可打印硼硅酸盐玻璃陶瓷浆料的制备及其流变性能研究
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摘要
通过讨论粉末粒径、分散剂、固含量、粘结剂、增塑剂对陶瓷浆料流变性能及打印效果的影响规律,研究了高浓度、良好分散的可打印硼硅酸盐玻璃陶瓷浆料的制备方法,并采用3D打印直写技术实现了硼硅酸盐玻璃陶瓷基板的成型。研究结果表明:当分散剂为质量分数3%,粘结剂为质量分数4%,增塑剂与粘结剂质量比为0. 4,固含量为质量分数46%时,浆料可打印性较好,粘度约为2660 mPa·s。采用所制备浆料打印的基板表面平整,经过烧结后内部结构致密,相对介电常数为5. 4,介电损耗为0. 0017,满足电路基板的使用需求。
The preparation method of printable borosilicate glass-ceramic slurry with high concentration and good dispersion was invented by comprehensively investigating the effect of powder size, dispersant, solid content, binder and plasticizer on the rheological properties and printing of the slurry. The borosilicate-glass ceramic substrate was 3D printed by direct writing technology using the slurry. The results showthat the slurry has best printability with the viscosity ～2660 mPa·s when the dispersant is 3%,the binder is 4%,the ratio of plasticizer to binder is 0. 4,and the solid content is 46%. The surface of the printed substrate is smooth,and the internal structure is compact after sintering. It satisfies the application requirement of the circuit substrate with the permittivity of 5. 4 and the dielectric loss of 0. 0017.
The preparation method of printable borosilicate glass-ceramic slurry with high concentration and good dispersion was invented by comprehensively investigating the effect of powder size, dispersant, solid content, binder and plasticizer on the rheological properties and printing of the slurry. The borosilicate-glass ceramic substrate was 3D printed by direct writing technology using the slurry. The results showthat the slurry has best printability with the viscosity ～2660 mPa·s when the dispersant is 3%,the binder is 4%,the ratio of plasticizer to binder is 0. 4,and the solid content is 46%. The surface of the printed substrate is smooth,and the internal structure is compact after sintering. It satisfies the application requirement of the circuit substrate with the permittivity of 5. 4 and the dielectric loss of 0. 0017.
引文
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[2]吴怀宇.3D打印:三维智能数字化创造[M].北京:电子工业出版社,2014.
[3]Sun K,Wei T S,Ahn B Y,et al.3D printing of interdigitated Li-ion microbattery architectures[J].Advanced M aterials,2013,25:4539-4543.
[4]古良玲,全晓莉.3D打印技术在电子元器件研制中的应用展望[J].电子元件与材料,2014,33(1):67-68.
[5]姚义俊,丘泰.氮化铝基板流延成型浆料的研究[J].材料科学与工程学报,2006(3):423-425.
[6]张金利,王灿,季惠明.Ba Sr Ti O3-M g O流延浆料中溶剂组分的优化[J].电子元件与材料,2013,32(11):19-22.
[7]王洪涛,陈枭,白小波,等.球磨法制备超细碳化硅粉体[J].中国粉体技术,2015,21(5):9-13.
[8]李勇君,裘进浩,朱孔军,等.PNN-PZT陶瓷流延浆料流变性能研究[J].电子元件与材料,2008,27(12):15-18.
[9]程程.压电陶瓷制备中分散剂的添加对陶瓷片性能一致性的影响[D].贵阳:贵州大学,2017.
[10]刘亮,廖艳梅,颜宏艳,等.Zr O2陶瓷流延浆料的流变特性的研究[J].人工晶体学报,2013,42(8):1595-1600.
[11]李斌,冯春霞,焦宝祥,等.Zr O2基陶瓷注凝成型料浆流变性的研究[J].南京工业大学学报(自然科学版),2005(5):89-92.