热冲击应力对非硅MEMS器件可靠性的影响
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摘要
以非硅MEMS器件作为研究对象,建立了非硅MEMS器件基本结构的热-机械耦合的有限元分析模型,并加载–60~+150℃的热冲击应力进行有限元分析。分析结果表明,热冲击应力导致结构层间由于热膨胀系数失配而产生应力,其中铜层与铬层界面间应力最大,且主要表现为x方向的剪切应力,其随温度循环在–75.6 MPa至125.3MPa之间转换,因此该界面间最易发生疲劳失效,导致结构分层。在此基础上,对某非硅MEMS惯性开关开展了热冲击试验和随机振动试验,验证了理论分析结果的正确性,找到了非硅MEMS器件的主要失效模式。
Choosing non-silicon components as research object,the finite element model of non-silicon MEMS components basic structure with thermal-mechanical coupling was builted,and the thermal shock stress between –60-+150 ℃ was carried on the model.The results of finite element analysis illustrate that the thermal shock stress can induce the stress between structure layers because of coefficients of thermal expansion mismatch.The largest Von Misses stress occurs in the interface between copper layer and chromium layer,which mostly shows shear stress in x direction,and converts between –75.6 MPa and 125.3 MPa along with temperature varieties.This interface can easily induce fatigue failure and lead to delaminating phenomenon.Based on these analyses,the thermal shock test and random vibration test on certain non-silicon MEMS inertial switch were carried out,which verify theory analysis result and find out the major failure mode of non-silicon MEMS components.
Choosing non-silicon components as research object,the finite element model of non-silicon MEMS components basic structure with thermal-mechanical coupling was builted,and the thermal shock stress between –60-+150 ℃ was carried on the model.The results of finite element analysis illustrate that the thermal shock stress can induce the stress between structure layers because of coefficients of thermal expansion mismatch.The largest Von Misses stress occurs in the interface between copper layer and chromium layer,which mostly shows shear stress in x direction,and converts between –75.6 MPa and 125.3 MPa along with temperature varieties.This interface can easily induce fatigue failure and lead to delaminating phenomenon.Based on these analyses,the thermal shock test and random vibration test on certain non-silicon MEMS inertial switch were carried out,which verify theory analysis result and find out the major failure mode of non-silicon MEMS components.
引文
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[2]石庚辰,李华.引信MEMS安全系统研究[J].探测与控制学报,2007,29(6):1-5.
[3]ZHAO Y,BASARAN C,CARTWRIGHT A.Inelastic behavior ofmicroelectronic solder joints under concurrent vibration and thermalcycling[C]//Thermal and Thermo Mechanical Phenomena in ElectronicSystems.New York:[s.n.],2000.
[4]SCOTTG C.Thermal stress in multilayer ceramic capacitor:numericalsimulations[J].IEEE Trans Electron Packg Manuf,1990,13(4):1135-1145.
[5]TRIGG A.Applications of infrared microscopy to IC and MEMSpackaging[J].IEEE Trans Electron Packg Manuf,2003,26(3):232-238.
[6]BRIAN STARK.MEMS reliability assurance guidelines for spaceapplications[R].California,USA:Jet Propulsion Laboratory,1999.
[7]于建国,叶庆泰,陈超.热冲击下机械结构非线性热力耦合模型的建立[J].应用力学学报,2004,21(4):43-47.
[8]HARARI I S,FREY S,FRANCA L P.A note on a recent study ofstabilized finite element computation for heat conduction[J].ComputMech,2002,28(1):63-65.
[9]张国智,胡仁喜,陈继刚,等.热力学有限元分析[M].北京:机械工业出版社,2007.