各种镀层厚度不同图形双面电镀的可行性研究

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英文篇名：Feasibility Study on Double-sided Electroplating with Various Coating Thickness and Different Graphics 作者：陈苏伟 英文作者：CHEN Suwei;The 45~(th) Research Institute of CETC; 关键词：晶圆电镀 ; 电流密度 ; 镀层厚度 英文关键词：Wafer plating;;Current density;;Plating thickness 中文刊名：DGZS 英文刊名：Equipment for Electronic Products Manufacturing 机构：中国电子科技集团公司第四十五研究所; 出版日期：2019-04-20 出版单位：电子工业专用设备 年：2019 期：v.48;No.275 语种：中文; 页：DGZS201902004 页数：4 CN：02 ISSN：62-1077/TN 分类号：17-19+40

摘要

根据晶圆电镀原理,建立简化的晶圆双面电镀槽模型,分析了改变阴阳极间距对电流密度的影响,探索了各种镀层厚度不同图形双面电镀的可行性。
        According to the principle of wafer electroplating,a simplified model of wafer double-sided electroplating cell was established. The effect of changing the distance between cathode and anode on current density was analyzed,and the feasibility of various coating thickness and different patterns of wafer double-sided electroplating was explored.

引文

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