微电子封装微尺度球栅阵列焊点三点弯曲应力应变分析
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摘要
建立了微尺度球栅阵列焊点三点弯曲应力应变有限元分析模型,在三点弯曲加载条件下,分析了焊点直径、焊点高度、焊盘直径和弯曲加载速率对焊点弯曲应力应变的影响。结果表明:焊点内最大弯曲应力应变随焊点直径、焊点高度和弯曲加载速率的增大而增大、随焊盘直径的增大而减小;在置信度为90%时,焊点直径对焊点内最大弯曲应力具有显著影响,焊点高度和焊盘直径对最大弯曲应力影响不显著,焊点直径对最大弯曲应力产生影响最大、焊盘直径对最大弯曲应力产生影响次之,而焊点高度对最大弯曲应力产生影响最小。
The miniature ball grid array( BGA) solder joint three point bending stress and strain finite element analysis models were set up,and the influences of ball diameter,ball height,pad diameter and bending load speed on the stress and strain of miniature BGA solder joints were analyzed under the three point bending load. The results show that both of the maximum stress and strain of miniature BGA solder joints increase with the increase of the ball diameter,ball height and bending load speed respectively,whereas reduce with the increase of the pad diameter. With 90% confidence,the ball diameter has a certain effect on the maximum bending stress,the ball height and the pad diameter have no significant effect on the maximum stress of miniature BAG solder joint. The ball diameter,pad diameter,ball height affect the maximum stress of miniature BGA solder joints in a descending order.
The miniature ball grid array( BGA) solder joint three point bending stress and strain finite element analysis models were set up,and the influences of ball diameter,ball height,pad diameter and bending load speed on the stress and strain of miniature BGA solder joints were analyzed under the three point bending load. The results show that both of the maximum stress and strain of miniature BGA solder joints increase with the increase of the ball diameter,ball height and bending load speed respectively,whereas reduce with the increase of the pad diameter. With 90% confidence,the ball diameter has a certain effect on the maximum bending stress,the ball height and the pad diameter have no significant effect on the maximum stress of miniature BAG solder joint. The ball diameter,pad diameter,ball height affect the maximum stress of miniature BGA solder joints in a descending order.
引文
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[2]尹立孟,杨艳,刘亮岐,等.电子封装微互连焊点力学行为的尺寸效应[J].金属学报,2009,45(4):422-427.YIN Li Meng,YANG Yan,LIUliang Qi,et al.Size effect of mechanical behavior of miniature solder joint interconnections in electronic packaging[J].Acta Metallurgica Sinica,2009,45(4):422-427(In Chinese).
[3]Zimprich P,Betzwar-Kotas A,Khatibi G,et al.Size effect in small scaled lead-free solder joints[J].J Mater Sci:Mater Electron,2008,9(4):383-388.
[4]Sharif A,Chan Y.C,Islam R.A.Effect to volume in interfacial reaction between Eutectic Sn-Pb solder and Cu metallization in microelectronic Packaging[J].Mater Sei Eng B,2004,106:120-125.
[5]尹立孟,李望云,位松,等.焊点尺寸对微焊点拉伸断裂强度的影响[J].电子元件与材料,2011,30(9):57-60.YIN Li Meng,LI Wang Yun,WEI Song,et al.Influences of solder joint size on the tensile fracture strength of microscale solder joints[J].Electronic Components and Materials,2011,30(9):57-60(In Chinese).
[6]王斌,黄春跃,梁颖,等.微尺度BGA焊点拉伸过程有限元仿真分析[J].电子元件与材料,2014,33(7):80-84.WANG Bin,HUANG Chun Yue,LIANG Yin,et al.Finite element simulation analysis of stress and strain in miniature BGA solder joints under tensile load[J].Electronic Components and Materials,2014,33(7):80-84(In Chinese).
[7]尹立孟,张新平.无铅微互连焊点力学行为尺寸效应的试验及数值模拟[J].机械工程学报,2010,46(2):55-60.YIN Li Meng,ZHANG Xin Ping.Experiment and numerical simulation of size effects of mechanical behaviors of lead-free microinterconnection solder joints[J].Journal of Mechanical Engineering,2010,46(2):55-60(In Chinese).
[8]何少华,文竹青,娄涛.试验设计与数据处理[M].长沙:国防科技大学出版社,2002:90-94.HE Shao Hua,WEN Zhu Qing,LOU Tao.Design of experiments and data processing[M].Changsha:National University of Defense Technology Press,2002:90-94(In Chinese).