有机硅改性环氧树脂的光固化动力学与性能研究
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摘要
目的研究紫外光固化有机硅改性环氧树脂的固化行为和性能。方法通过介电分析(DEA)研究光引发剂、热引发剂及有机硅含量对紫外光固化脂环族环氧树脂反应过程的影响,利用热重(TG)、差示扫描热(DSC)和显微硬度仪对有机硅树脂改性环氧树脂性能进行分析。结果发现光引发剂与热引发剂对固化效率可起到协同互补的作用,增加光引发剂和热引发剂的浓度,可缩短引发时间,加快固化速率,提高固化效率。与纯环氧树脂相比,有机硅改性环氧树脂的固化效率和初始分解温度都有所下降,但高温阶段降解速率明显降低,500℃的残炭率也得到提高。当加入质量分数为10%的有机硅时,固化物表现出较好的耐热性能,树脂维氏硬度可达31.75HV。结论紫外光可以很好地固化有机硅改性环氧树脂。
Objective To study curing behaviors and properties of UV cured organic silicone modified epoxy resin. Methods The effects of amount of photo/thermal initiator, organic silicon on UV curing process of cycloaliphatic epoxy acrylate were studied by dielectric analysis(DEA). The property of organic silicon modified epoxy resin was analyzed by TG, DSC and microhardness tester. Results Photo/thermal initiator had the effect of cooperative complementary on curing effect. Increasing the amount of photo/thermal initiator could shortened the initiation time, speeded up the curing rate and improved the efficiency of curing. Compared with pure epoxy resin, curing efficiency and initial decomposition temperature of silicon modified epoxy resin decreased while decomposition rate decreased in high temperature and the char yield was also improved at 500℃. With the addition of 10% organic silicon content, cured films showed good resistance and the Vickers hardness of the resin could reach 37.15 HV. Conclusion UV light can effectively cure the modified epoxy resin.
Objective To study curing behaviors and properties of UV cured organic silicone modified epoxy resin. Methods The effects of amount of photo/thermal initiator, organic silicon on UV curing process of cycloaliphatic epoxy acrylate were studied by dielectric analysis(DEA). The property of organic silicon modified epoxy resin was analyzed by TG, DSC and microhardness tester. Results Photo/thermal initiator had the effect of cooperative complementary on curing effect. Increasing the amount of photo/thermal initiator could shortened the initiation time, speeded up the curing rate and improved the efficiency of curing. Compared with pure epoxy resin, curing efficiency and initial decomposition temperature of silicon modified epoxy resin decreased while decomposition rate decreased in high temperature and the char yield was also improved at 500℃. With the addition of 10% organic silicon content, cured films showed good resistance and the Vickers hardness of the resin could reach 37.15 HV. Conclusion UV light can effectively cure the modified epoxy resin.
引文
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[2]BULUT U,CRIVELLO J V.Investigation of the Reactivity of Epoxide Monomers in Photoinitiated Cationtic Polymerization[J].Macromolecules,2005,38:3584-3595.
[3]王忠刚,刘万全,赵林妮,等.高性能脂环族环氧树脂分子设计与合成研究进展[J].高分子通报,2011,25(9):13-21.
[4]石新秀,袁崇凯,王传萍,等.有机硅改性环氧树脂的新进展[J].高分子通报,2015,25(4):18-36.
[5]魏振杰,刘伟区,李宏静.含磷有机硅杂化环氧树脂固化体系性能研究[J].高分子学报,2012,2(2):148-153.
[6]刘红波,林峰,肖望东,等.系列有机硅改性紫外光-热混杂固化树脂的表面性能[J].高分子材料科学与工程,2013,29(4):101-103.
[7]常金,李茂源,洪义强,等.甲基苯基有机硅低聚体改性环氧树脂的韧性及热残重[J].高分子材料科学与工程,2013,29(8):72-75.
[8]周建萍,贾仕君,傅万里,等.紫外光引发环氧树脂的下行前线聚合行为[J].高等学校化学学报,2015,36(5):1019-1024.
[9]CRIVELLO J.FALK V B,ZONCA M R.Photoactivated Frontal Polymerization of Oxetanes Using Optical Pyrometry[J].Polymer,2005,46(26):12109-12117.
[10]崔艳艳,杨建文,曾兆华,等.前线聚合研究及应用进展[J].高分子通报,2006(8):44-51.
[11]杨光,黄鹏程.氧原子对紫外光固化有机硅环氧树脂的作用[J].宇航学报,2008,29(6):2036-2040.
[12]SERNEK M,KAMKE F A.Application of Dielectric Analysis for Monitoring the Cure Process of Phenol Formaldehyde Adhesive[J].Int J Adhes Adhes,2007,27(97):562-567.
[13]ZHOU Ya-wen,WEI Zhou,FU Han.Dielectric Analysis on Phase Transition and Micelle Shape of Polyoxyethylene Trisiloxane Surfactant in Dilute Aqueous Solution[J].Chinese Chemical Letters,2010,10(22):745-748.
[14]尹海燕,王成双,王玉婷,等.环氧沥青的固化反应和微观结构[J].高分子材料科学与工程,2012,28(11):30-33.
[15]徐坤.紫外光固化聚氨酯丙烯酸酯/Zr O2纳米复合涂层的制备和性能研究[D].上海:复旦大学,2009.
[16]GUO D L,QING Z Y,CHANG C.Preparation of Porous Polyacrylamide Hydrogels by Frontal Polymerization[J].Polymer International,2007,56:1016-1020.