金刚石表面真空镀镍的工艺探讨
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  • 英文篇名:Discussion on the Technology of Vacuum Nickel Plating on Diamond Surface
  • 作者:万容兵 ; 何健霞 ; 赵涛
  • 英文作者:WAN Rong-bing;HE Jian-xia;ZHAO Tao;Zhejiang Ruiyi New Material Technology Co., Ltd;Zhejiang Ruidu New Material Technology Co., Ltd;
  • 关键词:金刚石镀覆 ; 真空镀镍 ; 干法镀镍 ; 镍源 ; EDTA二钠 ; 有机酸 ; 电镀金刚石线
  • 英文关键词:diamond coating;;vacuum nickel plating;;dry nickel plating;;nickel source;;EDTA disodium;;organic acid;;electroplated diamond wire
  • 中文刊名:BMJS
  • 英文刊名:Surface Technology
  • 机构:浙江瑞翌新材料科技股份有限公司;浙江瑞度新材料科技有限公司;
  • 出版日期:2019-03-20
  • 出版单位:表面技术
  • 年:2019
  • 期:v.48
  • 语种:中文;
  • 页:BMJS201903034
  • 页数:6
  • CN:03
  • ISSN:50-1083/TG
  • 分类号:248-253
摘要
目的探讨金刚石表面真空镀镍的影响因素及其在电镀金刚石线上应用的可行性。方法采用不同的镍源及EDTA二钠、有机酸、氧化铝,按照不同的配比配制镀液,在720℃、真空度6×10?2 Pa条件下镀覆,保温2.5h,通过粒度分析、快速振动球磨机、能谱分析、三维数字显微镜、磁性测试、镀层快速腐蚀测试等表征手段,探讨不同的工艺对金刚石表面镀层性能的影响。结果镀覆后,金刚石中心粒径D50和峰宽(峰宽D95-D5,中心粒径D50是粒度分布曲线中累积分布为50%时的最大颗粒的等效直径,D5、D95分别是分布曲线中累积分布为5%、95%时的最大颗粒的等效直径)随着氯化镍含量的增加而增大,随着EDTA二钠含量的增加而减小。有机酸对镀覆反应的促进为:柠檬酸>氯乙酸>乳酸。通过真空镀镍获得的镀层表面为镍金属层,具有磁性。金刚石的强度没有受到石墨化的影响而下降,镀层与金刚石之间结合较为牢固,且耐酸液腐蚀性能远好于化学镀镍。以氯化镍为镍源的真空镀镍金刚石,采用埋砂法在电镀金刚石线设备进行上砂测试,在10m/min的走线速度下,0.4mm长度钢线表面的金刚石约60颗,约为化学镀镍金刚石上砂颗粒数的30%。结论通过真空镀覆方式能够在金刚石表面沉积金属镍层,经初步测试,可以在电镀金刚石线中使用。
        The work aims to investigate the influencing factors of vacuum nickel plating on diamond surface and the feasibility of its application on diamond plating line. EDTA disodium, organic acid and aluminum oxide were coated with different nickel sources according to different mixing ratios at 720 ℃and 6×10?2 Pa vacuum for 2.5 h. The effects of different processes on coating on diamond surface were discussed by characterizing means such as particle size analysis, rapid vibration ball mill,energy spectrum analysis, three-dimensional digital microscope, magnetic test and rapid corrosion test. The diamond centre diameter D50 and peak width(D95-D5, the diamond centre diameter D50 was the maximum equivalent diameter of the diamond particles with a cumulative distribution of 50% in the particle size distribution curve. The D5 and D95 were the maximum equivalent diameters when the cumulative distribution was 5% and 95% in the distribution curve, respectively) increased with the increase of nickel oxide content after plating. D50 and peak width decreased with the increase of EDTA disodium. Organic acid promoted the plating reaction: citric acid>chloroacetic acid>lactic acid. Plating surface obtained by vacuum nickel plating was magnetic nickel metal layer. Diamond strength was not affected by graphitization and did not decline. The bonding between coating and diamond was firm, and acid corrosion resistance was much better than that of electroless nickel plating. The vacuum nickel-plated diamond with nickel chloride as nickel source was sanded on the equipment of buried-sand electroplating diamond wire. The number of diamond particles on 10 m/min, 0.4 mm length and 65 μm bus was 60, which was about 30% of that on electroless nickel-plated diamond. Metal nickel layer can be deposited on the diamond by vacuum plating and can be used in the production of electroplated diamond wire.
