺光电材料股份有限公司;
  • 出版日期:2014-12-30
  • 出版单位:测试技术学报
  • 年:2014
  • 期:v.28;No.108
  • 语种:中文;
  • 页:CSJS201406007
  • 页数:5
  • CN:06
  • ISSN:14-1301/TP
  • 分类号:35-39
摘要
为了解决薄壁金属与非金属环形粘接件粘接质量的常规无损检测方法缺陷定位、定量准确性不高的问题,本文采用超声C扫描成像检测和接触式超声脉冲回波法,通过对环形粘接件人工缺陷对比试块、粘接产品件的检测,以及人工缺陷对比试块的解剖,对薄壁金属与非金属环形粘接件的粘接质量进行了研究.结果表明采用超声C扫描成像检测方法能检出大面积的脱粘缺陷和气孔缺陷,而接触式超声脉冲回波法无法区分粘接界面的缺陷信号,粘接缺陷无法被检出.因此超声C扫描成像检测方法对环形粘接件粘接质量具有良好的检测适用性和可靠性,是评价薄壁金属与非金属环形粘接件粘接质量有效的无损检测方法.
        Defects localization and quantification were not accuracy of thin-walled metal and non-metal annular specimen adhesive quality with conventional NDT methods; The article used ultrasonic C-scan imaging detection technology and ultrasonic pulse-echo contact method to study on adhesive quality of thin-walled metal and nonmetal annular specimen,Through artificial defects reference block was tested and dissected,and adhesive products were tested,The results show that ultrasonic C-scan imaging detection technology can detect large area debond defects and porosity defects,and ultrasonic pulse-echo contact method can not distinguish adhesive interface defects signal,adhesive defects are not detected; So ultrasonic C-scan imaging detection technology have good applicability and reliability of annular adhesive specimen adhesive quality,It is effective NDT method to evaluate thin-walled metal and non-metal annular specimen adhesive quality.
引文
[1]李建文,王增勇.孙朝明,等.粘接质量成像检测研究[J].中国胶粘剂,2010,19(6):1-3.Li Jianwen,Wang Zengyong,Sun Chaoming,et al.Study on testing ability of imaging method for bonding quality[J].China Adhesives,2010,19(6):1-3.(in Chinese)
    [2]王晓勇,熊建平,余天熊.薄壁金属与非金属材料粘接质量超声波检测[P].中国专利:102602204,2012-07-25.
    [3]谢道平.超声C扫描图像处理技术的研究[D].西安:西安科技大学,2007.
    [4]王文洪,薛锦,王裕文.超声成像无损检测及其图像处理技术研究[D].西安:西安交通大学,2013.
    [5]杨风暴,韩焱.金属与非金属粘接质量的声阵列检测方法[J].测试技术学报,2001,15(4):225-228.Yang Fengbao,Han Yan.A Microphone array detecting method for the detection of adhesive quality between metallic and nonmetallic components[J].Journal of Test and Measurement Technology,2001,15(4):225-228.(in Chinese)

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