基于凝胶注模技术制备TiN-Cu电火花电极可行性研究
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  • 英文篇名:Fabrication of TiN-Cu Electrical Discharge Machining Electrode by Gel Injection Molding
  • 作者:张晶晶 ; 王怡琳 ; 李海恒 ; 石挺强 ; 蔡学品 ; 白传武
  • 英文作者:Zhang Jingjing;Wang Yilin;Li Haiheng;Shi Tingqiang;Cai Xuepin;Bai Chuanwu;Institute of Tropical Agriculture and Forestry,Hainan University;Hot crops Office of Ledong Li Autonomous County;
  • 关键词:凝胶注模技术 ; TiN-Cu电火花电极 ; 浆料流动性 ; 相对损耗率
  • 英文关键词:Gel injection molding technology;;TiN-Cu EDM electrode;;Slurry fluidity;;Relative loss rate
  • 中文刊名:ZKKX
  • 英文刊名:Chinese Journal of Vacuum Science and Technology
  • 机构:海南大学热带农林学院;乐东黎族自治县热作物办公室;
  • 出版日期:2019-02-15
  • 出版单位:真空科学与技术学报
  • 年:2019
  • 期:v.39
  • 基金:海南省自然科学基金青年基金项目资助(518QN215);; 海南大学应用科技学院(儋州校区)基金(Hyk-1520)
  • 语种:中文;
  • 页:ZKKX201902014
  • 页数:5
  • CN:02
  • ISSN:11-5177/TB
  • 分类号:79-83
摘要
本文主要探索凝胶注模技术制备TiN-Cu电火花加工用(EDM)电极的可行性。本文以TiN粉末和Cu粉末作为原料、海藻酸钠作为分散剂、明胶作为粘结剂,经过浆料制备、干燥、烧结成EDM电极。研究了pH值、分散剂、粘结剂对浆料流动性的影响和TiN-Cu EDM电极电加工性能。试验结果表明:当pH值为7、海藻酸钠质量分数为1%、明胶质量分数为1%时,30%TiN-Cu EDM电极相对损耗率为11.625%,比商用紫铜电极相对损耗率低,从而得出凝胶注模技术制备TiN-Cu EDM电极是可行的。
        Herein,we reported the novel TiN-Cu electrical discharge machining electrode fabricated by gel injection molding.The gel comprised mixture of TiN-Cu powders,sodium-alginate dispersant and gelatin binder.The influence of the gel properties on the surface microstructures and relative loss-rate of the newly-developed EDM electrode was investigated with scanning electron microscopy to optimize the fabrication conditions.The results show that it is feasible to produce TiN-Cu EDM electrode by gel molding.To be specific,the TiN-Cu EDM electrode,fabricated by gel molding under the optimized conditions:30%(wt.) TiN-Cu,PH-value of 7,1% sodium-alginate and 1% gelatin,outperforms the commercial red-copper electrode because of lower relative loss-rate of 11.625%,faster machining speed,lower evaporate rate and higher melting point.The problems of low fracture toughness and high micro-defects density on EDM electrode surface,including pores,pits,and cracks,remain to be solved.
引文
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