铜及铜合金加工材热镀锡研究进展
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摘要
近年来,工业环保的要求越来越严格,在很大程度上制约了电镀锡技术的发展和应用。同时,随着通讯和电力产业规模的不断扩大,对镀锡铜材的需求量随之增加。镀锡铜材的抗氧化能力强,接触电阻小,因而具有良好的焊接性和导电性。热镀锡技术作为镀锡铜材生产中的一种关键工艺,具有成本低、效率高、工艺流程简单、环境友好等特点,在电工、电子、能源等领域有着广泛的应用。从热镀锡技术的原理和特点,影响热镀锡质量的关键工艺参数(包括预处理、助镀剂、镀液的成分等),常见工艺缺陷以及废锡的处理和回收等方面综述了近年来铜加工材热镀锡技术的研究进展。
Recently, the development and application of electroplating tin have been significantly constrained due to the increasingly stringent requirements of industrial environmental protection.Meanwhile, the demand for tin-plated copper is increased with the continuous expansion of the communications and power industry. Tin-dipped copper has strong antioxidant capacity and low contact resistance; therefore, it shows good weldability and conductivity. As a key technology in the production of tin-dipped copper, hot tin plating process has the advantages of low cost, high efficiency, simple procedure, and environment friendly traits. It has been widely used in the field of electrical and electronic engineering, energy engineering, and so on. Recent research progress of hot tin dipping process for copper is reviewed by introducing its principle and characteristics, key process parameters influencing the quality of hot dipping(i.e. pretreatment, flux, composition of plating solution, ect),common process defects, the treatment and recovery of scrap tin, and so on.
Recently, the development and application of electroplating tin have been significantly constrained due to the increasingly stringent requirements of industrial environmental protection.Meanwhile, the demand for tin-plated copper is increased with the continuous expansion of the communications and power industry. Tin-dipped copper has strong antioxidant capacity and low contact resistance; therefore, it shows good weldability and conductivity. As a key technology in the production of tin-dipped copper, hot tin plating process has the advantages of low cost, high efficiency, simple procedure, and environment friendly traits. It has been widely used in the field of electrical and electronic engineering, energy engineering, and so on. Recent research progress of hot tin dipping process for copper is reviewed by introducing its principle and characteristics, key process parameters influencing the quality of hot dipping(i.e. pretreatment, flux, composition of plating solution, ect),common process defects, the treatment and recovery of scrap tin, and so on.
引文
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[14]GAGLIANO R A,GHOSH G,FINE M E.nucleation kinetics of Cu6Sn5 by reaction of molten tin with a copper substrate[J].Journal of Electronic Materials,2002,31(11):1195-1202.
[15]YU D Q,WU C M L,LAW C M T,et al.Intermetallic compounds growth between Sn-3.5Ag lead-free solder and Cu substrate by dipping method[J].Journal of Alloys and Compounds,2005,392(1/2):192-199.
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[18]孙欣,娄堤征.新型金属镀层材料在镀层铜线上应用[J].电线电缆,2000(1):33-35.
[19]KAKESHITA T,SHIMIZU K,KAWANAKA R,et al.Grain size effect of electro-plated tin coatings on whisker growth[J].Journal of Materials Science,1982,17(9):2560-2566.
[20]SIDOT E,SOUISSI N,BOUSSELMI L,et al.Study of the corrosion behaviour of Cu-10Sn bronze in aerated Na2SO4 aqueous solution[J].Corrosion Science,2006,48(8):2241-2257.
[21]SOUISSI N,SIDOT E,BOUSSELMI L,et al.Corrosion behaviour of Cu-10Sn bronze in aerated NaCl aqueous media-Electrochemical investigation[J].Corrosion Science,2007,49(8):3333-3347.
[22]LI J F,MANNAN S H,CLODE M P,et al.Interfacial reactions between molten Sn-Bi-X solders and Cu substrates for liquid solder interconnects[J].Acta Materialia,2006,54(11):2907-2922.
[23]KONG X,LI H P,LUO K B,et al.Research advance on comprehensive utilization of the tin scraps[J].Science&Technology in Chemical Industry,2011,19(2):59-63.
[24]ZANG L K,YUAN Z F,CAO Z M,et al.Reactive wetting processes and triple-line configuration of Sn-3.5Ag on Cu substrates at elevated temperatures[J].Journal of Electronic Materials,2012,41(8):2051-2056.
[25]王星星,龙伟民,裴夤崟,等.BAg45CuZn钎料表面化学镀锡的研究[J].表面技术,2013,42(3):56-58,107.
[26]NARAYANAN T S N S,PARK Y W,LEE K Y.Fretting corrosion of lubricated tin plated copper alloy contacts:Effect of temperature[J].Tribology International,2008,41(2):87-102.
[27]赵杰,李宁,孙武,等.化学镀锡晶须的研究进展[J].电镀与环保,2006,26(4):1-3.
[28]ILLéS B,HORVáTH B,HARSáNYI G.Effect of strongly oxidizing environment on whisker growth form tin coating[J].Surface and Coatings Technology,2010,205(7):2262-2266.
