摘要
聚偏氟乙烯(PVDF)是一种具有热电性和压电性的聚合物,由于其具有良好的柔韧性、热稳定性和耐腐蚀性等优点,因此在电子电气领域具有广阔的应用前景,但相对于传统无机类压电材料来说,其介电常数和压电常数仍相对较低,因此提升PVDF的压电性能和介电性能已成为目前国内外的研究热点之一。本文对近年来国内外利用金属及其化合物来提高聚偏氟乙烯(PVDF)电性能的方法进行了概述,并对金属及其化合物掺杂PVDF的利弊及发展趋势进行了展望。
Polyvinglidene fluoride(PVDF)is a kind of polymer with pyroelectric and piezoelectric properties.It is an ideal candidate material in the electrical and electronic field because of its better flexibility,thermal stability and corrosion resistance and so on.However,compared with traditional inorganic piezoelectric materials,its dielectric constant and piezoelectric constant of PVDF are much lower,so now how to improve the dielectric and piezoelectric properties of PVDF has become one international research hot spot.The recent advance on the methods of improving the dielectric or piezoelectric properties of polyvinylidene fluoride(PVDF)by hybridization of metal particles and metal compounds is reviewed in the paper.Advantages and disadvantages of this method are discussed,and the future research trend of hybrid PVDF for improving the electric properties are prospected meanwhile.
引文
[1]Bama G K,Devi P I,Ramachandran K.J Mater Sci,2009,44(5):1302~1307.
[2]Lang S B,Muensit S.Appl Phys A-Mater,2006,85(2):125~134.
[3]Zak A K,Gan W C,Majid W H A,Darroudi M,Velayutham T S.Ceram Int,2011,37(5):1653~1660.
[4]Li Y J,Iwakura Y,Shimizu H.J Nanosci Nanotechno,2008,8(4):1714~1720.
[5]Tawansi A,Oraby A,Badr S,Elashmawi I.Polym Int,2004,53(4):370~377.
[6]Benz M,Euler W B.J Appl Polym Sci,2003,89(4):1093~1100.
[7]Shimizu H,Li Y,Kaito A,Sano H.J Nanosci Nanotechno,2006,6(12):3923~3928.
[8]李海蓉.聚偏氟乙烯基复合材料的结构调控与介电性能研究.武汉:武汉理工大学博士学位论文,2014.
[9]李振强.改性纳米银/陶瓷/PVDF复合材料及介电性能的研究.武汉:武汉工程大学硕士学位论文,2015.
[10]Yang W,Yu S,Sun R,Du R.International Conference on Electronic Packaging Technology&High Density Packaging,Xi'an,2010:460~463.
[11]Schico C.Thermal and electrical properties of PVDF/Cu nanocomposites.Aveiro:University of Aveiro,2011.
[12]Zhou W,Wang Z,Dong L,Sui X,Chen Q.Compos Part A Appl Sci Manuf,2015,79:183~191.
[13]Chilvery A K,Batra A K,Thomas M.Phys Sci Int J,2014,5(4):734~741.
[14]Gaur M S,Indolia A P.J Therm Anal Calorim,2011,103(3):977~985.
[15]Dodds J S,Meyers F N,Loh K J,Dodds J S.Smart Struct Syst,2013,12(12):55~71.
[16]Wang G,Deng Y,Yan X,Lin G.Adv Funct Mater,2008,18(17):2584~2592.
[17]王玉琼,李梦轲,张天民,李雅楠,杨蕊,付宏波,孙杰婷,许宁宁,王军艳.中国科学:化学,2014,44(10):1609~1617.
[18]Zhao X,Zhang W,Chen S,Zhang J.J Polym Res,2012,19(5):1~9.
[19]Yu L Y,Xu Z L,Shen H M,Yang H.J Membrane Sci,2009,337(1/2):257~265.
[20]Yue Y L,Gong Y S,Wu H T,Wang C B,Zhang L M.Phys Chem Chem Phys,2014,17(2):1368~1378.
[21]刘卉,刘云飞,吕忆农,俞正磊.南京工业大学学报(自科版),2016,38(4):28~32.
[22]刘小楠,杨世源,毕新利,王军霞.功能材料,2008,39(3):406~409.
[23]王芳芳.CCTO/PVDF复合薄膜的制备及介电性能研究.北京:北京理工大学硕士学位论文,2014.
[24]王法军,周东祥,龚树萍,郑志平.材料导报,2009(10):11~13.
[25]Zhou T,Zha J,Cui R,Fan B,Yuan J,Dang Z.ACS Appl Mater Inter,2011,3(7):2184.
[26]Dang Z M,Zha J W,Yu Y,Zhou T.IEEE Trans Dielectr Electr Insul,2011,18(5):1518~1525.
[27]林国明.PVDF/陶瓷粉体/碳系填料复合材料的制备及介电性能研究.上海:上海师范大学硕士学位论文,2014.
[28]Seol J H,Lee J S,Ji H N,Ok Y P,Kong G P,Kim K S,Chang Y K,Tai W P.Ceram Int,2012,38:S263~S266.
[29]Srivastava A,Jana K K,Maiti P,Kumar D,Parkash O.Mater Res Bull,2015,70(3):735~742.
[30]Wang Y J,Zhai J W,Wang F F,Feng C G.Adv Mat Res,2014,989/994:242~245.
[31]Chen G,Wang X,Lin J,Yang W,Li H,Wen Y,Li L,Jiang Z,Lei Q.J Mater Chem C,2016,4(34).
[32]Feng D,Yu K,Wang H.J Adv Phys,2015,4:384~387.
[33]Panda M,Adyam V,Srinivas V,Thakur A K.Carbohyd Polym,2008,1003(1):78~86.
[34]Zhang X,Chen W,Wang J,Shen Y,Gu L,Lin Y,Nan C W.Nanoscale,2014,6(12):6701~6709.
[35]Zheng H,Liu X,Dou X,Chen J.Acta Materiae Compositae Sinica,2014,31(1):146~151.