引文
[1]SUNG C M.Superabrasive wire saw and associated methods of manufacture:U S,6915796B2[P].2005.
    [2]黄世玲,张迎九,杨德林.金刚石化学镀镍的研究[J].表面技术,2015(6):66-69.HUANG Shi-ling,ZHANG Ying-Jiu,YANG De-lin.Study of electroless planting nickel on diamond surface[J].Surface technology,2015(6):66-69.
    [3]WANG Yang-hui,ZANG Jian-bing,WANG Ming-zhi,et al.Properties and applications of Ti-coated diamond grits[J].Journal of materials processing technology,2002,129(1-3):369-372.
    [4]BAILEY M W,COLLIN W D.Dee beers titanized metal bond diamond grit and related investigations into the sawing of stone and concrete[J].Industiral diamond review,1978(1):8-13.
    [5]NGUYEN V H,HOANG T N,KWON S C,et al.Study on the properties of chromium matrix composite plated with nanosized diamond powders[J].Advanced materials research,2007,26-28:1361-1364.
    [6]臧建兵,王艳辉,王明智.Ti?Mo?W?Cr及其合金镀层与超硬磨料之间结合性能的研究[J].金刚石与磨料磨具工程,1997(2):6-9.ZANG Jian-bing,WANG Yan-hui,WANG Ming-zhi.Study on the bonding properties between Ti,Mo,W,Cr alloy coatings and superhard abrasives[J].Diamond and abrasive tools engineering,1997(2):6-9.
    [7]谭立新,余志明,蔡一湘.激光粒度法测试结果与库尔特法?沉降法的比较[J].中国粉体技术,2009,15(3):60-63.TAN Li-xin,YU Zhi-ming,CAI Yi-xiang.Measurement results comparison between laser analyzer,coulter counter and pipette methods[J].China powder scienceand technology,2009,15(3):60-63.
    [8]李雨,杨晨,刘定富.络合剂对化学镀镍-磷合金的影响[J].电镀与精饰,2015,37(2):33-36.LI Y,YANG C,LIU D F.The impact of complexing agents on electroless Ni-P alloy plating[J].Planting and finishing,2015,37(2):33-36.
    [9]HUANG Y S,CUI F Z.Effect of complexing agent on the morphology and microstructure of electroless deposited Ni-P alloy[J].Surface&coatings technology,2007,201(9):5416-5418.
    [10]BURGSTALLER A,SOCHER W,VOITLANDER J,et al.Magnetic studies of amorphous Ni-P alloys[J].Journal of magnetism&magnetic materials,2015,109(1):117-123.
    [11]梁振刚,沈明礼,卢旭东,等.活化剂对渗铬层结构和成分影响[J].功能材料,2015,46(13):1106-13110.LIANG Zhen-gang,SHEN Ming-li,LU Xu-dong,et al.Effect of activators on the microstructure and composition of chromizing coatings in pack cementation method[J].Functional materials,2015,46(13):13106-13110.
    [12]NAIDICH Y V,KOLESNICHENKO G A.Investigation of the wetting of diamond and graphite by molten metals and alloys[J].Soviet powder metallurgy&metal ceramics,1966,5(2):156-158.
    [13]陶刚,王松娟,吕国强,等.人造金刚石微粉颗粒强度检测方法的研究[M].杭州:浙江大学出版社,2014:179-186.TAO Gang,WANG Song-juan,LYU Guo-qiang,et al.Study on the method of testing the particle strength of artificial diamond powder[M].Hangzhou:Zhejiang University Press,2014:179-186.
    [14]WANG Yan-hui,ZANG Jian-bing,WANG Ming-zhi,et al.Relationship of interface microstructure and adhesion strength between Ti coating and diamond[J].Key engineering materials,2003,250(1):41-45.
    [15]MOUSAVI A S H,MASOUD S,ROGHANI Z M,et al.The effect of electroless bath parameters and heat treatment on the properties of Ni-P and Ni-P-Cu composite coatings[J].Materials research,2018,21(2):e20170973.

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