泡沫镁合金散热器对LED灯散热性能影响因素分析
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摘要
本文制作应用于LED灯上泡沫镁合金散热器,研究了泡沫镁合金散热器散热性能,并对其散热机理进行分析。结果表明:泡沫镁合金的孔径、孔结构和底座厚度三个因素对其散热性能影响很大,散热性能最好的泡沫镁合金结构参数为平均孔径为1.6 mm,孔隙率为60%,底座厚度在满足安装需要时越小越好。与试验中所用原始散热器相比较,泡沫镁散热器可使LED灯的温度降低1.2℃~3.9℃.
The magnesium alloy foam LED lamp radiator was prepared and the heat dissipation property was studied. The influence of pore structure on the dissipation property and the cooling mechanism were analyzed. The results showed the best parameters of heat dissipation performance of foam magnesium were as fellows:mean pore size 1.6 mm, porosity 60%, the thickness of the base 0 mm in the laboratory conditions. Compared with the present radiator, foam magnesium radiator can reduce LED temperature by 1.2 ℃~ 3.9 ℃.
The magnesium alloy foam LED lamp radiator was prepared and the heat dissipation property was studied. The influence of pore structure on the dissipation property and the cooling mechanism were analyzed. The results showed the best parameters of heat dissipation performance of foam magnesium were as fellows:mean pore size 1.6 mm, porosity 60%, the thickness of the base 0 mm in the laboratory conditions. Compared with the present radiator, foam magnesium radiator can reduce LED temperature by 1.2 ℃~ 3.9 ℃.
引文
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[3]吕猛,王芳,王录才.泡沫金属LED灯散热器研究现状[J].材料导报,2013,27(27):34-36.
[4]王录才,王芳.泡沫金属制备、性能及应用[M].北京:国防工业出版社,2012,171.
[5]H.P.蒂吉斯切,B.克雷兹特,左孝青,周芸译.多孔泡沫金属[M].北京:化学工业出版社,2004,180-181.
[6]吕猛.泡沫镁的制备工艺优化及在LED灯散热应用上的研究[D].太原:太原科技大学,2014.5.
[7]Lorna J.Gibson,Michael F.Ashby.Cellular solids:structure and properties(Second Edition)[M].Beijing:Tsinghua university press.2003:252-255.
[8]Luo X B,Liu S.A micmjet array cooling system for thermal management of high—brightness LEDs[J].IEEE Transactions on Advanced Packaging,2007,30(3):475-484.
[9]Arik M,Utturkar Y,Weaver S.Immersion Cooling of Light Emitting Diodes[C].12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.Las Vegas,NV,United states.2010:1-8.
[10]Chao S W,Lin C H,YEH C H,et a1.Study on the cooling enhancement of LED heat sources via an electrohydrodynamic approach[G]//The 33th Annual Conference of the IEEE Industrial Electronics Society,2007:2934-2937.