聚焦汽车、信息通信技术、工业设备和能源市场,TDK携最新传感器利器惊艳亮相——2019年TDK技术和产品新闻发布会采访纪要
详细信息    查看全文 | 推荐本文 |
  • 英文篇名:Focusing on the Automotive, ICT, Industrial Equipment and Energy Markets, TDK Giving an Impressive Appearance with the Latest Sensors——Interview Summary of TDK Technology and Product Press Conference in China, 2019 Staff Reporter
  • 作者:本刊记者
  • 英文作者:Staff Reporter;
  • 关键词:采访纪要 ; TDK ; 超声波ToF传感器 ; 3D霍尔效应位置传感器
  • 英文关键词:interview summary;;TDK;;Ultrasonic ToF sensor;;3D Hall effect position sensor
  • 中文刊名:CGSJ
  • 英文刊名:Sensor World
  • 出版日期:2019-04-25
  • 出版单位:传感器世界
  • 年:2019
  • 期:v.25;No.286
  • 语种:中文;
  • 页:CGSJ201904010
  • 页数:5
  • CN:04
  • ISSN:11-3736/TP
  • 分类号:6+25-28
摘要
2019年3月20日,一年一度的慕尼黑上海电子展(Electronica China)在上海新国际博览中心开幕。本届展会为期三天,着重展示在工业电子、汽车、消费电子、通信系统、物联网应用、医疗电子、军工、航空航天等行业应用的最新技术和解决方案。TDK株式会社携带其应用于各电子和电器行业的创新元件,解决方案以及系统应用参加展览,产品品牌包括TDK、EPCOS、TDK-Lambda、Micronas、InvenSense和Chirp。展出产品包括电容器、磁性元件、传感器、电子保护元件等等。
        Electronica China, an annual electronic technology exhibition, opened at the Shanghai New International Expo Center on March 20, 2019, which focused on the latest technologies and solutions applied in industrial electronics, automotive, consumer electronics, communication systems, Internet of Things applications, medical electronics, military, aerospace and other industries. TDK Co., Ltd. brought its innovative components, solutions and system applications used in various electronic and electrical industries to the exhibition with the brands including TDK, EPCOS, TDK-Lambda, Micronas, InvenSense and Chirp and the products including capacitors, magnetic components, sensors, electronic protection components and so on. During the exhibition, TDK Technology and Product Press Conference in China, 2019 was held. At the conference, TDK released 3 latest products-the world's first MEMS ultrasonic ToF sensor, the world's first axial lead-type polymer mixed aluminum electrolytic capacitor and 3D Hall effect position sensor with stray magnetic field compensation. After the release of the products, the heads of relevant departments of TDK accepted the interview of the media. This article is the interview summary of the press conference.
引文

© 2004-2018 中国地质图书馆版权所有 京ICP备05064691号 京公网安备11010802017129号

地址:北京市海淀区学院路29号 邮编:100083

电话:办公室:(+86 10)66554848;文献借阅、咨询服务、科技查新:66554700