基于BGA互联的毫米波模块三维集成设计
|
摘要
设计了一种利用微波基板作为转接板的毫米波系统级封装(System in Package,SIP)模块。采用球栅阵列(Ball Grid Array,BGA)作为射频信号层间垂直互联传输和隔离结构,实现了三维集成毫米波模块的低损耗垂直传输。对样件测试结果显示,在28～31 GHz频率范围之间,其端口驻波小于1.5,增益大于30 d B。该三维集成结构简单,射频传输性能良好,其体积仅为传统二维平面封装结构的20%,实现了模块的小型化,可广泛用于微波和毫米波电路与系统。
A three-dimensional( 3D) integrated millimeter-wave system in package( SIP) using a microwave substrate as a interposer is presented.A ball grid array( BGA) as a vertical interconnects and isolation structure in this module is designed to achieve low loss transmission.The measured results show that voltage standing wave ratio( VSWR) is less than 1.5 and the gain is greater than 30 dB between 28 GHz and 31 GHz.The module demonstrates good transmission performance and its size is only 20% of that of the traditional planar package structures.It can be widely used in microwave and millimeter wave circuits and systems.
A three-dimensional( 3D) integrated millimeter-wave system in package( SIP) using a microwave substrate as a interposer is presented.A ball grid array( BGA) as a vertical interconnects and isolation structure in this module is designed to achieve low loss transmission.The measured results show that voltage standing wave ratio( VSWR) is less than 1.5 and the gain is greater than 30 dB between 28 GHz and 31 GHz.The module demonstrates good transmission performance and its size is only 20% of that of the traditional planar package structures.It can be widely used in microwave and millimeter wave circuits and systems.
引文
[1]周骏,沈亚,顾江川.新型三维立体集成接收模块设计与实现[J].固体电子学研究与进展,2016,36(1):25-29.
[2] MURAYAMA K,AIZAWA M,HARA K,et al. Warpage control of silicon interposer for 2. 5D package application[C]//Proceedings of the 2013 IEEE 63rd Electronic Components and Technology Conference(ECTC 2013).Las Vegas:IEEE,2013:879-884.
[3]刘志辉,吴明远.微系统功能模块集成工艺发展趋势及挑战[J].电子工艺技术,2015,36(4):195-198.
[4]赵正平.微系统三维集成技术的新发展[J].微纳电子技术,2017,54(1):1-10.
[5] FEDERICO A,PAOLO M,GABRIELE T,et al.Development of low-cost 24-GHz circuits exploiting system-inpackage(Si P)approach and commercial PCB Technology[J]. IEEE Transaction on Components,Packaging and Manufacturing Technology,2012,2(8):1265-1274.
[6]罗明,王辉,刘江洪,等.基于硅基IPD技术的射频SIP设计[J].电子工艺技术,2015,36(6):323-326.
[7] REN X L,PANG C,QIN Z,et al.Design,analysis and test of high-frequency interconnections in 2.5D package with silicon interposer[J]. Journal of Semiconductors,2016,1(4):113-119.
[8] DECROSSAS E,GLOVER M D,PORTER K,et al.Highperformance and high-data-rate quasi-coaxial LTCC vertical interconnect transitions for multichip modules and system-on-package applications[J]. IEEE Transactions on Components,Packaging and Manufacturing Technology,2015,5(3):307-313.
[9]刘晓阳,刘海燕,于大全,等.硅通孔(TSV)转接板微组装技术研究进展[J].电子与封装,2015,15(8):1-8.
[10] KOYANAGI M,FUKUSHIMA T,TANAKA T.High-density through silicon vias for 3-D LSIs[J].Proceedings of the IEEE,2009,97(1):49-59.
[11] ZHU W T,ZHANG H B,KUANG X L.Study on rework process of BGA components[C]//Proceedings of 2015International Conference on Electronic Packaging Technology(ICEPT).Changsha:IEEE,2015:682-684.
[12]刘江洪,刘长江,罗明,等.基于毛纽扣的板级垂直互连技术[J].电子工艺技术,2016,37(3):135-137.
[13]张先荣.一种低损耗毫米波垂直互联设计[J].电讯技术,2017,57(7):825-829.
[14] CAMERON R J.Advanced coupling matrix synthesis techniques for microwave filters[J].IEEE Transactions on Microwave Theory and Techniques,2003,51(1):1-10.
[15] HONG J S,LANCASTER M J.Microstrip filters for RF/microwave applications[M]. New York:John Wiley&Sons lnc.,2001.
[2] MURAYAMA K,AIZAWA M,HARA K,et al. Warpage control of silicon interposer for 2. 5D package application[C]//Proceedings of the 2013 IEEE 63rd Electronic Components and Technology Conference(ECTC 2013).Las Vegas:IEEE,2013:879-884.
[3]刘志辉,吴明远.微系统功能模块集成工艺发展趋势及挑战[J].电子工艺技术,2015,36(4):195-198.
[4]赵正平.微系统三维集成技术的新发展[J].微纳电子技术,2017,54(1):1-10.
[5] FEDERICO A,PAOLO M,GABRIELE T,et al.Development of low-cost 24-GHz circuits exploiting system-inpackage(Si P)approach and commercial PCB Technology[J]. IEEE Transaction on Components,Packaging and Manufacturing Technology,2012,2(8):1265-1274.
[6]罗明,王辉,刘江洪,等.基于硅基IPD技术的射频SIP设计[J].电子工艺技术,2015,36(6):323-326.
[7] REN X L,PANG C,QIN Z,et al.Design,analysis and test of high-frequency interconnections in 2.5D package with silicon interposer[J]. Journal of Semiconductors,2016,1(4):113-119.
[8] DECROSSAS E,GLOVER M D,PORTER K,et al.Highperformance and high-data-rate quasi-coaxial LTCC vertical interconnect transitions for multichip modules and system-on-package applications[J]. IEEE Transactions on Components,Packaging and Manufacturing Technology,2015,5(3):307-313.
[9]刘晓阳,刘海燕,于大全,等.硅通孔(TSV)转接板微组装技术研究进展[J].电子与封装,2015,15(8):1-8.
[10] KOYANAGI M,FUKUSHIMA T,TANAKA T.High-density through silicon vias for 3-D LSIs[J].Proceedings of the IEEE,2009,97(1):49-59.
[11] ZHU W T,ZHANG H B,KUANG X L.Study on rework process of BGA components[C]//Proceedings of 2015International Conference on Electronic Packaging Technology(ICEPT).Changsha:IEEE,2015:682-684.
[12]刘江洪,刘长江,罗明,等.基于毛纽扣的板级垂直互连技术[J].电子工艺技术,2016,37(3):135-137.
[13]张先荣.一种低损耗毫米波垂直互联设计[J].电讯技术,2017,57(7):825-829.
[14] CAMERON R J.Advanced coupling matrix synthesis techniques for microwave filters[J].IEEE Transactions on Microwave Theory and Techniques,2003,51(1):1-10.
[15] HONG J S,LANCASTER M J.Microstrip filters for RF/microwave applications[M]. New York:John Wiley&Sons lnc.,2001.