标签用热熔压敏胶的制备及性能研究
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摘要
为制备性能优异的标签用热熔压敏胶,研究了热熔压敏胶的制备工艺和性能影响因素。通过研究影响胶体性能的相关因素,如初黏力、剥离强度、持黏力等物理性能,对配方中应用到的弹性体、增黏树脂、以及增塑剂含量进行选择,找到最佳涂布量和配方比例:涂布克重为50 g/m~2,配方中弹性体比例为35%～40%,增黏树脂比例为45%～50%,增塑剂为20%左右。
The preparation and properties of hot melt pressure sensitive adhesive(HMPSA) used for labels were studied. By studying the related factors affecting the HMPSA performance, such as initial adhesion, peeling strength and holding power, the content of elastomer, tackifier resin and plasticizer used in the formulation was selected, and the optimum coating amount and formulation proportion were found as follows: coating weight 50 g/m~2, elastomer proportion 35%～40%, tackifier resin roportion 45%～50%, plasticizer content about 20%.
The preparation and properties of hot melt pressure sensitive adhesive(HMPSA) used for labels were studied. By studying the related factors affecting the HMPSA performance, such as initial adhesion, peeling strength and holding power, the content of elastomer, tackifier resin and plasticizer used in the formulation was selected, and the optimum coating amount and formulation proportion were found as follows: coating weight 50 g/m~2, elastomer proportion 35%～40%, tackifier resin roportion 45%～50%, plasticizer content about 20%.
引文
[1]张飞.压敏胶研究进展[J].中国胶粘剂,2007,16(12):42-45.
[2]张爱清.压敏胶粘剂[M].北京:化学工业出版社,2002:167.
[3]张翼,齐暑华,段国晨,等.压敏胶研究进展[J].中国胶粘剂,2010,19(8):49-53.
[4] Wen LI, Laziz BOUZIDI, Suresh S. NARINE. Current Research and Development Status and Prospect of Hot-Melt Adhesives:A Review[J]. Industrial&Engineering Chemistry Research,2008,20(20):7524-7532.
[5]张在新.热熔压敏胶粘剂的市场和技术动向[J].中国胶粘剂,2002,11(5):50-52.
[6]郭静,相恒学,王倩倩,等.热熔胶研究进展[J].中国胶粘剂,2010,19(7):54-58.
[7]李红强,曾幸荣,吴伟卿,等.热塑性弹性体型型热熔压敏胶的研究进展[J].中国胶粘剂,2006,15(6):47-50.
[8]冯伟,宫晋英.热塑性弹性体在封边热熔胶中的应用[J].应用化工,2013, 42(12):2311-2312.
[9]钟明强,徐立新,王先进.热熔胶的开发与应用进展[J].浙江化工,2000, 31(4):42.
[10]程佳敏.浅谈热熔胶的组成、分类及使用[J].印刷世界,2005(8):14-15.
[11]张令华.不同增粘树脂对热熔胶性能影响的研究[D].济南:济南大学,2016:8.
[12] Dae J K, Hyun J K, Goan H Y. Effect of substrate and tackifier on peel strength of SIS(s-tyrene-isoprene-styrene)-based HMPSA[J].International Journal of adhesion&adhesives, 2005, 25(4):288-295.
[13]王清华.新型SIS热熔压敏胶的制备及其性能研究[D].南京:南京理工大学,2005:15-16.
[14]陶宇,左玲.增塑剂在软质PVC中的发展[J].当代化工,2008,37(6):647-650.
[2]张爱清.压敏胶粘剂[M].北京:化学工业出版社,2002:167.
[3]张翼,齐暑华,段国晨,等.压敏胶研究进展[J].中国胶粘剂,2010,19(8):49-53.
[4] Wen LI, Laziz BOUZIDI, Suresh S. NARINE. Current Research and Development Status and Prospect of Hot-Melt Adhesives:A Review[J]. Industrial&Engineering Chemistry Research,2008,20(20):7524-7532.
[5]张在新.热熔压敏胶粘剂的市场和技术动向[J].中国胶粘剂,2002,11(5):50-52.
[6]郭静,相恒学,王倩倩,等.热熔胶研究进展[J].中国胶粘剂,2010,19(7):54-58.
[7]李红强,曾幸荣,吴伟卿,等.热塑性弹性体型型热熔压敏胶的研究进展[J].中国胶粘剂,2006,15(6):47-50.
[8]冯伟,宫晋英.热塑性弹性体在封边热熔胶中的应用[J].应用化工,2013, 42(12):2311-2312.
[9]钟明强,徐立新,王先进.热熔胶的开发与应用进展[J].浙江化工,2000, 31(4):42.
[10]程佳敏.浅谈热熔胶的组成、分类及使用[J].印刷世界,2005(8):14-15.
[11]张令华.不同增粘树脂对热熔胶性能影响的研究[D].济南:济南大学,2016:8.
[12] Dae J K, Hyun J K, Goan H Y. Effect of substrate and tackifier on peel strength of SIS(s-tyrene-isoprene-styrene)-based HMPSA[J].International Journal of adhesion&adhesives, 2005, 25(4):288-295.
[13]王清华.新型SIS热熔压敏胶的制备及其性能研究[D].南京:南京理工大学,2005:15-16.
[14]陶宇,左玲.增塑剂在软质PVC中的发展[J].当代化工,2008,37(6):647-650.