基于ATE的高端图像传感器芯片测试技术
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摘要
针对移动智能终端、安防监控、高清影像、航天航空等领域高端图像传感芯片产品测试需求,搭建基于自动测试设备ATE的测试环境。研究开发光电测试激励源硬件设计技术、图像传感芯片关键参数测试技术及测试算法。解决White Balance、Shading、Sensitivity、Point Defect、Blotch Defect、FPN等图像传感芯片关键参数测试难点,实现相关参数精准测试,形成整体测试解决方案,实际使用ATE针对一款高集成度图像传感芯片进行测试验证,完成光敏感度、暗场电流、坏点、坏列、固定图形噪声(FPN)、ADC性能、DSP性能等测试,形成基于ATE的高集成系统级芯片一体化测试解决方案。
For the testing requirements of high-end image sensor chips in mobile intelligent terminals, security monitoring, high-definition imaging, aerospace and other fields, a TE-based testing environment has been built. This paper studies and develops hardware design technology of photoelectric test excitation source, key parameters testing technology and testing algorithm of image sensor chip. It solves the difficulties of testing key parameters of image sensor chips such as White Balance, Shading, Sensitivity, Point Defect, Blotch Defect, FPN and so on. It achieves precise testing of relevant parameters and forms a whole testing solution. In practice, ATE is used to test and verify a highly integrated image sensor chip. It completes testing of light sensitivity, dark field current, bad points, bad columns, fixed graphics noise(FPN), ADC performance and DSP performance. It forms an integrated test solution for high-integrated system-level chips based on ATE.
For the testing requirements of high-end image sensor chips in mobile intelligent terminals, security monitoring, high-definition imaging, aerospace and other fields, a TE-based testing environment has been built. This paper studies and develops hardware design technology of photoelectric test excitation source, key parameters testing technology and testing algorithm of image sensor chip. It solves the difficulties of testing key parameters of image sensor chips such as White Balance, Shading, Sensitivity, Point Defect, Blotch Defect, FPN and so on. It achieves precise testing of relevant parameters and forms a whole testing solution. In practice, ATE is used to test and verify a highly integrated image sensor chip. It completes testing of light sensitivity, dark field current, bad points, bad columns, fixed graphics noise(FPN), ADC performance and DSP performance. It forms an integrated test solution for high-integrated system-level chips based on ATE.
引文
[1]陈榕庭,包军林,杜磊.CMOS图像传感器封装与测试技术[M].北京:电子工业出版社,2006.
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[2]董博彦.CMOS图像传感器的测试与分析[D].天津:天津大学,2005.
[3]池国泉.高性能CMOS图像传感器测试与评价系统的设计与实现[D].天津:天津大学,2008.
[4]高成,张栋王,香芬.CMOS最新集成电路测试技术[M].北京:国防工业出版社,2009.
[5]Teledyne.Imaging Sensors:Silicon CMOSimaging technologies for x-ray,UV,visible and near infrared[M].California,USA:Teledyne Imaging Sensors Camarillo,2012.
[6]Teradyen.Semiconductor Test-IP750EP Test System[M].Teradyne,2018.