压电陶瓷圆片单面研磨抛光工艺

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英文篇名：Single-Side Grinding and Polishing Process of Piezoelectric Ceramics Wafer 作者：鄢秋娟 ; 罗夏林 ; 米佳 ; 李洪平 ; 谭桂娟 ; 刘善群 ; 唐运红 ; 于新晓 ; 张静雯 英文作者：YAN Qiujuan;LUO Xialin;MI Jia;LI Hongping;TAN Guijuan;LIU Shanqun;TANG Yunhong;YU Xinxiao;ZHANG Jingwen;The 26th Institute of China Electronics Technology Group Corporation; 关键词：单抛晶片 ; 双面研磨 ; 双面抛光 ; 化学腐蚀 ; 水溶粘接剂 英文关键词：single-side-polished wafer;;double-side grinding;;double-side polishing;;chemical etching;;water-solubility adhesive 中文刊名：YDSG 英文刊名：Piezoelectrics & Acoustooptics 机构：中国电子科技集团公司第二十六研究所; 出版日期：2018-08-15 出版单位：压电与声光 年：2018 期：v.40;No.241 语种：中文; 页：YDSG201804026 页数：4 CN：04 ISSN：50-1091/TN 分类号：112-115

摘要

介绍了一种在行星式双面磨抛设备上对压电陶瓷圆片进行单面研磨和抛光的工艺。在加工过程中,使用了自制的全水溶性粘接剂来粘接晶片,实现了圆片单面所有磨抛加工流程都在双面磨抛设备上进行。采用自制化学腐蚀液分段腐蚀控制圆片形貌(翘曲度)的变化,中间研磨工序优化介质控制表面粗糙度和划道、SiO2胶体化学机械抛光去除亚损伤层,获得了高品质的铝钛酸铝压电陶瓷(PZT)单面抛光圆片。
        A single-side-grinding and polishing process of piezoelectric ceramics wafer on a planetary double-side grinding and polishing equipment is presented in this paper.The self-prepared full-water-solubility adhesive is used to bond the wafers in the processing,and all the single-side grinding and polishing processes of wafer are carried out on the double-sided grinding and polishing equipment.The change of wafer morphology(warp)is step-controlled by the self-prepared chemical etching solution,the surface roughness and path of the wafers are controlled by the optimal medium in the intermediate grinding process,the sub-damaged layer of wafers are removed by the chemical mechanical polishing with SiO2 colloid.Finally,the high quality PZT ceramic single-side-polished wafers are obtained.

引文

[1]杨信伟,孙军,王军.晶片行星式研磨抛光机运动模拟研究[J].沈阳建筑大学学报(自然科学版),2000,16(4):292-294.
    [2]许君.高精度数控立式双面研磨机设计与开发[D].长沙:湖南大学,2014.