基于玻璃-硅复合基板的微系统圆片级三维封装
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摘要
随着微系统追求更小的尺寸、更高的集成度,圆片级三维封装技术已成为未来微系统封装的发展趋势。基于玻璃回流工艺,提出了一种新型圆片级三维封装技术。设计了用于实现单模光纤阵列与玻璃基板上平面光波导之间耦合封装的U型槽阵列,采用高导硅作为垂直电引出,制备了玻璃-硅复合基板,并用玻璃帽实现了封装。玻璃-硅复合基板技术在三维微系统和光电子封装领域中具有重要的应用前景。
With the pursuit of smaller size and higher integration of microsystems, wafer-level 3 D packaging technology has been the trend of microsystem packaging. In this paper, a new wafer-level 3 D packaging technology based on glass reflow process is proposed. U-groove array for coupling and packaging of single mode fiber array and planar lightwave circuit on glass substrate is designed. Using highly-conductive Silicon as vertical electrical feedthroughs, Glass-Silicon composite substrate is fabricated, and the packaging is then realized by a glass cap. Glass-Silicon composite substrate technology shows great potential for 3 D microsystem and optoelectronic packaging.
With the pursuit of smaller size and higher integration of microsystems, wafer-level 3 D packaging technology has been the trend of microsystem packaging. In this paper, a new wafer-level 3 D packaging technology based on glass reflow process is proposed. U-groove array for coupling and packaging of single mode fiber array and planar lightwave circuit on glass substrate is designed. Using highly-conductive Silicon as vertical electrical feedthroughs, Glass-Silicon composite substrate is fabricated, and the packaging is then realized by a glass cap. Glass-Silicon composite substrate technology shows great potential for 3 D microsystem and optoelectronic packaging.
引文
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[6]黄翠.高性能硅通孔(TSV)三维互连研究[D].清华大学,2015.HUANG Cui. High performance through-Silicon-via in 3-D interconnection[D]. Tsinghua University, 2015.
[7]Zhao J C,Yuan Q, Kan X, et al. A low feed-through 3D vacuum packaging technique with Silicon vias for RF MEMS resonators[J].Journal of Micromechanics and Microengineering, 2016, 27(1):014003.
[8]Schroder H, Brusberg L, Erxleben R, et al. GlassPack-a3D glass based interposer concept for SiP with integrated optical interconnects[C].Proceedings of the 60~(th)IEEE Conference on Electronic Components and Technology,2010:1647-1652.
[9]Chou B, Vis W, Khan B, et al. Design and demonstration of micro-mirrors and lenses for low loss and low cost single-mode fiber coupling in 3D glass photonic interposers[C].Proceedings of the 66~(th)IEEE Conference on Electronic Components and Technology, 2016:497-503.
[10]Shang J T, Chen B Y, Lin W,et al. Preparation of waferlevel glass cavities by a low-cost chemical foaming process(CFP)[J].Lab on a Chip, 2011,11(8):1532-1540.
[11]Merz P, Quenzer H J, Bernt H, et al. A novel micromachining technology for structuring borosilicate glass substrates[C].Proceedings of the 12~(th)International Conference on Solid-State Sensors, Actuators and Microsystems, 2003,1:258-261.
[12]Schott. Thermal properties of Borofloat~((?))33[EB/OL].https://www.schott. com/borofloat/english/attribute/thermic/index.html.
[13]梁栋国.微壳体谐振器的驱动、检测和封装研究[D].东南大学,2018.LIANG Dong-guo.Study on actuation, detection and packaging technology of micro shell resonators[D]. Southeast University, 2018.
[14]Luo B, Ma M Y, Zhang M A, et al. Composite Glass-Silicon substrates embedded with microcomponents for MEMS system integration[J].IEEE Transactions on Components, Packaging and Manufacturing Technology,2019, 9(2):201-208.
[2]Carson F P, Kim Y C, Yoon I S. 3-D stacked package technology and trends[J]. Proceedings of the IEEE,2009, 97(1):31-42.
[3]Priyabadini S, Sterken T, Cauwe M, et al. High-yield fabrication process for 3D-stacked ultrathin chip packages using photo-definable polyimide and symmetry in packages[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2014, 4(1):158-167.
[4]Torunbalci M M, Alper S E, Akin T. Wafer level hermetic encapsulation of MEMS inertial sensors using SOI cap wafers with vertical feedthroughs[C]. International Symposium on Inertial Sensors and Systems, 2014:1-2.
[5]Zoschke K, Manier C A, Wilke M, et al. Hermetic wafer level packaging of MEMS components using through Silicon via and wafer to wafer bonding technologies[C].Proceedings of the 63~(rd)IEEE Conference on Electronic Components and Technology,2013:1500-1507.
[6]黄翠.高性能硅通孔(TSV)三维互连研究[D].清华大学,2015.HUANG Cui. High performance through-Silicon-via in 3-D interconnection[D]. Tsinghua University, 2015.
[7]Zhao J C,Yuan Q, Kan X, et al. A low feed-through 3D vacuum packaging technique with Silicon vias for RF MEMS resonators[J].Journal of Micromechanics and Microengineering, 2016, 27(1):014003.
[8]Schroder H, Brusberg L, Erxleben R, et al. GlassPack-a3D glass based interposer concept for SiP with integrated optical interconnects[C].Proceedings of the 60~(th)IEEE Conference on Electronic Components and Technology,2010:1647-1652.
[9]Chou B, Vis W, Khan B, et al. Design and demonstration of micro-mirrors and lenses for low loss and low cost single-mode fiber coupling in 3D glass photonic interposers[C].Proceedings of the 66~(th)IEEE Conference on Electronic Components and Technology, 2016:497-503.
[10]Shang J T, Chen B Y, Lin W,et al. Preparation of waferlevel glass cavities by a low-cost chemical foaming process(CFP)[J].Lab on a Chip, 2011,11(8):1532-1540.
[11]Merz P, Quenzer H J, Bernt H, et al. A novel micromachining technology for structuring borosilicate glass substrates[C].Proceedings of the 12~(th)International Conference on Solid-State Sensors, Actuators and Microsystems, 2003,1:258-261.
[12]Schott. Thermal properties of Borofloat~((?))33[EB/OL].https://www.schott. com/borofloat/english/attribute/thermic/index.html.
[13]梁栋国.微壳体谐振器的驱动、检测和封装研究[D].东南大学,2018.LIANG Dong-guo.Study on actuation, detection and packaging technology of micro shell resonators[D]. Southeast University, 2018.
[14]Luo B, Ma M Y, Zhang M A, et al. Composite Glass-Silicon substrates embedded with microcomponents for MEMS system integration[J].IEEE Transactions on Components, Packaging and Manufacturing Technology,2019, 9(2):201-208.