[2]黄崇祺.中国金属导体制造业的创新开发与发展趋向[J].有色金属材料与工程, 2016, 37(3):64–71.
[3]李冰洁,江旭东,潘春旭.铜锡青铜合金腐蚀过程中的电化学与微结构特征研究[J].材料导报, 2017, 31(11):138–143.
[4]CHANG T C,HON M H,WANG M C.Intermetallic compounds formation and interfacial adhesion strength of Sn-9Zn-0.5Ag solder alloy hot-dipped on Cu substrate[J].Journal of Alloys and Compounds,2003,352(1/2):168-174.
[5]吴圣杰,刘新院,李化龙,等.高硬度镀锡板的时效敏感性[J].金属热处理,2016,41(8):24-28.
[6]刘鹏忠,陈小红,刘平.铜基石墨烯复合材料的制备及性能研究[J].有色金属材料与工程,2017,38(6):344-350.
[7]王立生,林涛,邵慧萍,等.热处理对热浸镀镍基涂层组织及性能的影响[J].金属热处理,2010,35(12):51-55.
[8]LANDRY K,RADO C,VOITOVICH R,et al.Mechanisms of reactive wetting:the question of triple line configuration[J].Acta Materialia,1997,45(7):3079-3085.
[9]TAN J,WANG J,GAO H Y,et al.Recent advances in high strength galvannealed steel steels[J].Materials Review,2008,22(2):64-67.
[10]董博文,龙伟民,张青科,等.BCu68Zn钎料表面热浸镀锡的工艺研究[J].精密成形工程,2015,7(1):61-65.
[11]宋明明,刘春昉.圆铜线热镀锡生产工艺的探讨[J].光纤与电缆及其应用技术,2010(5):32-35.
[12]王旭艳,薛松柏,禹胜林,等.温度与镀层对Sn-AgCu无铅钎料润湿性的影响[J].焊接学报,2005,26(10):93-96.
[13]王俭辛,薛松柏,韩宗杰,等.温度与镀层对Sn-CuNi无铅钎料润湿性能的影响[J].焊接学报,2006,27(10):53-56.
[14]GAGLIANO R A,GHOSH G,FINE M E.nucleation kinetics of Cu6Sn5 by reaction of molten tin with a copper substrate[J].Journal of Electronic Materials,2002,31(11):1195-1202.
[15]YU D Q,WU C M L,LAW C M T,et al.Intermetallic compounds growth between Sn-3.5Ag lead-free solder and Cu substrate by dipping method[J].Journal of Alloys and Compounds,2005,392(1/2):192-199.
[16]YU D Q,DUAN L L,ZHAO J,et al.The growth behaviors of intermetallic compounds between Sn-3.5Ag and Cu substrate[J].Material Science and Technology,2005,13(5):532-536.
[17]BAATED A,KIM K S,SUGANUMA K.Effect of intermetallic growth rate on spontaneous whisker growth from a tin coating on copper[J].Journal of Materials Science:Materials in Electronics,2011,22(11):1685-1693.
[18]孙欣,娄堤征.新型金属镀层材料在镀层铜线上应用[J].电线电缆,2000(1):33-35.
[19]KAKESHITA T,SHIMIZU K,KAWANAKA R,et al.Grain size effect of electro-plated tin coatings on whisker growth[J].Journal of Materials Science,1982,17(9):2560-2566.
[20]SIDOT E,SOUISSI N,BOUSSELMI L,et al.Study of the corrosion behaviour of Cu-10Sn bronze in aerated Na2SO4 aqueous solution[J].Corrosion Science,2006,48(8):2241-2257.
[21]SOUISSI N,SIDOT E,BOUSSELMI L,et al.Corrosion behaviour of Cu-10Sn bronze in aerated NaCl aqueous media-Electrochemical investigation[J].Corrosion Science,2007,49(8):3333-3347.
[22]LI J F,MANNAN S H,CLODE M P,et al.Interfacial reactions between molten Sn-Bi-X solders and Cu substrates for liquid solder interconnects[J].Acta Materialia,2006,54(11):2907-2922.
[23]KONG X,LI H P,LUO K B,et al.Research advance on comprehensive utilization of the tin scraps[J].Science&Technology in Chemical Industry,2011,19(2):59-63.
[24]ZANG L K,YUAN Z F,CAO Z M,et al.Reactive wetting processes and triple-line configuration of Sn-3.5Ag on Cu substrates at elevated temperatures[J].Journal of Electronic Materials,2012,41(8):2051-2056.
[25]王星星,龙伟民,裴夤崟,等.BAg45CuZn钎料表面化学镀锡的研究[J].表面技术,2013,42(3):56-58,107.
[26]NARAYANAN T S N S,PARK Y W,LEE K Y.Fretting corrosion of lubricated tin plated copper alloy contacts:Effect of temperature[J].Tribology International,2008,41(2):87-102.
[27]赵杰,李宁,孙武,等.化学镀锡晶须的研究进展[J].电镀与环保,2006,26(4):1-3.
[28]ILLéS B,HORVáTH B,HARSáNYI G.Effect of strongly oxidizing environment on whisker growth form tin coating[J].Surface and Coatings Technology,2010,205(7):2262-2266.