微细电沉积加工技术浅析及实验研究
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摘要
简要分析了微细电沉积加工的两种典型技术——磁电沉积技术和超声沉积技术,并结合中物院机械制造工艺研究所的研究设备,开展了微细电沉积的初步实验研究,在铜基底上实现了直径25μm、高300μm的微小圆柱的电沉积加工,并通过仿真分析解释了沉积样件直径小于微细电极直径的原因。
Two typical technology of micro-electroforming are discussed and relevant experiments are taken to study the mechanism of micro-electroforming using equipments developed by IMMT,China Academy of Engineering Physics,in which a nickel micro column with diameter of 25 μm,height of300 μm is deposited on copper and further study is accomplished with FEA method.
Two typical technology of micro-electroforming are discussed and relevant experiments are taken to study the mechanism of micro-electroforming using equipments developed by IMMT,China Academy of Engineering Physics,in which a nickel micro column with diameter of 25 μm,height of300 μm is deposited on copper and further study is accomplished with FEA method.
引文
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[11]贾晶,钟云波,汪超,等.强磁场中电沉积Ni-P合金的研究[J].上海金属,2009,31(4):10-14.
[12]CHOUCHANE S,LEVESQUE A,ZABINSKI P,et al.Electrochemical corrosion behavior in Na Cl medium of zinc-nickel alloys electrodeposited under applied magnetic field[J].Journal of Alloys and Compounds,2010,506(2):575-580.
[13]杨中东,高鹏,薛向欣,等.稳恒磁场下Ni-W合金镀膜的制备与耐蚀性[J].中国有色金属学报,2006,16(10):1710-1715.
[14]ROBERT W.Ultrasound and electroplating[J].Chemistry in Britain,1990,26(3):251-254.
[15]HYDEME,COMPTON R G.How ultrasound influences the electrodeposition of metals[J].Journal of Electroanalytical Chemistry 2002,531(1):19-24.
[16]TOUYERAS F,HIHN J Y,BOURGOIN X,et al.Effects of ultrasonic irradiation on the properties of coatings obtained by electroless plating and electroplating[J].Ultrasonics Sonochemistry,2005,12(1-2):13-19.
[17]CHIBA A,HAIJIMA H,KOBAYASHI K.Effect of sonication and vibration on the electroless Ni-B deposited film from acid bath[J].Surface and Coatings Technology,2003,169-170(1):104-107.
[18]NILSON R H,GRIFFITHS S K.Enhanced transport by acoustic streaming in deep trench-like cavities[J].Journal of the Electrochemical Society,2002,149(4):286-296.
[19]司东宏,薛玉君,申晨.超声电沉积制备Ni-Zr O2纳米复合镀层及其结构和性能的研究[J].表面技术,2010,39(3):10-12.
[20]WENG F T.A study of cathode agitation in ultrasonicaided microelectroforming[J].The International Journal of Advanced Manufacturing Technology,2005,25(9-10):909912.
[21]MADDEN J D W,HUNTER I W.Three-dimensional microfabrication by localized electrochemical deposition[J].Journal of Microelectrochemical Systems,1996,5(1):24-32.
[2]牟世辉,袁艳,姚淑霞.稳恒磁场对电镀铬的影响[J].沈阳工业学院学报,2004,23(2):83-85.
[3]ISPAS A,MATSUSHIMA H,BUND A,et al.Nucleation and growth of thin nickel layers under the influence of a magnetic field[J].Journal of Electroanalytical Chemistry,2009,626(1-2):174-182.
[4]KRAUSE A,KOZA J,ISPAS A,et al.Magnetic field induced micro-convective phenomena inside the diffusion layer during the electrodeposition of Co,Ni and Cu[J].Electrochimica Acta,2007,52(22):6338-6345.
[5]KRAUSE A,UHLEMANN M,GEBERT A,et al.The effect of magnetic fields on the electrodeposition of cobalt[J].Electrochimica Acta,2004,49(24):4127-4134.
[6]KOZAJ A,UHLEMANN M,GEBERT A,et al.The effect of magnetic fields on the electrodeposition of Co Fealloys[J].Electrochimica Acta,2008,53(16):5344-5353.
[7]QU N S,CHAN K C,ZHU D.Surface roughening in pulse current and pulse reverse current electroforming of nickel[J].Surface and Coatings Technology,1997,91(3):220-224.
[8]ISPAS A,MATSUSHIMA H,PLIETH W,et al.Influence of a magnetic field on the electrodeposition of nickel-iron alloys[J].Electrochimica Acta,2007,52(8):2785-2795.
[9]刘志勇,孙孟良,范峰,等.磁场下镍电沉积层织构及表面形貌[J].功能材料,2010,41(8):1422-1425.
[10]TABAKOVIC I,RIEMER S,VAS'KO V,et al.Effect of magnetic field on electrode reactions and properties of electrodeposited Ni Fe Films[J].Journal of Electrochemical Society,2003,150(9):635-640.
[11]贾晶,钟云波,汪超,等.强磁场中电沉积Ni-P合金的研究[J].上海金属,2009,31(4):10-14.
[12]CHOUCHANE S,LEVESQUE A,ZABINSKI P,et al.Electrochemical corrosion behavior in Na Cl medium of zinc-nickel alloys electrodeposited under applied magnetic field[J].Journal of Alloys and Compounds,2010,506(2):575-580.
[13]杨中东,高鹏,薛向欣,等.稳恒磁场下Ni-W合金镀膜的制备与耐蚀性[J].中国有色金属学报,2006,16(10):1710-1715.
[14]ROBERT W.Ultrasound and electroplating[J].Chemistry in Britain,1990,26(3):251-254.
[15]HYDEME,COMPTON R G.How ultrasound influences the electrodeposition of metals[J].Journal of Electroanalytical Chemistry 2002,531(1):19-24.
[16]TOUYERAS F,HIHN J Y,BOURGOIN X,et al.Effects of ultrasonic irradiation on the properties of coatings obtained by electroless plating and electroplating[J].Ultrasonics Sonochemistry,2005,12(1-2):13-19.
[17]CHIBA A,HAIJIMA H,KOBAYASHI K.Effect of sonication and vibration on the electroless Ni-B deposited film from acid bath[J].Surface and Coatings Technology,2003,169-170(1):104-107.
[18]NILSON R H,GRIFFITHS S K.Enhanced transport by acoustic streaming in deep trench-like cavities[J].Journal of the Electrochemical Society,2002,149(4):286-296.
[19]司东宏,薛玉君,申晨.超声电沉积制备Ni-Zr O2纳米复合镀层及其结构和性能的研究[J].表面技术,2010,39(3):10-12.
[20]WENG F T.A study of cathode agitation in ultrasonicaided microelectroforming[J].The International Journal of Advanced Manufacturing Technology,2005,25(9-10):909912.
[21]MADDEN J D W,HUNTER I W.Three-dimensional microfabrication by localized electrochemical deposition[J].Journal of Microelectrochemical Systems,1996,5(1):24-32.